A2I25D025GNR1

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of A2I25D025GNR1
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
A2I25D025GNR1SOT1730-2FM17F1264.811412 mg YesNoYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 237 565282019-10-114Not ApplicableNot ApplicableNot Applicable3 | 168 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.19999299.9900000.015812
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000200.0100000.000002
Subtotal0.200012100.00000000.015814
Copper Lead-FrameCopper and its compoundsCopper, metal7440-50-8646.82656897.01020051.140159
Iron and its compoundsIron, metal7439-89-67.7197641.1578000.610349
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.1353530.0203000.010701
Nickel and its compoundsNickel, metal7440-02-010.8342061.6249000.856587
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-01.2455100.1868000.098474
Subtotal666.761400100.000000052.716270
Die EncapsulantAnhydridesBenzophenonetetracarboxylic Acid Dianhydride2421-28-540.6969047.4838003.217626
Epoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-216.2786532.9935001.287042
Epoxy ResinsProprietary Material-Other Epoxy resins16.2786532.9935001.287042
Inorganic Silicon compoundsQuartz14808-60-716.2786532.9935001.287042
Inorganic Silicon compoundsSilica, vitreous60676-86-0434.10248979.82760034.321519
Magnesium and its compoundsMagnesium, metal7439-95-40.9706830.1785000.076745
Organic Silicon compoundsOther organic Silicon Compounds2.9153120.5361000.230494
PolymersPoly[(phenyl glycidyl ether)-co-dicyclopentadiene]119345-05-016.2786532.9935001.287042
Subtotal543.800000100.000000042.994552
Epoxy AdhesiveAcrylatesOther Methacrylate compounds0.2777042.2800000.021956
Epoxy ResinsOther Epoxy resins1.91251615.7021000.151210
Epoxy ResinsProprietary Material-Other Epoxy resins0.2457802.0179000.019432
Silver and its compoundsSilver, metal7440-22-49.74400080.0000000.770392
Subtotal12.180000100.00000000.962990
Post-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0019000.0200000.000150
Tin and its compoundsTin, metal7440-31-59.49810099.9800000.750950
Subtotal9.500000100.00000000.751100
Semiconductor Die 1Gold and its compoundsGold, metal7440-57-50.0642601.0200000.005081
Inorganic Silicon compoundsSilicon, doped6.11102597.0004000.483157
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1247151.9796000.009860
Subtotal6.300000100.00000000.498098
Semiconductor Die 2Gold and its compoundsGold, metal7440-57-50.1285201.0200000.010161
Inorganic Silicon compoundsSilicon, doped12.22205097.0004000.966314
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2494301.9796000.019721
Subtotal12.600000100.00000000.996196
Solder WireLead and its compoundsLead, metallic lead and lead alloys7439-92-112.86385095.5000001.017057
Silver and its compoundsSilver, metal7440-22-40.3367502.5000000.026624
Tin and its compoundsTin, metal7440-31-50.2694002.0000000.021300
Subtotal13.470000100.00000001.064981
Total1264.811412100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of A2I25D025GNR1
产品内容声明 A2I25D025GNR1
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Au
焊丝-金
OOOOOO
Copper Lead-Frame
铜引线框架
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Post-plating - Lead Free
封装后电镀- 无铅
OOOOOO
Semiconductor Die 1
半导体芯片
OOOOOO
Semiconductor Die 2
半导体芯片
OOOOOO
Solder Wire
焊丝
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of A2I25D025GNR1
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
26 Nov 2019
Test Report
26 Nov 2019
Test Report
26 Nov 2019
Test Report
26 Nov 2019
Copper Lead-FrameCDA 10200Test Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
CDA 194Test Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
CDA 194 + NI PLATINGTest Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
Die EncapsulantNot AvailableNot AvailableNot AvailableNot Available
Epoxy AdhesiveTest Report
1 Apr 2019
Test Report
1 Apr 2019
Test Report
15 Jun 2018
Not Available
Post-plating - Lead FreeTest Report
17 Aug 2018
Test Report
14 Mar 2018
Test Report
17 Aug 2018
Test Report
17 Aug 2018
Semiconductor Die 1Test Report
29 May 2018
Test Report
29 May 2018
Test Report
29 May 2018
Test Report
20 May 2019
Semiconductor Die 2Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Solder WireTest Report
30 Nov 2018
Test Report
30 Nov 2018
Not AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.