LS1026ASE8T1A

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of LS1026ASE8T1A
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
LS1026ASE8T1ASOT1653-1FBGA7803880.480000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 380 625572019-06-0463 | 168 hours25030 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Die EncapsulantAluminum and its compoundsAluminum, metal7429-90-516.99200072.0000000.437884
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2360001.0000000.006082
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones2.1240009.0000000.054735
Zinc and its compoundsZinc oxide1314-13-24.24800018.0000000.109471
Subtotal23.600000100.00000000.608172
Epoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-77.64000040.0000000.196883
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-62.86500015.0000000.073831
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-28.59500045.0000000.221493
Subtotal19.100000100.00000000.492207
Heat SpreaderCopper and its compoundsCopper, metal7440-50-82290.65781698.44670059.030270
Nickel and its compoundsNickel, metal7440-02-036.1421841.5533000.931384
Subtotal2326.800000100.000000059.961654
Semiconductor DieInorganic Silicon compoundsSilicon, doped168.53760089.6000004.343215
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.6929000.9000000.043626
Nickel and its compoundsNickel, metal7440-02-00.9405000.5000000.024237
Silver and its compoundsSilver, metal7440-22-40.5925150.3150000.015269
Tin and its compoundsTin, metal7440-31-516.3364858.6850000.420991
Subtotal188.100000100.00000004.847338
Solder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.9701430.5009000.025001
Silver and its compoundsSilver, metal7440-22-45.8208593.0054000.150004
Tin and its compoundsTin, metal7440-31-5186.88899896.4937004.816131
Subtotal193.680000100.00000004.991135
SubstrateAluminum and its compoundsAluminum Hydroxide21645-51-289.5336998.0982002.307284
Barium and its compoundsBarium sulfate7727-43-711.3036541.0224000.291295
Copper and its compoundsCopper phthalocyanine147-14-80.0718640.0065000.001852
Copper and its compoundsCopper, metal7440-50-8679.46085361.45630017.509712
Epoxy ResinsOther Epoxy resins44.7679554.0492001.153671
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.2802850.1158000.032993
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-64.6435200.4200000.119664
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3111.91546610.1226002.884062
Inorganic Silicon compoundsSilicon dioxide7631-86-913.0615581.1814000.336597
Magnesium and its compoundsTalc14807-96-61.2957630.1172000.033392
Organic compoundsCyclohexanone108-94-135.6655503.2259000.919102
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-619.1279861.7301000.492928
Polymers2-Oxiranemethanamine,N-[2-methyl-4-(2-oxiranylmethoxy)phenyl]-N-(2-oxiranylmethyl)-110656-67-21.9215330.1738000.049518
PolymersOther acrylic/epoxy resin mixture18.1440021.6411000.467571
PolymersOther polymers5.9812960.5410000.154138
Silver and its compoundsSilver, metal7440-22-42.0331980.1839000.052395
Tin and its compoundsTin, metal7440-31-565.3918185.9146001.685148
Subtotal1105.600000100.000000028.491321
UnderfillInorganic Silicon compoundsSilica, vitreous60676-86-014.16000060.0000000.364903
Inorganic compoundsCarbon Black1333-86-40.0236000.1000000.000608
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2124000.9000000.005474
PolymersPlastic: EP - Epoxide, Epoxy9.20400039.0000000.237187
Subtotal23.600000100.00000000.608172
Total3880.480000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of LS1026ASE8T1A
产品内容声明 LS1026ASE8T1A
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Heat Spreader
散热片
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
OOOOOO
Substrate
基板
OOOOOO
Underfill
底注
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of LS1026ASE8T1A
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
23 Nov 2018
Test Report
23 Nov 2018
Test Report
23 Nov 2018
Test Report
23 Nov 2018
Epoxy AdhesiveTest Report
7 Mar 2019
Test Report
7 Mar 2019
Test Report
7 Mar 2019
Test Report
7 Mar 2019
Heat SpreaderNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
28 Dec 2018
Test Report
28 Dec 2018
Test Report
28 Dec 2018
Test Report
28 Dec 2018
Solder Ball - SAC, Lead FreeTest Report
29 Mar 2019
Test Report
29 Mar 2019
Test Report
29 Mar 2019
Test Report
29 Mar 2019
SubstrateAUS 703Test Report
20 Mar 2019
Test Report
20 Mar 2019
Test Report
18 Nov 2018
Not Available
COPPERTest Report
22 Jan 2019
Test Report
22 Jan 2019
Test Report
22 Jan 2019
Not Available
E700GRTest Report
30 Jan 2018
Test Report
22 Jan 2019
Test Report
30 Jan 2018
Not Available
GX-13Test Report
31 Oct 2018
Test Report
31 Oct 2018
Test Report
31 Oct 2018
Not Available
PHP-900 IR-6Not AvailableNot AvailableTest Report
19 Sep 2018
Not Available
PHP-900 IR6Test Report
19 Sep 2018
Test Report
19 Sep 2018
Not AvailableNot Available
UnderfillTest Report
2 Apr 2019
Test Report
2 Apr 2019
Test Report
2 Apr 2019
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.