AFSC5G35D37T2

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NXP Semiconductors
Product content declaration of AFSC5G35D37T2Last Revision (GMT):
Sunday, 29 August 2021, 10:48:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
AFSC5G35D37T2SOT1831HLLGA27134.176170 mg YesNoYesNickel/Gold (Ni/Au)Othere4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 694 135282021-06-026Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.39754099.9900000.296282
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000400.0100000.000030
Subtotal0.397580100.00000000.296312
Capacitor 1CeramicCalcium and its compoundsCalcium monoxide1305-78-80.04666725.0000000.034780
Manganese and its compoundsManganese oxide1344-43-00.0093335.0000000.006956
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.01866710.0000000.013912
Zirconium and its compoundsZirconium oxide1314-23-40.11200060.0000000.083472
Subtotal0.186667100.00000000.139121
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00777799.9900000.005796
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Subtotal0.007778100.00000000.005797
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01166599.9900000.008694
Subtotal0.011667100.00000000.008695
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0023332.0000000.001739
Copper and its compoundsCopper, metal7440-50-80.10500090.0000000.078255
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0093338.0000000.006956
Subtotal0.116667100.00000000.086950
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000030.0100000.000002
Tin and its compoundsTin, metal7440-31-50.02722099.9900000.020286
Subtotal0.027222100.00000000.020288
Capacitor 2CeramicCalcium and its compoundsCalcium monoxide1305-78-80.02400025.0000000.017887
Manganese and its compoundsManganese oxide1344-43-00.0048005.0000000.003577
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00960010.0000000.007155
Zirconium and its compoundsZirconium oxide1314-23-40.05760060.0000000.042929
Subtotal0.096000100.00000000.071548
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00399999.9900000.002981
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Subtotal0.004000100.00000000.002981
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00599999.9900000.004471
Subtotal0.006000100.00000000.004472
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0012002.0000000.000894
Copper and its compoundsCopper, metal7440-50-80.05400090.0000000.040246
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0048008.0000000.003577
Subtotal0.060000100.00000000.044717
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Tin and its compoundsTin, metal7440-31-50.01399999.9900000.010433
Subtotal0.014000100.00000000.010434
Capacitor 3CapacitorBoron and its compoundsBoron oxide1303-86-20.0006030.6700000.000449
Calcium and its compoundsCalcium monoxide1305-78-80.00960310.6700000.007157
Copper and its compoundsCopper, metal7440-50-80.03379537.5500000.025187
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0024032.6700000.001791
Manganese and its compoundsManganese carbonate598-62-90.0024032.6700000.001791
Nickel and its compoundsNickel, metal7440-02-00.0029973.3300000.002234
Tin and its compoundsTin, metal7440-31-50.0070027.7800000.005219
Zirconium and its compoundsZirconium oxide1314-23-40.03119434.6600000.023248
Subtotal0.090000100.00000000.067076
Capacitor 4CeramicCalcium and its compoundsCalcium monoxide1305-78-80.02400025.0000000.017887
Manganese and its compoundsManganese oxide1344-43-00.0048005.0000000.003577
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00960010.0000000.007155
Zirconium and its compoundsZirconium oxide1314-23-40.05760060.0000000.042929
Subtotal0.096000100.00000000.071548
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00399999.9900000.002981
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Subtotal0.004000100.00000000.002981
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00599999.9900000.004471
