MIMXRT1052DVJ6B

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of MIMXRT1052DVJ6B
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
MIMXRT1052DVJ6BSOT1968-1LFBGA196247.703802 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 760 055572019-09-236Not ApplicableNot ApplicableNot ApplicableNot ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding WireCopper and its compoundsCopper, metal7440-50-80.98473098.1000000.397543
Gold and its compoundsGold, metal7440-57-50.0010040.1000000.000405
Palladium and its compoundsPalladium, metal7440-05-30.0180681.8000000.007294
Subtotal1.003802100.00000000.405243
Die EncapsulantEpoxy ResinsOther Epoxy resins11.2500006.0000004.541715
Inorganic Silicon compoundsSilica, vitreous60676-86-0161.25000086.00000065.097911
Inorganic compoundsCarbon Black1333-86-41.8750001.0000000.756953
Inorganic compoundsOther inorganic compounds3.7500002.0000001.513905
Phenols and Phenolic ResinsOther phenolic resins9.3750005.0000003.784762
Subtotal187.500000100.000000075.695245
Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.12000060.0000000.048445
Organic Silicon compounds3-(trimethoxysilyl)propyl methacrylate2530-85-00.0100005.0000000.004037
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0100005.0000000.004037
Organic compoundsOther Bismaleimides0.04000020.0000000.016148
Polymers1-Methoxy-2-propyl acetate108-65-60.02000010.0000000.008074
Subtotal0.200000100.00000000.080742
Semiconductor DieInorganic Silicon compoundsSilicon, doped6.86000098.0000002.769437
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1400002.0000000.056519
Subtotal7.000000100.00000002.825956
Solder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0016320.0032000.000659
Antimony and its compoundsAntimony, metal7440-36-00.0063750.0125000.002574
Arsenic and its compoundsArsenic, metal7440-38-20.0038250.0075000.001544
Bismuth and its compoundsBismuth, metal7440-69-90.0095880.0188000.003871
Cadmium and its compoundsCadmium, metal7440-43-90.0006630.0013000.000268
Copper and its compoundsCopper, metal7440-50-80.0032130.0063000.001297
Gold and its compoundsGold, metal7440-57-50.0032130.0063000.001297
Indium and its compoundsIndium, metal7440-74-60.0032130.0063000.001297
Inorganic compoundsSulfur7704-34-90.0005100.0010000.000206
Iron and its compoundsIron, metal7439-89-60.0063750.0125000.002574
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0159630.0313000.006444
Nickel and its compoundsNickel, metal7440-02-00.0016320.0032000.000659
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0032130.0063000.001297
Silver and its compoundsSilver, metal7440-22-41.7851023.5002000.720660
Tin and its compoundsTin, metal7440-31-549.15451496.38140019.844069
Zinc and its compoundsZinc, metal7440-66-60.0009690.0019000.000391
Subtotal51.000000100.000000020.589107
SubstrateAcrylatesProprietary Material-Other acrylates0.0627296.2729000.025324
Barium and its compoundsBarium sulfate7727-43-70.0537685.3768000.021707
Copper and its compoundsCopper, metal7440-50-80.42224442.2244000.170463
Cyanide compoundsPhthalocyanine Blue57455-37-50.0009860.0986000.000398
Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.19498619.4986000.078717
Inorganic Silicon compoundsSilica, vitreous60676-86-00.0017920.1792000.000723
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0227482.2748000.009184
Magnesium and its compoundsTalc14807-96-60.0053770.5377000.002171
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0069000.6900000.002786
Organic compoundsProprietary Material-Other organic compounds.0.0009860.0986000.000398
PolymersOther acrylic resins0.22748422.7484000.091837
Subtotal1.000000100.00000000.403708
Total247.703802100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MIMXRT1052DVJ6B
产品内容声明 MIMXRT1052DVJ6B
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire
焊线
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - Lead Free
焊锡球-无铅
OOOOOO
Substrate
基板
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MIMXRT1052DVJ6B
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding WireTest Report
18 Feb 2019
Test Report
18 Feb 2019
Test Report
18 Feb 2019
Test Report
18 Feb 2019
Die EncapsulantTest Report
22 Mar 2019
Test Report
22 Mar 2019
Test Report
22 Mar 2019
Test Report
22 Mar 2019
Epoxy AdhesiveTest Report
25 Sep 2019
Test Report
25 Sep 2019
Test Report
18 Oct 2018
Not Available
Semiconductor DieTest Report
29 Mar 2019
Test Report
29 Mar 2019
Test Report
29 Mar 2019
Test Report
29 Mar 2019
Solder Ball - Lead FreeNot AvailableNot AvailableNot AvailableNot Available
SubstrateNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.