LPC54616J256ET180E

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LPC54616J256ET180ELast Revision (GMT):
Saturday, 12 December 2020, 08:34:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC54616J256ET180ESOT570TFBGA18031.861085 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 402 325512019-12-3113 / 168 hours26030 sec.3 / 168 hours24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.54910697.8650001.723437
Gold and its compoundsGold, metal7440-57-50.0007580.1350000.002377
Palladium and its compoundsPalladium, metal7440-05-30.0112222.0000000.035221
Subtotal0.561085100.00000001.761035
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins0.10500010.5000000.329556
Inorganic Silicon compoundsQuartz14808-60-70.89500089.5000002.809069
Subtotal1.000000100.00000003.138625
Epoxy AdhesiveEpoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.19000010.0000000.596339
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0380002.0000000.119268
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.19000010.0000000.596339
Silver and its compoundsSilver, metal7440-22-41.48200078.0000004.651442
Subtotal1.900000100.00000005.963388
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0950000.5000000.298169
Silver and its compoundsSilver, metal7440-22-40.1900001.0000000.596339
Tin and its compoundsTin, metal7440-31-518.71500098.50000058.739368
Subtotal19.000000100.000000059.633876
SubstrateSubstrateCopper and its compoundsCopper, metal7440-50-81.54160016.4000004.838504
Epoxy ResinsProprietary Material-Other Epoxy resins1.60740017.1000005.045026
Gold and its compoundsGold, metal7440-57-50.0094000.1000000.029503
Inorganic Silicon compoundsOther silica compounds2.94220031.3000009.234463
Miscellaneous substancesProprietary Material-Other miscellaneous substances.2.51920026.8000007.906824
Nickel and its compoundsNickel, metal7440-02-00.0564000.6000000.177018
PolymersProprietary Material-Other acrylic/epoxy resin mixture0.7238007.7000002.271737
Subtotal9.400000100.000000029.503076
Total31.861085100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC54616J256ET180E
Product content declaration of LPC54616J256ET180E
上次修订 Last Revision (GMT):
Saturday, 12 December 2020, 08:34:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC54616J256ET180ELast Revision (GMT):
Saturday, 12 December 2020, 08:34:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantNot AvailableNot AvailableNot AvailableNot Available
Epoxy AdhesiveNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeNot AvailableNot AvailableNot AvailableNot Available
SubstrateAU PLATINGTest Report
6 Mar 2020
Test Report
6 Mar 2020
Test Report
6 Mar 2020
Test Report
6 Mar 2020
AUS 308Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
COPPERTest Report
16 Mar 2020
Test Report
16 Mar 2020
Test Report
16 Mar 2020
Test Report
16 Mar 2020
CU PLATINGTest Report
3 Jan 2020
Test Report
3 Jan 2020
Test Report
3 Jan 2020
Test Report
3 Jan 2020
HL832NXATest Report
6 Apr 2020
Test Report
6 Apr 2020
Test Report
6 Apr 2020
Test Report
6 Apr 2020
NI PLATINGTest Report
14 May 2020
Test Report
14 May 2020
Test Report
14 May 2020
Test Report
14 May 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.