Subtotal0.006000100.00000000.004472
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0012002.0000000.000894
Copper and its compoundsCopper, metal7440-50-80.05400090.0000000.040246
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0048008.0000000.003577
Subtotal0.060000100.00000000.044717
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Tin and its compoundsTin, metal7440-31-50.01399999.9900000.010433
Subtotal0.014000100.00000000.010434
Capacitor 5CeramicCalcium and its compoundsCalcium monoxide1305-78-80.01459125.0000000.010874
Manganese and its compoundsManganese oxide1344-43-00.0029185.0000000.002175
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00583610.0000000.004350
Zirconium and its compoundsZirconium oxide1314-23-40.03501860.0000000.026099
Subtotal0.058364100.00000000.043498
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00245499.9900000.001829
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Subtotal0.002455100.00000000.001829
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00190899.9900000.001423
Subtotal0.001909100.00000000.001423
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0004362.0000000.000325
Copper and its compoundsCopper, metal7440-50-80.01963690.0000000.014635
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0017468.0000000.001301
Subtotal0.021818100.00000000.016261
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Tin and its compoundsTin, metal7440-31-50.00545499.9900000.004065
Subtotal0.005455100.00000000.004065
Die EncapsulantDie EncapsulantEpoxy ResinsOther Epoxy resins2.8553005.0000002.128023
Inorganic Silicon compoundsSilica, vitreous60676-86-052.36620291.70000039.027945
Inorganic compoundsCarbon Black1333-86-40.5710601.0000000.425605
Magnesium and its compoundsProprietary Material-Other magnesium compounds0.1142120.2000000.085121
Phenols and Phenolic ResinsOther phenolic resins1.1421202.0000000.851209
Zinc and its compoundsProprietary Material-Other zinc compounds0.0571060.1000000.042561
Subtotal57.106000100.000000042.560464
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.0998263.0612000.074399
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.0998263.0612000.074399
Silver and its compoundsSilver, metal7440-22-43.06134993.8776002.281589
Subtotal3.261000100.00000002.430387
Inductor 1InductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.01984024.8000000.014786
Boron and its compoundsBoron oxide1303-86-20.0054406.8000000.004054
Cobalt and its compoundsC.I. Pigment Blue 281345-16-00.0003200.4000000.000238
Inorganic Silicon compoundsSilicon dioxide7631-86-90.02816035.2000000.020987
Nickel and its compoundsNickel, metal7440-02-00.0038404.8000000.002862
Silver and its compoundsSilver, metal7440-22-40.01744021.8000000.012998
Tin and its compoundsTin, metal7440-31-50.0049606.2000000.003697
Subtotal0.080000100.00000000.059623
Inductor 2InductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.03720024.8000000.027725
Boron and its compoundsBoron oxide1303-86-20.0102006.8000000.007602
Cobalt and its compoundsC.I. Pigment Blue 281345-16-00.0006000.4000000.000447
Inorganic Silicon compoundsSilicon dioxide7631-86-90.05280035.2000000.039351
Nickel and its compoundsNickel, metal7440-02-00.0072004.8000000.005366
Silver and its compoundsSilver, metal7440-22-40.03270021.8000000.024371
Tin and its compoundsTin, metal7440-31-50.0093006.2000000.006931
Subtotal0.150000100.00000000.111793
Inductor 3InductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.03720024.8000000.027725
Boron and its compoundsBoron oxide1303-86-20.0102006.8000000.007602
Cobalt and its compoundsC.I. Pigment Blue 281345-16-00.0006000.4000000.000447
Inorganic Silicon compoundsSilicon dioxide7631-86-90.05280035.2000000.039351
Nickel and its compoundsNickel, metal7440-02-00.0072004.8000000.005366
Silver and its compoundsSilver, metal7440-22-40.03270021.8000000.024371
