MPL115A2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPL115A2Last Revision (GMT):
Saturday, 05 June 2021, 12:04:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPL115A2SOT1769-1TSON832.700001 mg YesNoYesNickel/Gold (Ni/Au)Othere4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 194 851572021-01-176Not ApplicableNot ApplicableNot Applicable1 / Unlimited24530 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.09900199.0000000.302755
Palladium and its compoundsPalladium, metal7440-05-30.0010001.0000000.003058
Subtotal0.100001100.00000000.305813
CapCapChromium and Chromium III compoundsChromium, metal7440-47-32.46600018.0000007.541284
Copper and its compoundsCopper, metal7440-50-80.2740002.0000000.837920
Iron and its compoundsIron, metal7439-89-69.11050066.50000027.860855
Manganese and its compoundsManganese, metal7439-96-50.1370001.0000000.418960
Molybdenum and its compoundsMolybdenum, metal7439-98-70.2055001.5000000.628440
Nickel and its compoundsNickel, metal7440-02-01.50700011.0000004.608563
Subtotal13.700000100.000000041.896023
Die EncapsulantDie EncapsulantMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0005000.2500000.001529
Organic Silicon compoundsOther organic Silicon Compounds0.0020001.0000000.006116
Organic Silicon compoundsSiloxanes and Silicones, di-Me, mono(vinyl group)-terminated68952-00-10.19750098.7500000.603975
Subtotal0.200000100.00000000.611621
Epoxy Adhesive 1Epoxy AdhesiveCadmium and its compoundsCadmium, metal7440-43-90.0000020.0011000.000007
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.0131946.5968000.040347
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000210.0104000.000064
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.0021991.0995000.006725
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.0021991.0995000.006725
Silver and its compoundsSilver, metal7440-22-40.18238591.1927000.557754
Subtotal0.200000100.00000000.611621
Epoxy Adhesive 2Epoxy AdhesiveOrganic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.11996019.9933000.366849
Platinum and its compoundsOther platinum compounds0.0002000.0333000.000611
PolymersPlastic: SI - Silicone Rubber0.47984079.9734001.467402
Subtotal0.600000100.00000001.834862
Semiconductor Die 1DieInorganic Silicon compoundsSilicon7440-21-35.29200098.00000016.183486
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1080002.0000000.330275
Subtotal5.400000100.000000016.513761
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon, doped3.92000098.00000011.987767
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0800002.0000000.244648
Subtotal4.000000100.000000012.232416
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAluminum and its compoundsAluminum Hydroxide21645-51-20.97070011.4200002.968501
Barium and its compoundsBarium sulfate7727-43-70.2132562.5089000.652161
Copper and its compoundsCopper, metal7440-50-83.09594736.4229009.467726
Epoxy ResinsEpikote 86228064-14-40.5981117.0366001.829086
Epoxy ResinsProprietary Material-Other Non-halogenated Epoxy resins0.5711416.7193001.746607
Gold and its compoundsGold, metal7440-57-50.0980471.1535000.299839
Inorganic Silicon compoundsFibrous-glass-wool65997-17-31.98184323.3158006.060682
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1703662.0043000.520995
Nickel and its compoundsNickel, metal7440-02-00.4770205.6120001.458777
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.3235703.8067000.989509
Subtotal8.500000100.000000025.993883
Total32.700001100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPL115A2
Product content declaration of MPL115A2
上次修订 Last Revision (GMT):
Saturday, 05 June 2021, 12:04:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPL115A2Last Revision (GMT):
Saturday, 05 June 2021, 12:04:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
CapTest Report
17 Apr 2019
Test Report
17 Apr 2019
Test Report
17 Apr 2019
Test Report
17 Apr 2019
Die EncapsulantTest Report
15 Jun 2020
Test Report
15 Jun 2020
Test Report
6 Mar 2018
Test Report
12 Jun 2020
Epoxy Adhesive 1Test Report
9 Sep 2019
Test Report
9 Sep 2019
Test Report
9 Sep 2019
Test Report
9 Sep 2019
Epoxy Adhesive 2Test Report
16 Oct 2020
Test Report
16 Oct 2020
Test Report
16 Oct 2020
Test Report
16 Oct 2020
Semiconductor Die 1CAP DIETest Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
LEAD GLASS FRIT DIETest Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Semiconductor Die 2Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Substrate, Pre-plated NiAuCOPPER FOILTest Report
9 Mar 2021
Test Report
9 Mar 2021
Test Report
9 Mar 2021
Test Report
9 Mar 2021
HL832Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.