MC9S08PA8VTG

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of MC9S08PA8VTG
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
MC9S08PA8VTGSOT403-3TSSOP1662.485040 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 234 715742019-08-2353 | 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - CuCopper and its compoundsCopper, metal7440-50-80.17948997.0000000.287251
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0055513.0000000.008884
Subtotal0.185040100.00000000.296135
Copper Lead-FrameCopper and its compoundsCopper, metal7440-50-826.89434496.39550043.041254
Iron and its compoundsIron, metal7439-89-60.6556502.3500001.049291
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0047430.0170000.007591
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0230170.0825000.036837
Silver and its compoundsSilver, metal7440-22-40.2790001.0000000.446507
Tin and its compoundsTin, metal7440-31-50.0083700.0300000.013395
Zinc and its compoundsZinc, metal7440-66-60.0348750.1250000.055813
Subtotal27.900000100.000000044.650688
Die EncapsulantEpoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-62.5633899.6368004.102404
Inorganic Silicon compoundsSilica, vitreous60676-86-023.91371989.90120038.271111
Inorganic compoundsCarbon Black1333-86-40.0491570.1848000.078670
Organic Phosphorus compoundsOther organic phosphorous compounds0.0737350.2772000.118005
Subtotal26.600000100.000000042.570190
Epoxy AdhesiveAcrylates2-propenoic acid, (1-methylethylidene)bis(4,1-phenyleneoxy-2,1-ethanediyl) ester24447-78-70.0630007.0000000.100824
AcrylatesDicyclopentenyloxyethyl acrylate65983-31-50.0405004.5000000.064815
Epoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.0180002.0000000.028807
Organic Silicon compounds3-(trimethoxysilyl)propyl methacrylate2530-85-00.0099001.1000000.015844
Organic compoundsOther Organic Peroxides0.0027000.3000000.004321
Polymers1,3-Butadiene, homopolymer, epoxidized, cyclized68441-49-60.0360004.0000000.057614
PolymersPoly(acrylonitrile-co-butadiene-co-acrylic acid), dicarboxy terminated68891-50-90.0099001.1000000.015844
Silver and its compoundsSilver, metal7440-22-40.72000080.0000001.152276
Subtotal0.900000100.00000001.440345
Post-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0005600.0200000.000896
Tin and its compoundsTin, metal7440-31-52.79944099.9800004.480176
Subtotal2.800000100.00000004.481073
Semiconductor DieInorganic Silicon compoundsSilicon, doped4.01800098.0000006.430339
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0820002.0000000.131231
Subtotal4.100000100.00000006.561571
Total62.485040100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MC9S08PA8VTG
产品内容声明 MC9S08PA8VTG
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Cu
焊丝-铜
OOOOOO
Copper Lead-Frame
铜引线框架
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Post-plating - Lead Free
封装后电镀- 无铅
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MC9S08PA8VTG
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Copper Lead-FrameNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
24 Dec 2019
Epoxy AdhesiveTest Report
30 Jul 2019
Test Report
30 Jul 2019
Test Report
30 Jul 2019
Test Report
30 Jul 2019
Post-plating - Lead FreeTest Report
17 Aug 2018
Test Report
14 Mar 2018
Test Report
17 Aug 2018
Test Report
17 Aug 2018
Semiconductor DieTest Report
10 Dec 2019
Test Report
10 Dec 2019
Test Report
10 Dec 2019
Test Report
10 Dec 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.