MMC2114CFCVM33

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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Product content declaration of MMC2114CFCVM33
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MMC2114CFCVM33SOT879-2LBGA196596.215260 mg YesYesYesOtherOthere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 210 935572019-04-0723 | 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding WireCopper and its compoundsCopper, metal7440-50-80.77132198.1000000.129370
Gold and its compoundsGold, metal7440-57-50.0007860.1000000.000132
Palladium and its compoundsPalladium, metal7440-05-30.0141531.8000000.002374
Subtotal0.786260100.00000000.131875
Die EncapsulantAluminum and its compoundsAluminum, metal7429-90-58.8585013.0896001.485789
Epoxy ResinsProprietary Material-Other Epoxy resins8.8585013.0896001.485789
Inorganic Silicon compoundsSilica, vitreous60676-86-0250.99067487.53860042.097325
Inorganic compoundsCarbon Black1333-86-40.8859650.3090000.148598
Organic Phosphorus compoundsOther organic phosphorous compounds0.8859650.3090000.148598
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins16.2403945.6642002.723915
Subtotal286.720000100.000000048.090014
Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.10400060.0000000.185168
Organic Silicon compounds3-(trimethoxysilyl)propyl methacrylate2530-85-00.0920005.0000000.015431
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0920005.0000000.015431
Organic compoundsOther Bismaleimides0.36800020.0000000.061723
Polymers1-Methoxy-2-propyl acetate108-65-60.18400010.0000000.030861
Subtotal1.840000100.00000000.308613
Semiconductor DieInorganic Silicon compoundsSilicon, doped47.92200098.0000008.037701
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9780002.0000000.164035
Subtotal48.900000100.00000008.201736
Solder Ball - SAC, Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0010010.0010000.000168
Arsenic and its compoundsArsenic, metal7440-38-20.0010010.0010000.000168
Bismuth and its compoundsBismuth, metal7440-69-90.0010010.0010000.000168
Copper and its compoundsCopper, metal7440-50-80.7008330.7000000.117547
Iron and its compoundsIron, metal7439-89-60.0018020.0018000.000302
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0056070.0056000.000940
Silver and its compoundsSilver, metal7440-22-43.7644743.7600000.631395
Tin and its compoundsTin, metal7440-31-595.64328095.52960016.041736
Subtotal100.119000100.000000016.792425
Substrate, Pre-plated NiAuAromatic hydrocarbon compoundsOther Aromatic carbonyl compounds1.2092890.7661000.202828
Barium and its compoundsBarium sulfate7727-43-78.7715675.5569001.471208
Copper and its compoundsCopper, metal7440-50-855.62050035.2363009.328929
Epoxy ResinsEpikote 86228064-14-411.8903677.5327001.994308
Gold and its compoundsGold, metal7440-57-52.2379971.4178000.375367
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2266730.1436000.038019
Nickel and its compoundsNickel, metal7440-02-016.99444710.7662002.850388
Phosphorus compoundsDiphenyl cresyl phosphate26444-49-519.82406612.5588003.324985
Small Mineral and Ceramic FibersSilica, crystalline - tridymite15468-32-341.07509626.0216006.889306
Subtotal157.850000100.000000026.475337
Total596.215260100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MMC2114CFCVM33
产品内容声明 MMC2114CFCVM33
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire
焊线
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
OOOOOO
Substrate, Pre-plated NiAu
基板,镍金预镀
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MMC2114CFCVM33
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding WireTest Report
18 Feb 2019
Test Report
18 Feb 2019
Test Report
18 Feb 2019
Test Report
18 Feb 2019
Die EncapsulantTest Report
27 Jul 2018
Test Report
27 Jul 2018
Test Report
27 Jul 2018
Test Report
27 Jul 2018
Epoxy AdhesiveTest Report
18 Oct 2018
Test Report
18 Oct 2018
Test Report
18 Oct 2018
Not Available
Semiconductor DieTest Report
28 Dec 2018
Test Report
28 Dec 2018
Test Report
28 Dec 2018
Test Report
28 Dec 2018
Solder Ball - SAC, Lead FreeNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuAUS308Test Report
20 Aug 2018
Test Report
20 Aug 2018
Test Report
15 Feb 2019
Not Available
E679FG SERIESTest Report
22 Jan 2019
Test Report
22 Jan 2019
Test Report
22 Jan 2019
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.