K32L3A60VPJ1AT

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of K32L3A60VPJ1ATLast Revision (GMT):
Wednesday, 16 December 2020, 11:15:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
K32L3A60VPJ1ATSOT1850VFBGA176130.578350 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 860 445572020-06-2633 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.06901398.1000000.052852
Gold and its compoundsGold, metal7440-57-50.0000700.1000000.000054
Palladium and its compoundsPalladium, metal7440-05-30.0012661.8000000.000970
Subtotal0.070350100.00000000.053876
Die EncapsulantDie EncapsulantAcrylonitrile compoundsAcrylonitrile/Butadiene copolymer, carboxyl terminated (26/74)68891-46-30.0308000.0500000.023587
Aluminum and its compoundsProprietary Material-Other aluminum compounds0.6160001.0000000.471747
Epoxy ResinsProprietary Material-Other Epoxy resins3.0800005.0000002.358737
Inorganic Silicon compoundsSilica, vitreous60676-86-042.78120069.45000032.762859
Inorganic Silicon compoundsSilicon dioxide7631-86-912.32000020.0000009.434948
Inorganic compoundsCarbon Black1333-86-40.3080000.5000000.235874
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins2.4640004.0000001.886990
Subtotal61.600000100.000000047.174742
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.11000010.0000000.084241
Inorganic Silicon compoundsSilicon dioxide7631-86-90.27500025.0000000.210601
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.33000030.0000000.252722
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.27500025.0000000.210601
PolymersAcrylic acid ester copolymer78506-70-40.11000010.0000000.084241
Subtotal1.100000100.00000000.842406
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped10.48600098.0000008.030428
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2140002.0000000.163886
Subtotal10.700000100.00000008.194314
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0960400.5000000.073550
Silver and its compoundsSilver, metal7440-22-40.1920801.0000000.147099
Tin and its compoundsTin, metal7440-31-518.91988098.50000014.489293
Subtotal19.208000100.000000014.709942
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAromatic amines and their saltsOther aromatic amines and their salts0.0112560.0297000.008620
Aromatic hydrocarbon compounds1,2,4-Trimethylbenzene95-63-60.0033730.0089000.002583
Aromatic hydrocarbon compoundsOther Aromatic carbonyl compounds0.0710630.1875000.054421
Barium and its compoundsBarium sulfate7727-43-70.3791521.0004000.290363
Copper and its compoundsCopper phthalocyanine147-14-80.0033730.0089000.002583
Copper and its compoundsCopper, metal7440-50-817.66162746.60060013.525693
Epoxy ResinsOther Epoxy resins1.6132894.2567001.235495
Epoxy ResinsProprietary Material-Other Epoxy resins1.2076083.1863000.924815
Gold and its compoundsGold, metal7440-57-50.8976242.3684000.687422
Inorganic Silicon compoundsFibrous-glass-wool65997-17-37.17018718.9187005.491100
Inorganic Silicon compoundsSilicon dioxide7631-86-91.2665043.3417000.969919
Magnesium and its compoundsTalc14807-96-60.1909780.5039000.146256
Nickel and its compoundsNickel, metal7440-02-07.00494318.4827005.364552
Organic compounds3-methoxy-3-methyl-1-butyl acetate103429-90-90.4156491.0967000.318314
Organic compoundsQuinacridone pigment1047-16-10.0033730.0089000.002583
Subtotal37.900000100.000000029.024720
Total130.578350100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 K32L3A60VPJ1AT
Product content declaration of K32L3A60VPJ1AT
上次修订 Last Revision (GMT):
Wednesday, 16 December 2020, 11:15:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of K32L3A60VPJ1ATLast Revision (GMT):
Wednesday, 16 December 2020, 11:15:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantNot AvailableNot AvailableNot AvailableNot Available
Epoxy AdhesiveNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.