Tin and its compoundsTin, metal7440-31-50.0093006.2000000.006931
Subtotal0.150000100.00000000.111793
Inductor 4InductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.04340024.8000000.032345
Boron and its compoundsBoron oxide1303-86-20.0119006.8000000.008869
Cobalt and its compoundsC.I. Pigment Blue 281345-16-00.0007000.4000000.000522
Inorganic Silicon compoundsSilicon dioxide7631-86-90.06160035.2000000.045910
Nickel and its compoundsNickel, metal7440-02-00.0084004.8000000.006260
Silver and its compoundsSilver, metal7440-22-40.03815021.8000000.028433
Tin and its compoundsTin, metal7440-31-50.0108506.2000000.008086
Subtotal0.175000100.00000000.130425
Inductor 5InductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.04340024.8000000.032345
Boron and its compoundsBoron oxide1303-86-20.0119006.8000000.008869
Cobalt and its compoundsC.I. Pigment Blue 281345-16-00.0007000.4000000.000522
Inorganic Silicon compoundsSilicon dioxide7631-86-90.06160035.2000000.045910
Nickel and its compoundsNickel, metal7440-02-00.0084004.8000000.006260
Silver and its compoundsSilver, metal7440-22-40.03815021.8000000.028433
Tin and its compoundsTin, metal7440-31-50.0108506.2000000.008086
Subtotal0.175000100.00000000.130425
Inductor 6InductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.03720024.8000000.027725
Boron and its compoundsBoron oxide1303-86-20.0102006.8000000.007602
Cobalt and its compoundsC.I. Pigment Blue 281345-16-00.0006000.4000000.000447
Inorganic Silicon compoundsSilicon dioxide7631-86-90.05280035.2000000.039351
Nickel and its compoundsNickel, metal7440-02-00.0072004.8000000.005366
Silver and its compoundsSilver, metal7440-22-40.03270021.8000000.024371
Tin and its compoundsTin, metal7440-31-50.0093006.2000000.006931
Subtotal0.150000100.00000000.111793
ResistorCeramicAluminum and its compoundsAluminum oxide1302-74-50.02315496.1000000.017256
Calcium and its compoundsCalcium monoxide1305-78-80.0000960.4000000.000072
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0003611.5000000.000269
Magnesium and its compoundsMagnesium-oxide1309-48-40.0004822.0000000.000359
Subtotal0.024093100.00000000.017956
ConductorBismuth and its compoundsBismuth trioxide1304-76-30.00013813.8000000.000103
Boron and its compoundsBoron oxide1303-86-20.0000121.2000000.000009
Inorganic Silicon compoundsQuartz14808-60-70.0000464.6000000.000034
Silver and its compoundsSilver, metal7440-22-40.00080480.4000000.000599
Subtotal0.001000100.00000000.000745
ElectrodeBismuth and its compoundsBismuth trioxide1304-76-30.0000454.5000000.000034
Boron and its compoundsBoron oxide1303-86-20.0000020.2000000.000002
Inorganic Silicon compoundsQuartz14808-60-70.0000272.7000000.000020
Palladium and its compoundsPalladium, metal7440-05-30.0000373.7000000.000028
Silver and its compoundsSilver, metal7440-22-40.00088988.9000000.000663
Subtotal0.001000100.00000000.000745
InsulationInorganic Silicon compoundsSilica, vitreous60676-86-00.00016616.6000000.000124
Inorganic compoundsProprietary Material - Other inorganic compounds0.0000434.3000000.000032
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.00025025.0000000.000186
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.00054154.1000000.000403
Subtotal0.001000100.00000000.000745
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00172999.9900000.001289
Subtotal0.001730100.00000000.001289
Protective CoatingAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0000676.7000000.000050
Bismuth and its compoundsBismuth trioxide1304-76-30.00075575.5000000.000563
Boron and its compoundsBoron oxide1303-86-20.0000101.0000000.000008
Inorganic Silicon compoundsQuartz14808-60-70.00016816.8000000.000125
Subtotal0.001000100.00000000.000745
Resistive LayerAluminum and its compoundsAluminum oxide1302-74-50.0000725.5100000.000054
Boron and its compoundsBoron oxide1303-86-20.0000120.9000000.000009
Copper and its compoundsCupric oxide1317-38-00.0000120.9000000.000009
