MPC8548EPXAUJB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of MPC8548EPXAUJB
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8548EPXAUJBSOT1605-1CBGA78311558.204000 mg YesNoYesTin/Lead (Sn63/Pb37)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 194 715572020-01-135Not ApplicableNot ApplicableNot Applicable3 | 168 hours26040 sec.3External manufacturing
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
CapacitorBarium and its compoundsBarium titanate12047-27-749.89758465.4000000.431707
Copper and its compoundsCopper, metal7440-50-810.52884813.8000000.091094
Nickel and its compoundsNickel, metal7440-02-014.87772019.5000000.128720
Tin and its compoundsTin, metal7440-31-50.9918481.3000000.008581
Subtotal76.296000100.00000000.660103
Die EncapsulantAluminum and its compoundsAluminum, metal7429-90-520.19000075.0000000.174681
Organic Silicon compoundsProprietary Material-Other organic silicon compounds2.69200010.0000000.023291
Zinc and its compoundsZinc, metal7440-66-64.03800015.0000000.034936
Subtotal26.920000100.00000000.232908
Epoxy AdhesiveAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-118.83283175.0312000.162939
Organic Silicon compoundsOther organic Silicon Compounds1.2534444.9938000.010845
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-25.01372519.9750000.043378
Subtotal25.100000100.00000000.217162
Heat SpreaderCadmium and its compoundsOther cadmium compounds0.0768700.0010000.000665
Chromium and Chromium III compoundsChromium, metal7440-47-30.0768700.0010000.000665
Copper and its compoundsCopper, metal7440-50-87302.61925294.99960063.181263
Lead and its compoundsLead, metallic lead and lead alloys7439-92-12.9364340.0382000.025406
Nickel and its compoundsNickel, metal7440-02-0381.2905744.9602003.298874
Subtotal7687.000000100.000000066.506873
Semiconductor DieInorganic Silicon compoundsSilicon, doped83.06793089.1000000.718692
Lead and its compoundsLead, metallic lead and lead alloys7439-92-18.7801229.4177000.075964
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8390700.9000000.007260
Nickel and its compoundsNickel, metal7440-02-00.0769150.0825000.000665
Tin and its compoundsTin, metal7440-31-50.4620480.4956000.003998
Titanium and its compoundsTitanium, metal7440-32-60.0039160.0042000.000034
Subtotal93.230000100.00000000.806613
Solder Ball - Low LeadCopper and its compoundsCopper, metal7440-50-80.2336960.0300000.002022
Lead and its compoundsLead, metallic lead and lead alloys7439-92-1287.83606636.9500002.490318
Silver and its compoundsSilver, metal7440-22-40.1557980.0200000.001348
Tin and its compoundsTin, metal7440-31-5490.76244063.0000004.246010
Subtotal778.988000100.00000006.739698
Solder FluxAliphatic AminesOther aliphatic amines0.1121400.2100000.000970
Aluminum and its compoundsAluminum, metal7429-90-50.0005340.0010000.000005
Antimony and its compoundsAntimony, metal7440-36-00.0534000.1000000.000462
Arsenic and its compoundsArsenic, metal7440-38-20.0052870.0099000.000046
Bismuth and its compoundsBismuth, metal7440-69-90.0160200.0300000.000139
Cadmium and its compoundsCadmium, metal7440-43-90.0010680.0020000.000009
Copper and its compoundsCopper, metal7440-50-80.2611260.4890000.002259
Gold and its compoundsGold, metal7440-57-50.0026700.0050000.000023
Iron and its compoundsIron, metal7439-89-60.0106800.0200000.000092
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0267000.0500000.000231
Nickel and its compoundsNickel, metal7440-02-00.0053400.0100000.000046
Silver and its compoundsSilver, metal7440-22-41.4337902.6850000.012405
Tin and its compoundsTin, metal7440-31-551.45997896.3670000.445225
Zinc and its compoundsZinc, metal7440-66-60.0112670.0211000.000097
Subtotal53.400000100.00000000.462009
SubstrateArsenic and its compoundsArsenic, metal7440-38-20.0278370.0010000.000241
Barium and its compoundsBarium sulfate7727-43-714.2748140.5128000.123504
Copper and its compoundsCopper, metal7440-50-8985.84735535.4150008.529416
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3724.63051426.0312006.269404
Inorganic Silicon compoundsSilicon dioxide7631-86-9529.74367719.0302004.583270
Lead and its compoundsLead, metallic lead and lead alloys7439-92-11.2999880.0467000.011247
Miscellaneous substancesProprietary Material-Other miscellaneous substances.510.40531318.3355004.415957
Silver and its compoundsSilver, metal7440-22-40.4620940.0166000.003998
Tin and its compoundsTin, metal7440-31-517.0084070.6110000.147154
Subtotal2783.700000100.000000024.084192
UnderfillBismuth and its compoundsBismuth, metal7440-69-90.4028741.2001000.003486
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-56.71447020.0014000.058093
Inorganic Silicon compoundsSilica, vitreous60676-86-014.26725042.5000000.123438
Inorganic compoundsCarbon Black1333-86-40.3357341.0001000.002905
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-61.6786345.0004000.014523
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins10.17103930.2980000.087998
Subtotal33.570000100.00000000.290443
Total11558.204000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MPC8548EPXAUJB
产品内容声明 MPC8548EPXAUJB
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Capacitor
电容器
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Heat Spreader
散热片
OOOOOO
Semiconductor Die
半导体芯片
XOOOOO
Solder Ball - Low Lead
焊球 - 低铅
XOOOOO
Solder Flux
助焊剂
OOOOOO
Substrate
基板
OOOOOO
Underfill
底注
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MPC8548EPXAUJB
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
31 Jan 2019
Test Report
31 Jan 2019
Test Report
31 Jan 2019
Not Available
INNER ELECTRODETest Report
21 Nov 2019
Test Report
21 Nov 2019
Test Report
7 Dec 2018
Not Available
NI PLATINGTest Report
21 Jun 2019
Test Report
21 Jun 2019
Test Report
21 Jun 2019
Not Available
OUTER ELECTRODETest Report
21 Nov 2019
Test Report
21 Nov 2019
Test Report
7 Dec 2018
Not Available
SN PLATINGTest Report
21 Jun 2019
Test Report
21 Jun 2019
Test Report
21 Jun 2019
Not Available
Die EncapsulantTest Report
23 Nov 2018
Test Report
23 Nov 2018
Test Report
23 Nov 2018
Test Report
23 Nov 2018
Epoxy AdhesiveTest Report
18 Apr 2019
Test Report
18 Apr 2019
Test Report
18 Apr 2019
Test Report
18 Apr 2019
Heat SpreaderNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Solder Ball - Low LeadNot AvailableNot AvailableNot AvailableNot Available
Solder FluxTest Report
29 Jan 2019
Test Report
29 Jan 2019
Test Report
29 Jan 2019
Test Report
29 Jan 2019
SubstrateABF-GX13Test Report
13 Sep 2019
Test Report
13 Sep 2019
Test Report
13 Sep 2019
Not Available
AUS 703Test Report
20 Mar 2019
Test Report
20 Mar 2019
Test Report
18 Nov 2018
Not Available
COPPER FOILTest Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
Not Available
E679FG SERIESTest Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
Not Available
PHP-900 IR6Test Report
18 Aug 2019
Test Report
22 Nov 2018
Test Report
18 Aug 2019
Not Available
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.