MIMXRT1052CVJ5B

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of MIMXRT1052CVJ5B
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
MIMXRT1052CVJ5BSOT1968-1LFBGA196381.903802 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 760 045572019-10-2473 | 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding WireCopper and its compoundsCopper, metal7440-50-80.98473098.1000000.257848
Gold and its compoundsGold, metal7440-57-50.0010040.1000000.000263
Palladium and its compoundsPalladium, metal7440-05-30.0180681.8000000.004731
Subtotal1.003802100.00000000.262842
Die EncapsulantEpoxy ResinsOther Epoxy resins11.2500006.0000002.945768
Inorganic Silicon compoundsSilica, vitreous60676-86-0161.25000086.00000042.222675
Inorganic compoundsCarbon Black1333-86-41.8750001.0000000.490961
Inorganic compoundsOther inorganic compounds3.7500002.0000000.981923
Phenols and Phenolic ResinsOther phenolic resins9.3750005.0000002.454807
Subtotal187.500000100.000000049.096133
Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.12000060.0000000.031421
Organic Silicon compounds3-(trimethoxysilyl)propyl methacrylate2530-85-00.0100005.0000000.002619
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0100005.0000000.002619
Organic compoundsOther Bismaleimides0.04000020.0000000.010474
Polymers1-Methoxy-2-propyl acetate108-65-60.02000010.0000000.005237
Subtotal0.200000100.00000000.052369
Semiconductor DieInorganic Silicon compoundsSilicon, doped6.86000098.0000001.796264
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1400002.0000000.036658
Subtotal7.000000100.00000001.832922
Solder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0016320.0032000.000427
Antimony and its compoundsAntimony, metal7440-36-00.0063750.0125000.001669
Arsenic and its compoundsArsenic, metal7440-38-20.0038250.0075000.001002
Bismuth and its compoundsBismuth, metal7440-69-90.0095880.0188000.002511
Cadmium and its compoundsCadmium, metal7440-43-90.0006630.0013000.000174
Copper and its compoundsCopper, metal7440-50-80.0032130.0063000.000841
Gold and its compoundsGold, metal7440-57-50.0032130.0063000.000841
Indium and its compoundsIndium, metal7440-74-60.0032130.0063000.000841
Inorganic compoundsSulfur7704-34-90.0005100.0010000.000133
Iron and its compoundsIron, metal7439-89-60.0063750.0125000.001669
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0159630.0313000.004180
Nickel and its compoundsNickel, metal7440-02-00.0016320.0032000.000427
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0032130.0063000.000841
Silver and its compoundsSilver, metal7440-22-41.7851023.5002000.467422
Tin and its compoundsTin, metal7440-31-549.15451496.38140012.870915
Zinc and its compoundsZinc, metal7440-66-60.0009690.0019000.000254
Subtotal51.000000100.000000013.354148
SubstrateAcrylatesProprietary Material-Other acrylates8.4809616.2729002.220706
Barium and its compoundsBarium sulfate7727-43-77.2694345.3768001.903472
Copper and its compoundsCopper, metal7440-50-857.08738942.22440014.948107
Cyanide compoundsPhthalocyanine Blue57455-37-50.1333070.0986000.034906
Inorganic Silicon compoundsFibrous-glass-wool65997-17-326.36210719.4986006.902813
Inorganic Silicon compoundsSilica, vitreous60676-86-00.2422780.1792000.063440
Inorganic Silicon compoundsSilicon dioxide7631-86-93.0755302.2748000.805315
Magnesium and its compoundsTalc14807-96-60.7269700.5377000.190354
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.9328800.6900000.244271
Organic compoundsProprietary Material-Other organic compounds.0.1333070.0986000.034906
PolymersOther acrylic resins30.75583722.7484008.053294
Subtotal135.200000100.000000035.401585
Total381.903802100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MIMXRT1052CVJ5B
产品内容声明 MIMXRT1052CVJ5B
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire
焊线
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - Lead Free
焊锡球-无铅
OOOOOO
Substrate
基板
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MIMXRT1052CVJ5B
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding WireTest Report
18 Feb 2019
Test Report
18 Feb 2019
Test Report
18 Feb 2019
Test Report
18 Feb 2019
Die EncapsulantTest Report
22 Mar 2019
Test Report
22 Mar 2019
Test Report
22 Mar 2019
Test Report
22 Mar 2019
Epoxy AdhesiveTest Report
25 Sep 2019
Test Report
25 Sep 2019
Test Report
18 Oct 2018
Not Available
Semiconductor DieTest Report
29 Mar 2019
Test Report
29 Mar 2019
Test Report
29 Mar 2019
Test Report
29 Mar 2019
Solder Ball - Lead FreeNot AvailableNot AvailableNot AvailableNot Available
SubstrateNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.