MIMXRT1021CAG4AR

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MIMXRT1021CAG4ARLast Revision (GMT):
Wednesday, 31 March 2021, 10:05:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MIMXRT1021CAG4ARSOT486LQFP1441291.347290 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 603 185282020-05-2533 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.31882697.8873000.102128
Gold and its compoundsGold, metal7440-57-50.0023730.1761000.000184
Palladium and its compoundsPalladium, metal7440-05-30.0260921.9366000.002021
Subtotal1.347290100.00000000.104332
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-8174.77433195.01600013.534262
Inorganic Silicon compoundsSilicon7440-21-31.3427770.7300000.103983
Iron and its compoundsIron, metal7439-89-60.2336060.1270000.018090
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0551830.0300000.004273
Magnesium and its compoundsMagnesium, metal7439-95-40.3255770.1770000.025212
Manganese and its compoundsManganese, metal7439-96-50.1103650.0600000.008547
Nickel and its compoundsNickel, metal7440-02-05.9413273.2300000.460087
Zinc and its compoundsZinc, metal7440-66-61.1588350.6300000.089738
Subtotal183.942000100.000000014.244193
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001860.0100000.000014
Silver and its compoundsSilver, metal7440-22-41.85781499.9900000.143866
Subtotal1.858000100.00000000.143881
Die EncapsulantDie EncapsulantEpoxy ResinsEpoxy resin, EPON Resin 809125928-94-353.0700005.0000004.109661
Inorganic Silicon compoundsSilica, vitreous60676-86-0796.05000075.00000061.644920
Inorganic Silicon compoundsSilicon dioxide7631-86-9100.8330009.5000007.808357
Inorganic compoundsCarbon Black1333-86-45.3070000.5000000.410966
Organic Silicon compoundsSilicone modified epoxy resin218163-11-253.0700005.0000004.109661
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins53.0700005.0000004.109661
Subtotal1061.400000100.000000082.193226
Epoxy AdhesiveEpoxy AdhesiveAcrylates2-propenoic acid, (1-methylethylidene)bis(4,1-phenyleneoxy-2,1-ethanediyl) ester24447-78-70.8820007.0000000.068301
AcrylatesDicyclopentenyloxyethyl acrylate65983-31-50.5670004.5000000.043908
Epoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.2520002.0000000.019515
Organic Silicon compounds3-(trimethoxysilyl)propyl methacrylate2530-85-00.1386001.1000000.010733
Organic compoundsOther Organic Peroxides0.0378000.3000000.002927
Polymers1,3-Butadiene, homopolymer, epoxidized, cyclized68441-49-60.5040004.0000000.039029
PolymersPoly(acrylonitrile-co-butadiene-co-acrylic acid), dicarboxy terminated68891-50-90.1386001.1000000.010733
Silver and its compoundsSilver, metal7440-22-410.08000080.0000000.780580
Subtotal12.600000100.00000000.975725
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0026400.0200000.000204
Tin and its compoundsTin, metal7440-31-513.19736099.9800001.021984
Subtotal13.200000100.00000001.022188
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped16.66000098.0000001.290125
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3400002.0000000.026329
Subtotal17.000000100.00000001.316455
Total1291.347290100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MIMXRT1021CAG4AR
Product content declaration of MIMXRT1021CAG4AR
上次修订 Last Revision (GMT):
Wednesday, 31 March 2021, 10:05:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MIMXRT1021CAG4ARLast Revision (GMT):
Wednesday, 31 March 2021, 10:05:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
29 Apr 2020
Test Report
29 Apr 2020
Test Report
29 Apr 2020
Test Report
29 Apr 2020
Copper Lead-FrameTest Report
5 Mar 2020
Test Report
5 Mar 2020
Test Report
5 Mar 2020
Test Report
5 Mar 2020
Die EncapsulantTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Epoxy AdhesiveTest Report
27 Jul 2020
Test Report
27 Jul 2020
Test Report
27 Jul 2020
Test Report
27 Jul 2020
Post-plating - Lead FreeTest Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Semiconductor DieTest Report
2 Sep 2020
Test Report
2 Sep 2020
Test Report
2 Sep 2020
Test Report
29 Mar 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.