MC7448VS1400ND

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MC7448VS1400NDLast Revision (GMT):
Wednesday, 02 December 2020, 03:30:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC7448VS1400NDSOT1610-3CLGA3601738.921300 mg YesNoYesNot ApplicableOtherNot Applicablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 226 181572019-10-043Not ApplicableNot ApplicableNot Applicable1 / Unlimited24530 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Ceramic SubstrateCeramic SubstrateAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-145.1857772.8597002.598495
Barium and its compoundsBarium7440-39-3270.24087117.10290015.540719
Boron and its compoundsBoron oxide1303-86-259.5629973.7696003.425284
Calcium and its compoundsCalcium monoxide1305-78-832.9416752.0848001.894374
Chromium and Chromium III compoundsChromium, metal7440-47-35.7673210.3650000.331661
Copper and its compoundsCopper, metal7440-50-8130.8929108.2839007.527247
Gold and its compoundsGold, metal7440-57-51.1850660.0750000.068150
Inorganic Silicon compoundsQuartz14808-60-7991.46097862.74720057.015862
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0158010.0010000.000909
Magnesium and its compoundsMagnesium, metal7439-95-41.2877720.0815000.074056
Nickel and its compoundsNickel, metal7440-02-08.4518910.5349000.486042
Palladium and its compoundsPalladium, metal7440-05-30.0979650.0062000.005634
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.8453470.0535000.048613
Strontium and its compoundsStrontium Oxide1314-11-03.5551980.2250000.204449
Zirconium and its compoundsZirconium oxide1314-23-428.5964331.8098001.644493
Subtotal1580.088000100.000000090.865987
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped114.52317089.1000006.585874
Lead and its compoundsLead, metallic lead and lead alloys7439-92-112.1048819.4177000.696114
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.1568000.9000000.066524
Nickel and its compoundsNickel, metal7440-02-00.1060400.0825000.006098
Tin and its compoundsTin, metal7440-31-50.6370110.4956000.036632
Titanium and its compoundsTitanium, metal7440-32-60.0053980.0042000.000310
Subtotal128.533300100.00000007.391553
UnderfillUnderfillAnhydridesMethylhexahydrophthalic anhydride25550-51-04.57726915.1065000.263225
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-61.6875585.5695000.097046
Epoxy ResinsElastomer Modified Diglycidyl Ether68909-14-81.6875585.5695000.097046
Epoxy ResinsNeopentyl glycol diglycidyl ether17557-23-21.6875585.5695000.097046
Inorganic Silicon compoundsQuartz14808-60-719.77926465.2781001.137444
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8807912.9069000.050652
Subtotal30.300000100.00000001.742460
Total1738.921300100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC7448VS1400ND
Product content declaration of MC7448VS1400ND
上次修订 Last Revision (GMT):
Wednesday, 02 December 2020, 03:30:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
陶瓷基板
Ceramic Substrate
陶瓷基板
Ceramic Substrate
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC7448VS1400NDLast Revision (GMT):
Wednesday, 02 December 2020, 03:30:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Ceramic SubstrateNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.