TJA1124CHG/0Z

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of TJA1124CHG/0Z
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
TJA1124CHG/0ZSOT815-1DHVQFN2450.241229 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 859 944312019-10-2521 | Unlimited26030 sec.1 | Unlimited24020 sec.3Bangkok, Thailand
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - CuCopper and its compoundsCopper, metal7440-50-80.05922399.9900000.117877
Organic Phosphorus compoundsOther organic phosphorous compounds0.0000060.0100000.000012
Subtotal0.059229100.00000000.117889
Copper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-818.51930097.47000036.860762
Iron and its compoundsIron, metal7439-89-60.4560002.4000000.907621
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0057000.0300000.011345
Zinc and its compoundsZinc, metal7440-66-60.0190000.1000000.037817
Subtotal19.000000100.000000037.817546
Die EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins1.6200006.0000003.224443
Inorganic Silicon compoundsSilica, vitreous60676-86-023.13900085.70000046.055800
Inorganic Silicon compoundsSilicon dioxide7631-86-91.4850005.5000002.955740
Inorganic compoundsCarbon Black1333-86-40.0810000.3000000.161222
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.6750002.5000001.343518
Subtotal27.000000100.000000053.740724
Epoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.0066193.3094000.013174
AcrylatesProprietary Material-Other acrylates0.0176508.8252000.035131
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.0066193.3094000.013174
Palladium and its compoundsPalladium, metal7440-05-30.0003310.1655000.000659
PolymersProprietary Material-Other polymers0.0033091.6547000.006587
Silver and its compoundsSilver, metal7440-22-40.16547282.7358000.329354
Subtotal0.200000100.00000000.398079
Pre-plating - Precious metal - OtherGold and its compoundsGold, metal7440-57-50.0120003.0000000.023885
Nickel and its compoundsNickel, metal7440-02-00.36920092.3000000.734855
Palladium and its compoundsPalladium, metal7440-05-30.0124003.1000000.024681
Silver and its compoundsSilver, metal7440-22-40.0064001.6000000.012738
Subtotal0.400000100.00000000.796159
Semiconductor DieInorganic Silicon compoundsSilicon7440-21-33.51036098.0000006.987011
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0716402.0000000.142592
Subtotal3.582000100.00000007.129603
Total50.241229100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of TJA1124CHG/0Z
产品内容声明 TJA1124CHG/0Z
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Cu
焊丝-铜
OOOOOO
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Pre-plating - Precious metal - Other
预电镀-贵金属-其它
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of TJA1124CHG_0Z
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Copper Lead-Frame, Pre-Plated NiPdAuTest Report
1 Feb 2019
Test Report
1 Feb 2019
Test Report
1 Feb 2019
Test Report
1 Feb 2019
Die EncapsulantTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Epoxy AdhesiveTest Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Pre-plating - Precious metal - OtherNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.