MCIMX6QP7CVT8AB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX6QP7CVT8ABLast Revision (GMT):
Thursday, 26 November 2020, 11:38:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX6QP7CVT8ABSOT1643-1FBGA6243301.975700 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 566 415572020-10-1593 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapCapCopper and its compoundsCopper, metal7440-50-81986.13800099.00000060.149988
Nickel and its compoundsNickel, metal7440-02-020.0620001.0000000.607576
Subtotal2006.200000100.000000060.757564
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-58.40000070.0000000.254393
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.3600003.0000000.010903
Organic Silicon compoundsDimethyl Cyclosiloxanes70900-21-90.1200001.0000000.003634
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.1200001.0000000.003634
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-21.20000010.0000000.036342
Zinc and its compoundsZinc oxide1314-13-21.80000015.0000000.054513
Subtotal12.000000100.00000000.363419
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-72.91000030.0000000.088129
Inorganic Silicon compoundsSilylated silica68909-20-60.3880004.0000000.011751
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0019400.0200000.000059
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.3880004.0000000.011751
Organic Silicon compoundsOther siloxanes and silicones0.2910003.0000000.008813
Organic Silicon compoundsSilicic acid sodium salt hydrolysis products with chlorotrimethylsilane and dichloroethenylmethylsilane68584-83-80.4365004.5000000.013219
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-25.23800054.0000000.158632
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.0291000.3000000.000881
Organic compoundsOther organic compounds.0.0145500.1500000.000441
Platinum and its compoundsOther platinum compounds0.0029100.0300000.000088
Subtotal9.700000100.00000000.293764
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped33.95840089.6000001.028427
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3411000.9000000.010330
Nickel and its compoundsNickel, metal7440-02-00.1895000.5000000.005739
Silver and its compoundsSilver, metal7440-22-40.1193850.3150000.003616
Tin and its compoundsTin, metal7440-31-53.2916158.6850000.099686
Subtotal37.900000100.00000001.147798
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-81.5131250.5000000.045825
Silver and its compoundsSilver, metal7440-22-49.0787503.0000000.274949
Tin and its compoundsTin, metal7440-31-5292.03312596.5000008.844194
Subtotal302.625000100.00000009.164967
SubstrateSubstrateArsenic and its compoundsArsenic, metal7440-38-20.0092150.0010000.000279
Barium and its compoundsBarium sulfate7727-43-75.0500980.5480000.152942
Cobalt and its compoundsCobalt, metal7440-48-40.0156660.0017000.000474
Copper and its compoundsCopper, metal7440-50-8403.96635743.83550012.234080
Epoxy ResinsOther Epoxy resins240.46575426.0936007.282481
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3229.27905024.8797006.943693
Inorganic Silicon compoundsSilicon dioxide7631-86-923.2507242.5230000.704146
Nickel and its compoundsNickel, metal7440-02-00.0193530.0021000.000586
Silver and its compoundsSilver, metal7440-22-40.5879490.0638000.017806
Tin and its compoundsTin, metal7440-31-518.9065342.0516000.572582
Subtotal921.550700100.000000027.909070
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-31.32000011.0000000.039976
Bismuth and its compoundsBismuth nitrate10361-44-10.0120000.1000000.000363
Bismuth and its compoundsBismuth trioxide1304-76-30.0960000.8000000.002907
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-61.68000014.0000000.050879
Epoxy ResinsOther Epoxy resins0.4800004.0000000.014537
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.20000010.0000000.036342
Inorganic Silicon compoundsSilica, vitreous60676-86-07.20000060.0000000.218051
Inorganic compoundsCarbon Black1333-86-40.0120000.1000000.000363
Subtotal12.000000100.00000000.363419
Total3301.975700100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX6QP7CVT8AB
Product content declaration of MCIMX6QP7CVT8AB
上次修订 Last Revision (GMT):
Thursday, 26 November 2020, 11:38:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
盖子
Cap
盖子
Cap
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX6QP7CVT8ABLast Revision (GMT):
Thursday, 26 November 2020, 11:38:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantNot AvailableNot AvailableNot AvailableNot Available
Epoxy AdhesiveNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeNot AvailableNot AvailableNot AvailableNot Available
SubstrateNot AvailableNot AvailableNot AvailableNot Available
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.