MCIMX6G2CVM05AB

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

Product content declaration of MCIMX6G2CVM05AB
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
MCIMX6G2CVM05ABSOT1534-2LFBGA289448.596495 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 461 565572019-04-2443 | 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding WireCopper and its compoundsCopper, metal7440-50-81.81630598.0994000.404886
Gold and its compoundsGold, metal7440-57-50.0018520.1000000.000413
Palladium and its compoundsPalladium, metal7440-05-30.0333381.8006000.007432
Subtotal1.851495100.00000000.412731
Die EncapsulantAluminum and its compoundsAluminum, metal7429-90-55.6725002.5000001.264499
Inorganic Silicon compoundsSilica, amorphous synthetic112926-00-85.6725002.5000001.264499
Inorganic Silicon compoundsSilicon dioxide7631-86-9181.52000080.00000040.463981
Magnesium and its compoundsMagnesium, metal7439-95-42.2690001.0000000.505800
Organic Phosphorus compoundsOther organic phosphorous compounds2.2690001.0000000.505800
Organic Silicon compoundsOther organic Silicon Compounds2.2690001.0000000.505800
Organic Silicon compoundsSilicone modified epoxy resin218163-11-226.09350011.5000005.816697
PolymersProprietary Material-Other acrylic/epoxy resin mixture1.1345000.5000000.252900
Subtotal226.900000100.000000050.579976
Epoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.1275007.5000000.028422
Inorganic Silicon compoundsSilica, vitreous60676-86-00.76500045.0000000.170532
PolymersCrosslinked acrylate polymer25767-43-50.34000020.0000000.075792
PolymersOther polymers0.1275007.5000000.028422
PolymersProprietary Material-Other polymers0.34000020.0000000.075792
Subtotal1.700000100.00000000.378960
Semiconductor DieInorganic Silicon compoundsSilicon, doped7.54600098.0000001.682135
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1540002.0000000.034329
Subtotal7.700000100.00000001.716465
Solder Ball - SAC, Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0007110.0010000.000159
Antimony and its compoundsAntimony, metal7440-36-00.0355720.0500000.007930
Arsenic and its compoundsArsenic, metal7440-38-20.0213440.0300000.004758
Bismuth and its compoundsBismuth, metal7440-69-90.0213440.0300000.004758
Cadmium and its compoundsCadmium, metal7440-43-90.0014230.0020000.000317
Copper and its compoundsCopper, metal7440-50-80.3557250.5000000.079297
Iron and its compoundsIron, metal7439-89-60.0142290.0200000.003172
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0355720.0500000.007930
Silver and its compoundsSilver, metal7440-22-40.7114501.0000000.158595
Tin and its compoundsTin, metal7440-31-569.94691898.31600015.592391
Zinc and its compoundsZinc, metal7440-66-60.0007110.0010000.000159
Subtotal71.145000100.000000015.859464
SubstrateAcrylonitrile compoundsAcrylonitrile/Butadiene copolymer, carboxyl terminated (26/74)68891-46-31.3930001.0000000.310524
Barium and its compoundsBarium sulfate7727-43-713.93000010.0000003.105240
Copper and its compoundsCopper, metal7440-50-821.03430015.1000004.688913
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-535.17325025.2500007.840732
Gold and its compoundsGold, metal7440-57-51.6716001.2000000.372629
Inorganic Silicon compoundsFibrous-glass-wool65997-17-333.43200024.0000007.452577
Inorganic Silicon compoundsSilica amorphous61790-53-217.06425012.2500003.803920
Nickel and its compoundsNickel, metal7440-02-08.3580006.0000001.863144
Organic Silicon compoundsSilicone modified epoxy resin218163-11-27.2436005.2000001.614725
Subtotal139.300000100.000000031.052405
Total448.596495100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MCIMX6G2CVM05AB
产品内容声明 MCIMX6G2CVM05AB
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire
焊线
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
OOOOOO
Substrate
基板
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MCIMX6G2CVM05AB
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding WireTest Report
22 Jun 2018
Test Report
22 Jun 2018
Test Report
22 Jun 2018
Test Report
22 Jun 2018
Die EncapsulantTest Report
23 May 2018
Test Report
23 May 2018
Test Report
23 May 2018
Test Report
23 May 2018
Epoxy AdhesiveTest Report
18 Oct 2018
Test Report
18 Oct 2018
Test Report
18 Oct 2018
Not Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeTest Report
20 Mar 2018
Test Report
20 Mar 2018
Test Report
20 Mar 2018
Test Report
20 Mar 2018
SubstrateAUS308Test Report
20 Aug 2018
Test Report
20 Aug 2018
Test Report
15 Feb 2019
Not Available
COPPER FOILTest Report
30 Jan 2018
Test Report
22 Jan 2019
Test Report
22 Jan 2019
Not Available
E679FGBTest Report
22 Jan 2019
Test Report
22 Jan 2019
Test Report
22 Jan 2019
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.