MC7448HX600ND

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NXP Semiconductors
Product content declaration of MC7448HX600NDLast Revision (GMT):
Tuesday, 15 June 2021, 07:45:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC7448HX600NDSOT1603-2CBGA3603591.073300 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 251 681572021-06-1010Not ApplicableNot ApplicableNot Applicable1 / Unlimited26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-753.36640065.4000001.486085
Copper and its compoundsCopper, metal7440-50-811.26080013.8000000.313578
Nickel and its compoundsNickel, metal7440-02-015.91200019.5000000.443099
Tin and its compoundsTin, metal7440-31-51.0608001.3000000.029540
Subtotal81.600000100.00000002.272301
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped114.52317089.1000003.189107
Lead and its compoundsLead, metallic lead and lead alloys7439-92-112.1048819.4177000.337083
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.1568000.9000000.032213
Nickel and its compoundsNickel, metal7440-02-00.1060400.0825000.002953
Tin and its compoundsTin, metal7440-31-50.6370110.4956000.017739
Titanium and its compoundsTitanium, metal7440-32-60.0053980.0042000.000150
Subtotal128.533300100.00000003.579245
Solder Ball - High LeadSolder Ball - High LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-11297.69093089.50000036.136576
Tin and its compoundsTin, metal7440-31-5152.24307010.5000004.239487
Subtotal1449.934000100.000000040.376063
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-80.1515000.5000000.004219
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0025150.0083000.000070
Silver and its compoundsSilver, metal7440-22-40.9090003.0000000.025313
Tin and its compoundsTin, metal7440-31-529.23698596.4917000.814157
Subtotal30.300000100.00000000.843759
Solder PasteSolder PasteLead and its compoundsLead, metallic lead and lead alloys7439-92-14.66200037.0000000.129822
Tin and its compoundsTin, metal7440-31-57.93800063.0000000.221048
Subtotal12.600000100.00000000.350870
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-145.2635852.4364001.260447
Barium and its compoundsBarium oxide1304-28-5269.78501414.5217007.512657
Barium and its compoundsBarium titanate12047-27-799.6155585.3620002.773977
Boron and its compoundsBoron oxide1303-86-259.4423613.1996001.655281
Calcium and its compoundsCalcium monoxide1305-78-832.8794511.7698000.915588
Chromium and Chromium III compoundsDichromium trioxide1308-38-95.7424780.3091000.159910
Copper and its compoundsCopper, metal7440-50-8265.13492614.2714007.383167
Copper and its compoundsCuprous oxide1317-39-11.4360840.0773000.039990
Gold and its compoundsGold, metal7440-57-51.6906030.0910000.047078
Inorganic Silicon compoundsSilicon dioxide7631-86-91002.65232553.96970027.920687
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0185780.0010000.000517
Nickel and its compoundsNickel, metal7440-02-022.8807391.2316000.637156
Palladium and its compoundsPalladium, metal7440-05-30.1467670.0079000.004087
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-01.1629870.0626000.032385
Silver and its compoundsSilver, metal7440-22-40.4793140.0258000.013347
Strontium and its compoundsStrontium Oxide1314-11-03.5892810.1932000.099950
Tin and its compoundsTin, metal7440-31-517.3128940.9319000.482109
Zirconium and its compoundsZirconium oxide1314-23-428.5730561.5380000.795669
Subtotal1857.806000100.000000051.734004
UnderfillUnderfillAnhydridesMethylhexahydrophthalic anhydride25550-51-04.57726915.1065000.127462
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-61.6875585.5695000.046993
Epoxy ResinsElastomer Modified Diglycidyl Ether68909-14-81.6875585.5695000.046993
Epoxy ResinsNeopentyl glycol diglycidyl ether17557-23-21.6875585.5695000.046993
Inorganic Silicon compoundsQuartz14808-60-719.77926465.2781000.550790
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8807912.9069000.024527
Subtotal30.300000100.00000000.843759
Total3591.073300100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC7448HX600ND
Product content declaration of MC7448HX600ND
上次修订 Last Revision (GMT):
Tuesday, 15 June 2021, 07:45:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊球 - 高铅
Solder Ball - High Lead
焊球 - 高铅
Solder Ball - High Lead
XOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
XOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC7448HX600NDLast Revision (GMT):
Tuesday, 15 June 2021, 07:45:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
15 Jan 2021
Test Report
15 Jan 2021
Test Report
15 Jan 2021
Test Report
15 Jan 2021
INNER ELECTRODETest Report
5 Nov 2020
Test Report
5 Nov 2020
Test Report
5 Nov 2020
Test Report
5 Nov 2020
NI PLATINGTest Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
18 Jun 2020
Test Report
18 Jun 2020
OUTER ELECTRODETest Report
21 Nov 2020
Test Report
21 Nov 2020
Test Report
9 Nov 2020
Test Report
9 Nov 2020
SN PLATINGTest Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
12 Jun 2020
Semiconductor DieTest Report
10 Aug 2020
Test Report
10 Aug 2020
Test Report
10 Aug 2020
Test Report
10 Aug 2020
Solder Ball - High LeadNot AvailableNot AvailableNot AvailableNot Available
Solder FluxNot AvailableNot AvailableNot AvailableNot Available
Solder PasteNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuCOPPER FOILTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
E679FG SERIESTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
14 Jan 2020
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.