MCIMX6Q7CVT08AD

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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Product content declaration of MCIMX6Q7CVT08AD
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
MCIMX6Q7CVT08ADSOT1643-1FBGA6243300.425000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 247 585572019-04-0753 | 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
CapCopper and its compoundsCopper, metal7440-50-81986.13800099.00000060.178250
Nickel and its compoundsNickel, metal7440-02-020.0620001.0000000.607861
Subtotal2006.200000100.000000060.786111
Die EncapsulantAluminum and its compoundsAluminum, metal7429-90-58.40000070.0000000.254513
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.3600003.0000000.010908
Organic Silicon compoundsDimethyl Cyclosiloxanes70900-21-90.1200001.0000000.003636
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.1200001.0000000.003636
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-21.20000010.0000000.036359
Zinc and its compoundsZinc oxide1314-13-21.80000015.0000000.054538
Subtotal12.000000100.00000000.363590
Epoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-72.91000030.0000000.088170
Inorganic Silicon compoundsSilylated silica68909-20-60.3880004.0000000.011756
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0019400.0200000.000059
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.3880004.0000000.011756
Organic Silicon compoundsOther siloxanes and silicones0.2910003.0000000.008817
Organic Silicon compoundsSilicic acid sodium salt hydrolysis products with chlorotrimethylsilane and dichloroethenylmethylsilane68584-83-80.4365004.5000000.013226
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-25.23800054.0000000.158707
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.0291000.3000000.000882
Organic compoundsOther organic compounds.0.0145500.1500000.000441
Platinum and its compoundsOther platinum compounds0.0029100.0300000.000088
Subtotal9.700000100.00000000.293902
Semiconductor DieInorganic Silicon compoundsSilicon, doped36.73600089.6000001.113069
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3690000.9000000.011180
Nickel and its compoundsNickel, metal7440-02-00.2050000.5000000.006211
Silver and its compoundsSilver, metal7440-22-40.1291500.3150000.003913
Tin and its compoundsTin, metal7440-31-53.5608508.6850000.107891
Subtotal41.000000100.00000001.242264
Solder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-81.8157500.6000000.055016
Silver and its compoundsSilver, metal7440-22-49.0787503.0000000.275078
Tin and its compoundsTin, metal7440-31-5291.73050096.4000008.839180
Subtotal302.625000100.00000009.169274
SubstrateAluminum and its compoundsAluminum Hydroxide21645-51-2143.22619815.6207004.339629
Arsenic and its compoundsArsenic, metal7440-38-20.0091690.0010000.000278
Barium and its compoundsBarium sulfate7727-43-73.7666250.4108000.114126
Copper and its compoundsCopper phthalocyanine147-14-80.6024030.0657000.018252
Copper and its compoundsCopper, metal7440-50-8315.54471734.4143009.560730
Epoxy ResinsBisphenol A diglycidyl ether1675-54-37.0619640.7702000.213971
Epoxy ResinsOther Epoxy resins14.2367061.5527000.431360
Epoxy ResinsProprietary Material-Other Epoxy resins38.1943864.1656001.157257
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3276.90013230.1996008.389833
Inorganic Silicon compoundsSilicon dioxide7631-86-968.6391347.4860002.079706
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0091690.0010000.000278
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-613.2565401.4458000.401662
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins25.6832862.8011000.778181
Silver and its compoundsSilver, metal7440-22-40.2943250.0321000.008918
Tin and its compoundsTin, metal7440-31-59.4752451.0334000.287092
Subtotal916.900000100.000000027.781271
UnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-31.32000011.0000000.039995
Bismuth and its compoundsBismuth nitrate10361-44-10.0120000.1000000.000364
Bismuth and its compoundsBismuth trioxide1304-76-30.0960000.8000000.002909
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-61.68000014.0000000.050903
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.20000010.0000000.036359
Inorganic Silicon compoundsSilica, vitreous60676-86-07.20000060.0000000.218154
Inorganic compoundsCarbon Black1333-86-40.0120000.1000000.000364
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.4800004.0000000.014544
Subtotal12.000000100.00000000.363590
Total3300.425000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MCIMX6Q7CVT08AD
产品内容声明 MCIMX6Q7CVT08AD
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Cap
盖子
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
OOOOOO
Substrate
基板
OOOOOO
Underfill
底注
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MCIMX6Q7CVT08AD
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapC1100Test Report
29 Jun 2018
Test Report
29 Jun 2018
Test Report
29 Jun 2018
Not Available
NI PLATINGTest Report
21 Jun 2018
Test Report
21 Jun 2018
Test Report
21 Jun 2018
Not Available
Die EncapsulantTest Report
23 Nov 2018
Test Report
23 Nov 2018
Test Report
23 Nov 2018
Test Report
23 Nov 2018
Epoxy AdhesiveNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
28 Dec 2017
Test Report
28 Dec 2017
Test Report
28 Dec 2017
Test Report
28 Dec 2017
Solder Ball - SAC, Lead FreeTest Report
29 Oct 2018
Test Report
29 Oct 2018
Test Report
29 Oct 2018
Test Report
29 Oct 2018
SubstrateAUS 703Test Report
20 Mar 2019
Test Report
20 Mar 2019
Test Report
18 Nov 2018
Not Available
COPPERTest Report
22 Jan 2019
Test Report
22 Jan 2019
Test Report
22 Jan 2019
Not Available
E679FGTest Report
22 Jan 2019
Test Report
22 Jan 2019
Test Report
22 Jan 2019
Not Available
GX-13Test Report
31 Oct 2018
Test Report
31 Oct 2018
Test Report
31 Oct 2018
Not Available
PHP-900 IR-6Test Report
19 Sep 2018
Not AvailableTest Report
19 Sep 2018
Not Available
UnderfillTest Report
2 Apr 2019
Test Report
2 Apr 2019
Test Report
2 Apr 2019
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.