MIMX8QX1AVLFZAC

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of MIMX8QX1AVLFZAC
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MIMX8QX1AVLFZACSOT1916FBGA6093081.498000 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 805 275572020-06-2153 | 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Die EncapsulantAluminum and its compoundsAluminum, metal7429-90-58.71200072.0000000.282720
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones1.21000010.0000000.039267
Zinc and its compoundsZinc oxide1314-13-22.17800018.0000000.070680
Subtotal12.100000100.00000000.392666
Epoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-722.80000040.0000000.739900
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-68.55000015.0000000.277463
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-225.65000045.0000000.832387
Subtotal57.000000100.00000001.849750
Heat SpreaderCopper and its compoundsCopper, metal7440-50-81844.95300098.45000059.871952
Nickel and its compoundsNickel, metal7440-02-029.0470001.5500000.942626
Subtotal1874.000000100.000000060.814578
Semiconductor DieInorganic Silicon compoundsSilicon7440-21-3117.69800098.0000003.819506
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.4020002.0000000.077949
Subtotal120.100000100.00000003.897455
Solder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-45.2955003.5000000.171848
Tin and its compoundsTin, metal7440-31-5146.00450096.5000004.738101
Subtotal151.300000100.00000004.909950
SubstrateAluminum and its compoundsAluminum Hydroxide21645-51-2127.03830414.8949004.122615
Barium and its compoundsBarium sulfate7727-43-75.0158930.5881000.162774
Copper and its compoundsCopper, metal7440-50-8415.96176648.77040013.498687
Epoxy ResinsEpikote 86228064-14-468.4041258.0202002.219834
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-57.1336390.8364000.231499
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3130.29552215.2768004.228318
Inorganic Silicon compoundsSilica, vitreous60676-86-03.5830250.4201000.116275
Inorganic Silicon compoundsSilicon dioxide7631-86-924.9677362.9274000.810247
Organic compounds3-methoxy-3-methyl-1-butyl acetate103429-90-94.6585290.5462000.151177
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-67.1310800.8361000.231416
PolymersOther polymers47.1507605.5283001.530125
Silver and its compoundsSilver, metal7440-22-40.3488350.0409000.011320
Tin and its compoundsTin, metal7440-31-511.2087851.3142000.363745
Subtotal852.898000100.000000027.678032
UnderfillInorganic Silicon compoundsSilica, vitreous60676-86-08.46000060.0000000.274542
Inorganic compoundsCarbon Black1333-86-40.0141000.1000000.000458
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1269000.9000000.004118
PolymersPlastic: EP - Epoxide, Epoxy5.49900039.0000000.178452
Subtotal14.100000100.00000000.457570
Total3081.498000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MIMX8QX1AVLFZAC
产品内容声明 MIMX8QX1AVLFZAC
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Heat Spreader
散热片
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - Lead Free
焊锡球-无铅
OOOOOO
Substrate
基板
OOOOOO
Underfill
底注
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MIMX8QX1AVLFZAC
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
23 Nov 2018
Test Report
23 Nov 2018
Test Report
23 Nov 2018
Test Report
23 Nov 2018
Epoxy AdhesiveTest Report
9 Mar 2020
Test Report
9 Mar 2020
Test Report
9 Mar 2020
Test Report
9 Mar 2020
Heat SpreaderCUTest Report
26 Jun 2019
Test Report
26 Jun 2019
Test Report
26 Jun 2019
Test Report
26 Jun 2019
NI PLATINGTest Report
11 Jul 2019
Test Report
11 Jul 2019
Test Report
11 Jul 2019
Test Report
11 Jul 2019
Semiconductor DieTest Report
5 Apr 2019
Test Report
5 Apr 2019
Test Report
5 Apr 2019
Test Report
5 Apr 2019
Solder Ball - Lead FreeTest Report
3 Jan 2019
Test Report
3 Jan 2019
Test Report
3 Jan 2019
Test Report
3 Jan 2019
SubstrateAUS 308Test Report
20 Aug 2018
Test Report
20 Aug 2018
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
15 Feb 2019
Test Report
15 Feb 2019
CU FOILTest Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
E700GRTest Report
22 Jan 2019
Test Report
22 Jan 2019
Test Report
14 Jan 2020
Test Report
14 Jan 2020
GX-13Test Report
13 Sep 2019
Test Report
13 Sep 2019
Test Report
13 Sep 2019
Test Report
13 Sep 2019
PHP-900 IR-6Test Report
19 Aug 2019
Not AvailableTest Report
18 Aug 2019
Not Available
UnderfillTest Report
10 Mar 2020
Test Report
10 Mar 2020
Test Report
10 Mar 2020
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.