FXTH87EG11DT1

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of FXTH87EG11DT1Last Revision (GMT):
Thursday, 08 April 2021, 05:14:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FXTH87EG11DT1SOT1575HQFN24298.749978 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 515 325282021-01-139Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - Au 1Bonding Wire - AuGold and its compoundsGold, metal7440-57-50.09997499.9900000.033464
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000100.0100000.000003
Subtotal0.099984100.00000000.033467
Bonding Wire - Au 2Bonding Wire - AuGold and its compoundsGold, metal7440-57-50.39995499.9900000.133876
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000400.0100000.000013
Subtotal0.399994100.00000000.133889
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-86.98229496.9763002.337170
Gold and its compoundsGold, metal7440-57-50.0013680.0190000.000458
Iron and its compoundsIron, metal7439-89-60.1538142.1363000.051486
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000720.0010000.000024
Nickel and its compoundsNickel, metal7440-02-00.0573120.7960000.019184
Palladium and its compoundsPalladium, metal7440-05-30.0018000.0250000.000602
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0020450.0284000.000684
Silver and its compoundsSilver, metal7440-22-40.0012960.0180000.000434
Subtotal7.200000100.00000002.410042
Die Encapsulant 1Die EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins14.9504897.5015005.004348
Inorganic Silicon compoundsSilica, vitreous60676-86-0163.41882581.99640054.700866
Inorganic Silicon compoundsSilicon dioxide7631-86-914.9504897.5015005.004348
Inorganic compoundsCarbon Black1333-86-40.9966990.5001000.333623
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins4.9834972.5005001.668116
Subtotal199.300000100.000000066.711302
Die Encapsulant 2Die EncapsulantOrganic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.23624036.3600000.413804
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.06074060.6100000.689787
Organic Silicon compoundsTetra (trimethylsiloxy) silane3555-47-30.1030203.0300000.034484
Subtotal3.400000100.00000001.138075
Die Encapsulant 3Die EncapsulantGold and its compoundsGold, metal7440-57-50.1030203.0300000.034484
Magnesium and its compoundsMagnesium, metal7439-95-42.06074060.6100000.689787
Palladium and its compoundsPalladium, metal7440-05-31.23624036.3600000.413804
Subtotal3.400000100.00000001.138075
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.37200093.0000000.124519
Organic Silicon compounds(3,4-Epoxycyclohexyl)ethyltrimethoxysilane3388-04-30.0080002.0000000.002678
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0200005.0000000.006695
Subtotal0.400000100.00000000.133891
Epoxy Adhesive 2Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.04500045.0000000.015063
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0000100.0100000.000003
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0050005.0000000.001674
PolymersPlastic: EP - Epoxide, Epoxy0.04999049.9900000.016733
Subtotal0.100000100.00000000.033473
Epoxy Adhesive 3Epoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.01000010.0000000.003347
Epoxy ResinsOther Epoxy resins0.02500025.0000000.008368
Inorganic Silicon compoundsSilicon dioxide7631-86-90.02500025.0000000.008368
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.03000030.0000000.010042
PolymersAcrylic acid ester copolymer78506-70-40.01000010.0000000.003347
Subtotal0.100000100.00000000.033473
Epoxy Adhesive 4Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.39600099.0000000.132552
Inorganic compoundsCarbon Black1333-86-40.0040001.0000000.001339
Subtotal0.400000100.00000000.133891
LidLidChromium and Chromium III compoundsChromium, metal7440-47-312.62411818.1381004.225646
Inorganic Silicon compoundsSilicon7440-21-30.4377140.6289000.146515
Inorganic compoundsCarbon7440-44-00.0347300.0499000.011625
Inorganic compoundsSulfur7704-34-90.0020880.0030000.000699
Iron and its compoundsIron, metal7439-89-649.57434071.22750016.593923
Manganese and its compoundsManganese, metal7439-96-50.7295471.0482000.244200
Nickel and its compoundsNickel, metal7440-02-05.9890108.6049002.004690
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.2084520.2995000.069775
Subtotal69.600000100.000000023.297073
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped5.24300098.0000001.754979
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1070002.0000000.035816
Subtotal5.350000100.00000001.790795
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon, doped6.27200098.0000002.099414
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1280002.0000000.042845
Subtotal6.400000100.00000002.142260
Semiconductor Die 3Semiconductor DieInorganic Silicon compoundsFibrous-glass-wool65997-17-30.0258520.9943000.008653
Inorganic Silicon compoundsSilicon, doped2.52130696.9733000.843952
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.0269911.0381000.009035
Organic compounds2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate25265-77-40.0258520.9943000.008653
Subtotal2.600000100.00000000.870293
Total298.749978100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FXTH87EG11DT1
Product content declaration of FXTH87EG11DT1
上次修订 Last Revision (GMT):
Thursday, 08 April 2021, 05:14:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au 1
焊丝-金
Bonding Wire - Au
OOOOOO
焊丝-金
Bonding Wire - Au 2
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 3
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 3
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 4
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
盖子
Lid
盖子
Lid
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FXTH87EG11DT1Last Revision (GMT):
Thursday, 08 April 2021, 05:14:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - Au 1Test Report
25 May 2020
Test Report
25 May 2020
Test Report
25 May 2020
Test Report
25 May 2020
Bonding Wire - Au 2Test Report
25 May 2020
Test Report
25 May 2020
Test Report
25 May 2020
Test Report
25 May 2020
Copper Lead-Frame, Pre-PlatedTest Report
14 Jan 2019
Test Report
14 Jan 2019
Test Report
14 Jan 2019
Test Report
14 Jan 2019
Die Encapsulant 1Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Die Encapsulant 2Test Report
28 Apr 2020
Test Report
28 Apr 2020
Test Report
28 Apr 2020
Test Report
28 Apr 2020
Die Encapsulant 3Test Report
28 Apr 2020
Test Report
28 Apr 2020
Test Report
28 Apr 2020
Test Report
28 Apr 2020
Epoxy Adhesive 1Test Report
6 Oct 2020
Test Report
6 Oct 2020
Test Report
6 Oct 2020
Test Report
6 Oct 2020
Epoxy Adhesive 2Test Report
8 Sep 2020
Test Report
8 Sep 2020
Test Report
8 Sep 2020
Not Available
Epoxy Adhesive 3Test Report
30 Mar 2020
Test Report
30 Mar 2020
Test Report
10 Apr 2019
Not Available
Epoxy Adhesive 4Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
LidTest Report
27 Dec 2018
Test Report
27 Dec 2018
Test Report
27 Dec 2018
Test Report
27 Dec 2018
Semiconductor Die 1Test Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
Semiconductor Die 2Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Semiconductor Die 3CAP DIETest Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
LEAD GLASS FRIT DIETest Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.