T2080NSN8MQLB

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of T2080NSN8MQLBLast Revision (GMT):
Friday, 11 December 2020, 12:30:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
T2080NSN8MQLBSOT1657FBGA8965537.683000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 318 565572020-03-2473 / 168 hours25030 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-518.07200072.0000000.326346
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2510001.0000000.004533
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones2.2590009.0000000.040793
Zinc and its compoundsZinc oxide1314-13-24.51800018.0000000.081587
Subtotal25.100000100.00000000.453258
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-73.12000040.0000000.056341
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.17000015.0000000.021128
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-23.51000045.0000000.063384
Subtotal7.800000100.00000000.140853
Heat SpreaderHeat SpreaderCopper and its compoundsCopper, metal7440-50-82809.19746098.80060050.728752
Nickel and its compoundsNickel, metal7440-02-034.1025401.1994000.615827
Subtotal2843.300000100.000000051.344579
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped164.80128089.6000002.975997
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.6553700.9000000.029893
Nickel and its compoundsNickel, metal7440-02-00.9196500.5000000.016607
Silver and its compoundsSilver, metal7440-22-40.5793800.3150000.010462
Tin and its compoundsTin, metal7440-31-515.9743208.6850000.288466
Subtotal183.930000100.00000003.321425
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-81.1124200.5000000.020088
Silver and its compoundsSilver, metal7440-22-46.6745203.0000000.120529
Tin and its compoundsTin, metal7440-31-5214.69706096.5000003.877020
Subtotal222.484000100.00000004.017637
SubstrateSubstrateAluminum and its compoundsAluminum Hydroxide21645-51-2132.7835045.9545002.397817
Arsenic and its compoundsArsenic, metal7440-38-20.5329630.0239000.009624
Barium and its compoundsBarium sulfate7727-43-721.5972500.9685000.390005
Copper and its compoundsCopper phthalocyanine147-14-80.1382580.0062000.002497
Copper and its compoundsCopper, metal7440-50-81065.08002447.76210019.233315
Epoxy ResinsEpikote 86228064-14-4275.63977812.3607004.977529
Epoxy ResinsProprietary Material-Other Epoxy resins175.3870627.8650003.167156
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3272.23684612.2081004.916079
Inorganic Silicon compoundsSilicon dioxide7631-86-9227.62185610.2074004.110417
Magnesium and its compoundsTalc14807-96-62.4752660.1110000.044699
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-622.3309101.0014000.403254
Silver and its compoundsSilver, metal7440-22-41.0302460.0462000.018604
Tin and its compoundsTin, metal7440-31-533.1150401.4850000.597994
Subtotal2229.969000100.000000040.268990
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-015.06000060.0000000.271955
Inorganic compoundsCarbon Black1333-86-40.0251000.1000000.000453
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2259000.9000000.004079
PolymersPlastic: EP - Epoxide, Epoxy9.78900039.0000000.176771
Subtotal25.100000100.00000000.453258
Total5537.683000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 T2080NSN8MQLB
Product content declaration of T2080NSN8MQLB
上次修订 Last Revision (GMT):
Friday, 11 December 2020, 12:30:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
散热片
Heat Spreader
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of T2080NSN8MQLBLast Revision (GMT):
Friday, 11 December 2020, 12:30:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantNot AvailableNot AvailableNot AvailableNot Available
Epoxy AdhesiveNot AvailableNot AvailableNot AvailableNot Available
Heat SpreaderTest Report
3 Jul 2020
Test Report
3 Jul 2020
Test Report
3 Jul 2020
Test Report
3 Jul 2020
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeTest Report
13 Mar 2020
Test Report
13 Mar 2020
Test Report
13 Mar 2020
Test Report
13 Mar 2020
SubstrateNot AvailableNot AvailableNot AvailableNot Available
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.