MPC8314ECVRAFDA

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of MPC8314ECVRAFDALast Revision (GMT):
Monday, 02 August 2021, 03:09:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8314ECVRAFDASOT1627-1HBGA6204269.141408 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 253 985572021-01-2693 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-87.68376697.0000000.179984
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2376423.0000000.005567
Subtotal7.921408100.00000000.185550
Die EncapsulantDie EncapsulantEpoxy ResinsOther Epoxy resins68.8020006.0000001.611612
Inorganic Silicon compoundsSilica, vitreous60676-86-0986.16200086.00000023.099774
Inorganic compoundsCarbon Black1333-86-411.4670001.0000000.268602
Inorganic compoundsOther inorganic compounds22.9340002.0000000.537204
Phenols and Phenolic ResinsOther phenolic resins57.3350005.0000001.343010
Subtotal1146.700000100.000000026.860202
Epoxy Adhesive 1Epoxy AdhesiveAromatic amines and their salts1,3,5-Triazine-2,4-diamine, 6-[2-(2-methyl-1H-imidazol-1-yl)ethyl]38668-46-10.0785940.8451000.001841
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.20508512.9579000.028228
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.0785940.8451000.001841
Silver and its compoundsSilver, metal7440-22-47.93772785.3519000.185933
Subtotal9.300000100.00000000.217842
Epoxy Adhesive 2Epoxy AdhesiveInorganic Silicon compoundsOther silica compounds1.18000020.0000000.027640
Inorganic Silicon compoundsQuartz14808-60-70.0590001.0000000.001382
Inorganic Silicon compoundsSilica, vitreous60676-86-01.18000020.0000000.027640
Inorganic compoundsCarbon Black1333-86-40.0590001.0000000.001382
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.4720008.0000000.011056
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.2950005.0000000.006910
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.65500045.0000000.062191
Subtotal5.900000100.00000000.138201
Heat SpreaderHeat SpreaderCopper and its compoundsCopper, metal7440-50-81083.93066096.97000025.389898
Copper and its compoundsCupric oxide1317-38-01.1178000.1000000.026183
Inorganic compoundsCarbon Black1333-86-43.9123000.3500000.091641
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3353400.0300000.007855
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-328.5039002.5500000.667673
Subtotal1117.800000100.000000026.183251
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped29.40000098.0000000.688663
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6000002.0000000.014054
Subtotal30.000000100.00000000.702717
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-418.2042003.5000000.426414
Tin and its compoundsTin, metal7440-31-5501.91580096.50000011.756832
Subtotal520.120000100.000000012.183246
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAcrylatesOther acrylates17.9340111.2529000.420085
Aluminum and its compoundsAluminum Oxides (Al2O3)1344-28-193.2986526.5180002.185420
Barium and its compoundsBarium7440-39-316.1204271.1262000.377603
Copper and its compoundsCopper, metal7440-50-8876.23007961.21490020.524738
Epoxy ResinsBisphenol A diglycidyl ether1675-54-31.7548960.1226000.041106
Epoxy ResinsOther Non-halogenated Epoxy resins78.9001995.5121001.848151
Gold and its compoundsGold, metal7440-57-52.2702000.1586000.053177
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3201.04156114.0451004.709180
Inorganic Silicon compoundsSilicon dioxide7631-86-9114.7696528.0180002.688354
Miscellaneous substancesProprietary Material-Other miscellaneous substances.15.1370551.0575000.354569
Nickel and its compoundsNickel, metal7440-02-013.4537290.9399000.315139
Organic Silicon compoundsOther organic Silicon Compounds0.4895390.0342000.011467
Subtotal1431.400000100.000000033.528990
Total4269.141408100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8314ECVRAFDA
Product content declaration of MPC8314ECVRAFDA
上次修订 Last Revision (GMT):
Monday, 02 August 2021, 03:09:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
散热片
Heat Spreader
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8314ECVRAFDALast Revision (GMT):
Monday, 02 August 2021, 03:09:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
8 Oct 2020
Test Report
8 Oct 2020
Test Report
8 Oct 2020
Test Report
8 Oct 2020
Die EncapsulantTest Report
24 Apr 2020
Test Report
24 Apr 2020
Test Report
24 Apr 2020
Test Report
24 Apr 2020
Epoxy Adhesive 1Test Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Epoxy Adhesive 2Test Report
24 Sep 2020
Test Report
24 Sep 2020
Test Report
24 Sep 2020
Test Report
24 Sep 2020
Heat SpreaderNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
26 Dec 2019
Solder Ball - Lead FreeTest Report
9 Dec 2019
Test Report
9 Dec 2019
Test Report
9 Dec 2019
Test Report
9 Dec 2019
Substrate, Pre-plated NiAuNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.