MC32PF1510A3EP

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of MC32PF1510A3EPLast Revision (GMT):
Sunday, 07 March 2021, 12:24:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC32PF1510A3EPSOT1369-4HVQFN4059.980191 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 717 155572018-07-1163 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-81.64153496.5500002.736794
Gold and its compoundsGold, metal7440-57-50.0059510.3500000.009921
Palladium and its compoundsPalladium, metal7440-05-30.0527063.1000000.087872
Subtotal1.700191100.00000002.834588
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-86.41256097.16000010.691130
Iron and its compoundsIron, metal7439-89-60.1511402.2900000.251983
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0019800.0300000.003301
Silver and its compoundsSilver, metal7440-22-40.0244200.3700000.040713
Zinc and its compoundsZinc, metal7440-66-60.0099000.1500000.016505
Subtotal6.600000100.000000011.003633
Die EncapsulantDie EncapsulantInorganic Silicon compoundsSilica, vitreous60676-86-039.41810089.00000065.718530
Inorganic Silicon compoundsSilicon dioxide7631-86-93.5432008.0000005.907284
Inorganic compoundsCarbon Black1333-86-41.3287003.0000002.215231
Subtotal44.290000100.000000073.841045
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsOther Epoxy resins0.07900010.0000000.131710
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0240003.0380000.040014
Polymers2-Propenenitrile, polymer with 1,3-butadiene, carboxy-terminated, polymers with bisphenol A and epichlorohydrin68610-41-30.68700086.9620001.145378
Subtotal0.790000100.00000001.317101
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped6.46800098.00000010.783560
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1320002.0000000.220073
Subtotal6.600000100.000000011.003633
Total59.980191100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC32PF1510A3EP
Product content declaration of MC32PF1510A3EP
上次修订 Last Revision (GMT):
Sunday, 07 March 2021, 12:24:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC32PF1510A3EPLast Revision (GMT):
Sunday, 07 March 2021, 12:24:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Copper Lead-Frame, Pre-Plated NiPdAuNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
27 Jan 2021
Test Report
27 Jan 2021
Test Report
27 Jan 2021
Test Report
27 Jan 2021
Epoxy AdhesiveTest Report
30 Jun 2020
Test Report
30 Jun 2020
Test Report
30 Jun 2020
Test Report
30 Jun 2020
Semiconductor DieTest Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.