FXTH87EH116T1

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of FXTH87EH116T1Last Revision (GMT):
Sunday, 20 December 2020, 03:50:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FXTH87EH116T1SOT1575-1HQFN24295.899978 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 408 635282020-08-078Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - Au 1Bonding Wire - AuGold and its compoundsGold, metal7440-57-50.09997499.9900000.033786
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000100.0100000.000003
Subtotal0.099984100.00000000.033790
Bonding Wire - Au 2Bonding Wire - AuGold and its compoundsGold, metal7440-57-50.39995499.9900000.135165
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000400.0100000.000013
Subtotal0.399994100.00000000.135179
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-86.98229496.9763002.359680
Gold and its compoundsGold, metal7440-57-50.0013680.0190000.000462
Iron and its compoundsIron, metal7439-89-60.1538142.1363000.051982
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000720.0010000.000024
Nickel and its compoundsNickel, metal7440-02-00.0573120.7960000.019369
Palladium and its compoundsPalladium, metal7440-05-30.0018000.0250000.000608
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0020450.0284000.000691
Silver and its compoundsSilver, metal7440-22-40.0012960.0180000.000438
Subtotal7.200000100.00000002.433254
Die Encapsulant 1Die EncapsulantOrganic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.21818136.3636000.411687
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.03030460.6061000.686145
Organic Silicon compoundsTetra (trimethylsiloxy) silane3555-47-30.1015153.0303000.034307
Subtotal3.350000100.00000001.132139
Die Encapsulant 2Die EncapsulantOrganic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.21818136.3636000.411687
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.03030460.6061000.686145
Organic Silicon compoundsTetra (trimethylsiloxy) silane3555-47-30.1015153.0303000.034307
Subtotal3.350000100.00000001.132139
Die Encapsulant 3Die EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins14.9504897.5015005.052548
Inorganic Silicon compoundsSilica, vitreous60676-86-0163.41882581.99640055.227725
Inorganic Silicon compoundsSilicon dioxide7631-86-914.9504897.5015005.052548
Inorganic compoundsCarbon Black1333-86-40.9966990.5001000.336837
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins4.9834972.5005001.684183
Subtotal199.300000100.000000067.353841
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.37200093.0000000.125718
Organic Silicon compounds(3,4-Epoxycyclohexyl)ethyltrimethoxysilane3388-04-30.0080002.0000000.002704
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0200005.0000000.006759
Subtotal0.400000100.00000000.135181
Epoxy Adhesive 2Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.04500045.0000000.015208
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0000100.0100000.000003
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0050005.0000000.001690
PolymersPlastic: EP - Epoxide, Epoxy0.04999049.9900000.016894
Subtotal0.100000100.00000000.033795
Epoxy Adhesive 3Epoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.01000010.0000000.003380
Epoxy ResinsOther Epoxy resins0.02500025.0000000.008449
Inorganic Silicon compoundsSilicon dioxide7631-86-90.02500025.0000000.008449
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.03000030.0000000.010139
PolymersAcrylic acid ester copolymer78506-70-40.01000010.0000000.003380
Subtotal0.100000100.00000000.033795
Epoxy Adhesive 4Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.39600099.0000000.133829
Inorganic compoundsCarbon Black1333-86-40.0040001.0000000.001352
Subtotal0.400000100.00000000.135181
LidLidChromium and Chromium III compoundsChromium, metal7440-47-312.62411818.1381004.266346
Inorganic Silicon compoundsSilicon7440-21-30.4377140.6289000.147926
Inorganic compoundsCarbon7440-44-00.0347300.0499000.011737
Inorganic compoundsSulfur7704-34-90.0020880.0030000.000706
Iron and its compoundsIron, metal7439-89-649.57434071.22750016.753749
Manganese and its compoundsManganese, metal7439-96-50.7295471.0482000.246552
Nickel and its compoundsNickel, metal7440-02-05.9890108.6049002.023998
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.2084520.2995000.070447
Subtotal69.600000100.000000023.521462
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped6.27200098.0000002.119635
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1280002.0000000.043258
Subtotal6.400000100.00000002.162893
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsFibrous-glass-wool65997-17-30.0258520.9943000.008737
Inorganic Silicon compoundsSilicon, doped2.52130696.9733000.852080
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.0269911.0381000.009121
Organic compounds2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate25265-77-40.0258520.9943000.008737
Subtotal2.600000100.00000000.878675
Semiconductor Die 3Semiconductor DieInorganic Silicon compoundsSilicon, doped2.54800098.0000000.861102
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0520002.0000000.017573
Subtotal2.600000100.00000000.878675
Total295.899978100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FXTH87EH116T1
Product content declaration of FXTH87EH116T1
上次修订 Last Revision (GMT):
Sunday, 20 December 2020, 03:50:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au 1
焊丝-金
Bonding Wire - Au
OOOOOO
焊丝-金
Bonding Wire - Au 2
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 3
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 3
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 4
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
盖子
Lid
盖子
Lid
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
XOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FXTH87EH116T1Last Revision (GMT):
Sunday, 20 December 2020, 03:50:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - Au 1Not AvailableNot AvailableNot AvailableNot Available
Bonding Wire - Au 2Not AvailableNot AvailableNot AvailableNot Available
Copper Lead-Frame, Pre-PlatedNot AvailableNot AvailableNot AvailableNot Available
Die Encapsulant 1Not AvailableNot AvailableNot AvailableNot Available
Die Encapsulant 2Not AvailableNot AvailableNot AvailableNot Available
Die Encapsulant 3Not AvailableNot AvailableNot AvailableNot Available
Epoxy Adhesive 1Not AvailableNot AvailableNot AvailableNot Available
Epoxy Adhesive 2Not AvailableNot AvailableNot AvailableNot Available
Epoxy Adhesive 3Not AvailableNot AvailableNot AvailableNot Available
Epoxy Adhesive 4Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
LidNot AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 1Not AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 2Not AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 3Not AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.