MCIMX537CVV8C

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX537CVV8CLast Revision (GMT):
Thursday, 25 February 2021, 08:32:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX537CVV8CSOT1717-1FBGA5292127.289509 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 197 825572021-02-20103 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-56.39886999.9900000.300799
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0006400.0100000.000030
Subtotal6.399509100.00000000.300829
Die EncapsulantDie EncapsulantEpoxy ResinsOther Non-halogenated Epoxy resins30.9517186.3726001.454984
Inorganic Silicon compoundsQuartz14808-60-721.2488894.3749000.998872
Inorganic Silicon compoundsSilica, vitreous60676-86-0403.90617783.15960018.986893
Inorganic compoundsCarbon Black1333-86-42.4255860.4994000.114022
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4852140.0999000.022809
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins26.6824155.4936001.254292
Subtotal485.700000100.000000022.831871
Epoxy Adhesive 1Epoxy AdhesiveInorganic Silicon compoundsProprietary Material-Other silica compounds0.05000025.0000000.002350
Inorganic Silicon compoundsSilica, vitreous60676-86-00.05000025.0000000.002350
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-20.10000050.0000000.004701
Subtotal0.200000100.00000000.009402
Epoxy Adhesive 2Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.0027341.3670000.000129
Epoxy ResinsProprietary Material-Other Epoxy resins0.0073613.6803000.000346
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0058892.9443000.000277
Silver and its compoundsSilver, metal7440-22-40.18401792.0084000.008650
Subtotal0.200000100.00000000.009402
Heat SpreaderHeat SpreaderBarium and its compoundsBarium sulfate7727-43-70.3454000.0309000.016237
Copper and its compoundsCopper, metal7440-50-81100.75690398.47530051.744574
Copper and its compoundsCupric oxide1317-38-06.7135070.6006000.315590
Inorganic Silicon compoundsSilicon dioxide, syntetic112945-52-52.6223590.2346000.123272
Inorganic compoundsCarbon Black1333-86-40.2883920.0258000.013557
Magnesium and its compoundsTalc14807-96-60.8070520.0722000.037938
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-36.2663870.5606000.294571
Subtotal1117.800000100.000000052.545739
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped24.50000098.0000001.151700
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5000002.0000000.023504
Subtotal25.000000100.00000001.175204
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-44.6021503.5000000.216339
Tin and its compoundsTin, metal7440-31-5126.88785096.5000005.964766
Subtotal131.490000100.00000006.181105
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAluminum and its compoundsAluminum Hydroxide21645-51-219.3062175.3554000.907550
Aluminum and its compoundsProprietary Material-Other aluminum compounds0.0331660.0092000.001559
Barium and its compoundsBarium sulfate7727-43-75.1612781.4317000.242622
Copper and its compoundsCopper phthalocyanine147-14-80.0335270.0093000.001576
Copper and its compoundsCopper, metal7440-50-8270.15834074.93990012.699651
Cyanide compounds2,2-Bis-(4-cyanatophenyl)propane1156-51-06.4352851.7851000.302511
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-56.4352851.7851000.302511
Epoxy ResinsProprietary Material-Other Epoxy resins10.2230592.8358000.480567
Gold and its compoundsGold, metal7440-57-50.5998720.1664000.028199
Inorganic Silicon compoundsFibrous-glass-wool65997-17-331.5920578.7634001.485085
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1492470.0414000.007016
Magnesium and its compoundsTalc14807-96-60.5973480.1657000.028080
Nickel and its compoundsNickel, metal7440-02-02.9416800.8160000.138283
Organic compoundsBis(3-ethyl-5-methyl-4-maleimidophenyl)methane105391-33-16.4352851.7851000.302511
PolymersProprietary Material-Other polymers0.3983520.1105000.018726
Subtotal360.500000100.000000016.946447
Total2127.289509100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX537CVV8C
Product content declaration of MCIMX537CVV8C
上次修订 Last Revision (GMT):
Thursday, 25 February 2021, 08:32:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
散热片
Heat Spreader
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX537CVV8CLast Revision (GMT):
Thursday, 25 February 2021, 08:32:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
25 May 2020
Test Report
25 May 2020
Test Report
25 May 2020
Test Report
25 May 2020
Die EncapsulantTest Report
10 Mar 2020
Test Report
10 Mar 2020
Test Report
10 Mar 2020
Test Report
10 Mar 2020
Epoxy Adhesive 1Test Report
24 Sep 2020
Test Report
24 Sep 2020
Test Report
24 Sep 2020
Test Report
24 Sep 2020
Epoxy Adhesive 2Test Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Not Available
Heat SpreaderNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
26 Dec 2019
Test Report
26 Dec 2019
Test Report
26 Dec 2019
Test Report
26 Dec 2019
Solder Ball - Lead FreeTest Report
13 Mar 2020
Test Report
13 Mar 2020
Test Report
13 Mar 2020
Test Report
13 Mar 2020
Substrate, Pre-plated NiAuCOPPER FOILTest Report
7 Jan 2021
Test Report
16 Mar 2020
Not AvailableTest Report
16 Mar 2020
HL832NXATest Report
6 Apr 2020
Test Report
6 Apr 2020
Test Report
6 Apr 2020
Test Report
6 Apr 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.