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00025719.5400000.000191
Lead and its compoundsLead monooxide1317-36-80.0000745.6500000.000055
Manganese and its compoundsManganese tetraoxide1317-35-70.0000241.8000000.000018
Palladium and its compoundsPalladium, metal7440-05-30.0001189.0200000.000088
Ruthenium and its compoundsRuthenium oxide12036-10-10.0001189.0200000.000088
Silver and its compoundsSilver, metal7440-22-40.00056543.0500000.000421
Tantalum and its compoundsTantalum (V) oxide1314-61-00.0000372.8100000.000028
Zinc and its compoundsZinc oxide1314-13-20.0000241.8000000.000018
Subtotal0.001313100.00000000.000978
TerminationChromium and Chromium III compoundsChromium, metal7440-47-30.00035035.0000000.000261
Nickel and its compoundsNickel, metal7440-02-00.00065065.0000000.000484
Subtotal0.001000100.00000000.000745
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000000
Tin and its compoundsTin, metal7440-31-50.00259399.9900000.001933
Subtotal0.002594100.00000000.001934
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-325.52820589.60000019.025886
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2564220.9000000.191108
Nickel and its compoundsNickel, metal7440-02-00.1424570.5000000.106171
Silver and its compoundsSilver, metal7440-22-40.0897480.3150000.066888
Tin and its compoundsTin, metal7440-31-52.4744698.6850001.844194
Subtotal28.491300100.000000021.234247
Semiconductor Die 2Semiconductor DieGold and its compoundsGold, metal7440-57-50.0055141.0200000.004109
Inorganic Silicon compoundsSilicon, doped0.52434597.0004000.390789
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0107011.9796000.007975
Subtotal0.540560100.00000000.402873
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-80.0152012.9864000.011329
Glycol Ethers and Acetates - Specific2-(2-butoxyethoxy)ethanol112-34-50.0138352.7181000.010311
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.06337512.4509000.047233
Silver and its compoundsSilver, metal7440-22-40.0219144.3053000.016332
Tin and its compoundsTin, metal7440-31-50.39467577.5393000.294147
Subtotal0.509000100.00000000.379352
Solder PasteSolder PasteCopper and its compoundsCopper, metal7440-50-80.0091382.9864000.006811
Glycol Ethers and Acetates - Specific2-(2-butoxyethoxy)ethanol112-34-50.0083172.7181000.006199
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.03810012.4509000.028395
Silver and its compoundsSilver, metal7440-22-40.0131744.3053000.009819
Tin and its compoundsTin, metal7440-31-50.23727077.5393000.176835
Subtotal0.306000100.00000000.228058
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuBarium and its compoundsBarium sulfate7727-43-70.7616611.8239000.567657
Copper and its compoundsCopper, metal7440-50-822.56965154.04610016.820909
Epoxy ResinsOther Epoxy resins2.4596645.8900001.833160
Gold and its compoundsGold, metal7440-57-50.4237391.0147000.315808
Inorganic Silicon compoundsFibrous-glass-wool65997-17-35.28969712.6669003.942352
Inorganic Silicon compoundsSilica, vitreous60676-86-06.34764515.2003004.730829
Nickel and its compoundsNickel, metal7440-02-03.9079439.3581002.912546
Subtotal41.760000100.000000031.123261
Total134.176170100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 AFSC5G35D37T2
Product content declaration of AFSC5G35D37T2
上次修订 Last Revision (GMT):
Sunday, 29 August 2021, 10:48:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
电容器
Capacitor 1
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 2
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 3
电容器
Capacitor
OOOOOO
电容器
Capacitor 4
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 5
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
电感
Inductor 1
电感
Inductor
OOOOOO
电感
Inductor 2
电感
Inductor
OOOOOO
电感
Inductor 3
电感
Inductor
OOOOOO
电感
Inductor 4
电感
Inductor
OOOOOO
电感
Inductor 5
电感
Inductor
OOOOOO
电感
Inductor 6
电感
Inductor
OOOOOO
电阻
Resistor
陶瓷的
Ceramic
OOOOOO

