T2081NXN8TTB

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of T2081NXN8TTBLast Revision (GMT):
Friday, 11 December 2020, 06:31:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
T2081NXN8TTBSOT1653-1FBGA7803915.250000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 259 785572020-03-2453 / 168 hours25030 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-516.99200072.0000000.433995
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2360001.0000000.006028
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones2.1240009.0000000.054249
Zinc and its compoundsZinc oxide1314-13-24.24800018.0000000.108499
Subtotal23.600000100.00000000.602771
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-77.64000040.0000000.195134
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-62.86500015.0000000.073175
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-28.59500045.0000000.219526
Subtotal19.100000100.00000000.487836
Heat SpreaderHeat SpreaderCopper and its compoundsCopper, metal7440-50-82290.65781698.44670058.506042
Nickel and its compoundsNickel, metal7440-02-036.1421841.5533000.923113
Subtotal2326.800000100.000000059.429155
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped158.68160089.6000004.052911
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.5939000.9000000.040710
Nickel and its compoundsNickel, metal7440-02-00.8855000.5000000.022617
Silver and its compoundsSilver, metal7440-22-40.5578650.3150000.014249
Tin and its compoundsTin, metal7440-31-515.3811358.6850000.392852
Subtotal177.100000100.00000004.523338
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.9684000.5000000.024734
Silver and its compoundsSilver, metal7440-22-45.8104003.0000000.148404
Tin and its compoundsTin, metal7440-31-5186.90120096.5000004.773672
Subtotal193.680000100.00000004.946811
SubstrateSubstrateAluminum and its compoundsAluminum Hydroxide21645-51-2115.20953610.0063002.942584
Barium and its compoundsBarium sulfate7727-43-79.0117730.7827000.230171
Copper and its compoundsCopper phthalocyanine147-14-80.0575690.0050000.001470
Copper and its compoundsCopper, metal7440-50-8405.17286035.19050010.348582
Epoxy ResinsOther Epoxy resins14.1008281.2247000.360151
Epoxy ResinsProprietary Material-Other Epoxy resins183.74944115.9592004.693173
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3216.97107118.8446005.541691
Inorganic Silicon compoundsSilicon dioxide7631-86-959.7940985.1933001.527210
Magnesium and its compoundsTalc14807-96-61.0327790.0897000.026378
Organic Phosphorus compoundsOther organic phosphorous compounds12.5338141.0886000.320128
PolymersProprietary Material-Other polymers115.13700010.0000002.940732
Silver and its compoundsSilver, metal7440-22-40.5607170.0487000.014321
Tin and its compoundsTin, metal7440-31-518.0385141.5667000.460724
Subtotal1151.370000100.000000029.407318
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-014.16000060.0000000.361663
Inorganic compoundsCarbon Black1333-86-40.0236000.1000000.000603
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2124000.9000000.005425
PolymersPlastic: EP - Epoxide, Epoxy9.20400039.0000000.235081
Subtotal23.600000100.00000000.602771
Total3915.250000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 T2081NXN8TTB
Product content declaration of T2081NXN8TTB
上次修订 Last Revision (GMT):
Friday, 11 December 2020, 06:31:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
散热片
Heat Spreader
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of T2081NXN8TTBLast Revision (GMT):
Friday, 11 December 2020, 06:31:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantNot AvailableNot AvailableNot AvailableNot Available
Epoxy AdhesiveNot AvailableNot AvailableNot AvailableNot Available
Heat SpreaderNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeTest Report
13 Mar 2020
Test Report
13 Mar 2020
Test Report
13 Mar 2020
Test Report
13 Mar 2020
SubstrateNot AvailableNot AvailableNot AvailableNot Available
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.