K32L2B21VMP0A

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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Product content declaration of K32L2B21VMP0A
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
K32L2B21VMP0ASOT1555-1LFBGA6465.292755 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 928 385572020-04-1333 | 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - CuCopper and its compoundsCopper, metal7440-50-80.77601597.0000001.188516
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0240003.0000000.036758
Subtotal0.800015100.00000001.225274
Die EncapsulantAluminum and its compoundsOther aluminum compounds0.9000003.0000001.378407
Epoxy ResinsOther Non-halogenated Epoxy resins1.5000005.0000002.297345
Inorganic Silicon compoundsSilica, vitreous60676-86-025.50000085.00000039.054869
Inorganic compoundsCarbon Black1333-86-40.3000001.0000000.459469
Phenols and Phenolic ResinsOther phenolic resins0.9000003.0000001.378407
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.9000003.0000001.378407
Subtotal30.000000100.000000045.946905
Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.66000060.0000001.010832
Organic Silicon compounds3-(trimethoxysilyl)propyl methacrylate2530-85-00.0550005.0000000.084236
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0550005.0000000.084236
Organic compoundsOther Bismaleimides0.22000020.0000000.336944
Polymers1-Methoxy-2-propyl acetate108-65-60.11000010.0000000.168472
Subtotal1.100000100.00000001.684720
Semiconductor DieInorganic Silicon compoundsSilicon, doped6.27958598.0000009.617584
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1281552.0000000.196277
Subtotal6.407740100.00000009.813861
Solder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0349250.5000000.053490
Silver and its compoundsSilver, metal7440-22-40.0698501.0000000.106980
Tin and its compoundsTin, metal7440-31-56.88022598.50000010.537501
Subtotal6.985000100.000000010.697971
Substrate, Pre-plated NiAuAcrylonitrile compoundsAcrylonitrile/Butadiene copolymer, carboxyl terminated (26/74)68891-46-30.1744400.8722000.267166
Barium and its compoundsBarium sulfate7727-43-71.6154408.0772002.474149
Copper and its compoundsCopper, metal7440-50-87.26518036.32590011.127085
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-53.52824017.6412005.403724
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-61.1308005.6540001.731892
Gold and its compoundsGold, metal7440-57-50.0957800.4789000.146693
Inorganic Silicon compoundsFibrous-glass-wool65997-17-33.35096016.7548005.132208
Inorganic Silicon compoundsSilicon7440-21-30.0214400.1072000.032837
Nickel and its compoundsNickel, metal7440-02-00.9749804.8749001.493244
PolymersOther acrylic resins1.1050805.5254001.692500
PolymersOther acrylic/epoxy resin mixture0.7376603.6883001.129773
Subtotal20.000000100.000000030.631270
Total65.292755100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of K32L2B21VMP0A
产品内容声明 K32L2B21VMP0A
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Cu
焊丝-铜
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
OOOOOO
Substrate, Pre-plated NiAu
基板,镍金预镀
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of K32L2B21VMP0A
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
3 Jun 2019
Test Report
3 Jun 2019
Test Report
3 Jun 2019
Test Report
3 Jun 2019
Die EncapsulantTest Report
18 Jul 2019
Test Report
18 Jul 2019
Test Report
18 Jul 2019
Test Report
18 Jul 2019
Epoxy AdhesiveTest Report
25 Sep 2019
Test Report
25 Sep 2019
Test Report
29 Sep 2019
Not Available
Semiconductor DieTest Report
10 Sep 2019
Test Report
10 Sep 2019
Test Report
10 Sep 2019
Not Available
Solder Ball - SAC, Lead FreeTest Report
20 Feb 2019
Test Report
20 Feb 2019
Test Report
20 Feb 2019
Test Report
5 Sep 2018
Substrate, Pre-plated NiAuAUS308Test Report
15 Feb 2019
Test Report
15 Feb 2019
Test Report
15 Feb 2019
Test Report
15 Feb 2019
COPPER FOILTest Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
CU PLATINGTest Report
8 Aug 2019Test Report
3 Jul 2018
Test Report
8 Aug 2019Test Report
3 Jul 2018
Test Report
8 Aug 2019Test Report
3 Jul 2018
Test Report
8 Aug 2019Test Report
3 Jul 2018
E679FG SERIESTest Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
NI PLATINGTest Report
3 Jan 2019
Test Report
3 Jan 2019
Test Report
3 Jan 2019
Test Report
3 Jan 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.