导体
Conductor
OOOOOO

电极
Electrode
OOOOOO

绝缘
Insulation
OOOOOO

镀镍层
Nickel Plating
OOOOOO

防护涂料
Protective Coating
OOOOOO

电阻层
Resistive Layer
XOOOOO

终端材料
Termination
OOOOOO

镀锡
Tin Plating
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of AFSC5G35D37T2Last Revision (GMT):
Sunday, 29 August 2021, 10:48:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Capacitor 1CERAMICTest Report
15 Jan 2021
Test Report
15 Jan 2021
Test Report
15 Jan 2021
Test Report
15 Jan 2021
INNER ELECTRODETest Report
5 Nov 2020
Test Report
5 Nov 2020
Test Report
5 Nov 2020
Test Report
5 Nov 2020
NI PLATINGTest Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
21 Jun 2019
Test Report
21 Jun 2019
OUTER ELECTRODETest Report
9 Nov 2020
Test Report
9 Nov 2020
Test Report
9 Nov 2020
Test Report
9 Nov 2020
SN PLATINGTest Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
12 Jun 2020
Capacitor 2Not AvailableNot AvailableNot AvailableNot Available
Capacitor 3Not AvailableNot AvailableNot AvailableNot Available
Capacitor 4Not AvailableNot AvailableNot AvailableNot Available
Capacitor 5Not AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
3 Mar 2021
Test Report
3 Mar 2021
Test Report
3 Mar 2021
Test Report
3 Mar 2021
Epoxy AdhesiveTest Report
16 Apr 2021
Test Report
16 Apr 2021
Test Report
16 Apr 2021
Test Report
16 Apr 2021
Inductor 1ELECTRODETest Report
16 Jul 2020
Test Report
16 Jul 2020
Test Report
18 Jul 2020
Test Report
18 Jul 2020
GLAZE (BB)Test Report
14 Oct 2020
Test Report
14 Oct 2020
Test Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Test Report
27 Nov 2020
Test Report
27 Nov 2020
Test Report
27 Nov 2020
Test Report
27 Nov 2020
Inductor 2Not AvailableNot AvailableNot AvailableNot Available
Inductor 3Not AvailableNot AvailableNot AvailableNot Available
Inductor 4Not AvailableNot AvailableNot AvailableNot Available
Inductor 5Not AvailableNot AvailableNot AvailableNot Available
Inductor 6Not AvailableNot AvailableNot AvailableNot Available
ResistorALUMINATest Report
17 Nov 2017
Test Report
17 Nov 2017
Test Report
17 Nov 2017
Test Report
17 Nov 2017
BOTTOM CONDUCTORTest Report
7 Jun 2017
Test Report
7 Jun 2017
Test Report
7 Jun 2017
Test Report
7 Jun 2017
INSULATION - 1ST OVERCOATTest Report
7 Jun 2017
Test Report
7 Jun 2017
Test Report
7 Jun 2017
Test Report
7 Jun 2017
INSULATION - 2ND OVERCOATTest Report
7 Jun 2017
Test Report
7 Jun 2017
Test Report
7 Jun 2017
Test Report
7 Jun 2017
RESISTIVE LAYERTest Report
17 Nov 2017
Test Report
17 Nov 2017
Test Report
17 Nov 2017
Test Report
17 Nov 2017
TERMINAL CONDUCTORTest Report
17 Nov 2017
Test Report
17 Nov 2017
Test Report
17 Nov 2017
Test Report
17 Nov 2017
TOP CONDUCTORTest Report
7 Jul 2017
Test Report
7 Jul 2017
Test Report
7 Jul 2017
Test Report
7 Jul 2017
Semiconductor Die 1Test Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
Semiconductor Die 2Test Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
Solder FluxTest Report
6 Nov 2019
Test Report
6 Nov 2019
Not AvailableNot Available
Solder PasteTest Report
15 Feb 2020
Test Report
15 Feb 2020
Test Report
15 Feb 2020
Test Report
15 Feb 2020
Substrate, Pre-plated NiAuAUS SR1Test Report
31 May 2021
Test Report
31 May 2021
Test Report
31 May 2021
Test Report
31 May 2021
COPPER FOILTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
E705G SERIESTest Report
9 Apr 2020
Test Report
9 Apr 2020
Test Report
9 Apr 2020
Test Report
28 Apr 2018
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.