FS32K116LAT0MFMT

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of FS32K116LAT0MFMTLast Revision (GMT):
Tuesday, 08 December 2020, 07:56:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FS32K116LAT0MFMTSOT617-3HVQFN3293.091257 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 787 095572020-06-0973 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-80.14974499.0000000.160858
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0015131.0000000.001625
Subtotal0.151257100.00000000.162483
Copper Lead-FrameCopper Lead-FrameCopper and its compoundsCopper, metal7440-50-821.93075097.47000023.558335
Iron and its compoundsIron, metal7439-89-60.5400002.4000000.580076
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0067500.0300000.007251
Zinc and its compoundsZinc, metal7440-66-60.0225000.1000000.024170
Subtotal22.500000100.000000024.169832
Die EncapsulantDie EncapsulantEpoxy ResinsOther Epoxy resins0.7800001.5600000.837888
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-61.8200003.6400001.955071
Inorganic Silicon compoundsSilica, vitreous60676-86-039.30500078.61000042.222010
Inorganic Silicon compoundsSilicon dioxide7631-86-94.3700008.7400004.694318
Inorganic compoundsCarbon Black1333-86-40.0850000.1700000.091308
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.5550003.1100001.670404
Phenols and Phenolic ResinsOther phenolic resins0.1550000.3100000.166503
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-61.9300003.8600002.073234
Subtotal50.000000100.000000053.710737
Epoxy AdhesiveEpoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.0046333.3094000.004977
AcrylatesProprietary Material-Other acrylates0.0123558.8252000.013272
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.0046333.3094000.004977
Palladium and its compoundsPalladium, metal7440-05-30.0002320.1655000.000249
PolymersProprietary Material-Other polymers0.0023171.6547000.002488
Silver and its compoundsSilver, metal7440-22-40.11583082.7358000.124426
Subtotal0.140000100.00000000.150390
Pre-plating - Precious metal - NiPdAuPre-plating - Precious metal - NiPdAuGold and its compoundsGold, metal7440-57-50.0090001.0000000.009668
Nickel and its compoundsNickel, metal7440-02-00.81900091.0000000.879782
Palladium and its compoundsPalladium, metal7440-05-30.0720008.0000000.077343
Subtotal0.900000100.00000000.966793
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped19.01200098.00000020.422971
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3880002.0000000.416795
Subtotal19.400000100.000000020.839766
Total93.091257100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FS32K116LAT0MFMT
Product content declaration of FS32K116LAT0MFMT
上次修订 Last Revision (GMT):
Tuesday, 08 December 2020, 07:56:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
铜引线框架
Copper Lead-Frame
铜引线框架
Copper Lead-Frame
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FS32K116LAT0MFMTLast Revision (GMT):
Tuesday, 08 December 2020, 07:56:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuNot AvailableNot AvailableNot AvailableNot Available
Copper Lead-FrameNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantNot AvailableNot AvailableNot AvailableNot Available
Epoxy AdhesiveNot AvailableNot AvailableNot AvailableNot Available
Pre-plating - Precious metal - NiPdAuNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.