FS32R294KCK0MJDR

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of FS32R294KCK0MJDRLast Revision (GMT):
Wednesday, 18 August 2021, 06:50:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FS32R294KCK0MJDRSOT1989LFBGA269494.882013 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 975 565182021-03-0963 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.12441597.8873000.227209
Gold and its compoundsGold, metal7440-57-50.0020230.1761000.000409
Palladium and its compoundsPalladium, metal7440-05-30.0222451.9366000.004495
Subtotal1.148683100.00000000.232113
Die EncapsulantDie EncapsulantEpoxy ResinsOther Epoxy resins17.0520006.0000003.445670
Inorganic Silicon compoundsSilica, vitreous60676-86-0244.41200086.00000049.387934
Inorganic compoundsCarbon Black1333-86-42.8420001.0000000.574278
Inorganic compoundsOther inorganic compounds5.6840002.0000001.148557
Phenols and Phenolic ResinsOther phenolic resins14.2100005.0000002.871392
Subtotal284.200000100.000000057.427830
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.85500045.0000000.172768
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0001900.0100000.000038
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0950005.0000000.019196
PolymersPlastic: EP - Epoxide, Epoxy0.94981049.9900000.191927
Subtotal1.900000100.00000000.383930
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-317.08466398.0000003.452270
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3486672.0000000.070455
Subtotal17.433330100.00000003.522724
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0021820.0032000.000441
Antimony and its compoundsAntimony, metal7440-36-00.0085250.0125000.001723
Arsenic and its compoundsArsenic, metal7440-38-20.0051150.0075000.001034
Bismuth and its compoundsBismuth, metal7440-69-90.0128220.0188000.002591
Cadmium and its compoundsCadmium, metal7440-43-90.0008870.0013000.000179
Copper and its compoundsCopper, metal7440-50-80.0042970.0063000.000868
Gold and its compoundsGold, metal7440-57-50.0042970.0063000.000868
Indium and its compoundsIndium, metal7440-74-60.0042970.0063000.000868
Inorganic compoundsSulfur7704-34-90.0006820.0010000.000138
Iron and its compoundsIron, metal7439-89-60.0085250.0125000.001723
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0213470.0313000.004313
Nickel and its compoundsNickel, metal7440-02-00.0021820.0032000.000441
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0042970.0063000.000868
Silver and its compoundsSilver, metal7440-22-42.3871363.5002000.482365
Tin and its compoundsTin, metal7440-31-565.73211596.38140013.282381
Zinc and its compoundsZinc, metal7440-66-60.0012960.0019000.000262
Subtotal68.200000100.000000013.781063
SubstrateSubstrateBarium and its compoundsBarium sulfate7727-43-76.0583984.9659001.224211
Copper and its compoundsCopper, metal7440-50-817.69622214.5051003.575847
Gold and its compoundsGold, metal7440-57-50.4163860.3413000.084138
Inorganic Silicon compoundsFibrous-glass-wool65997-17-326.58184821.7884005.371351
Inorganic Silicon compoundsSilica, vitreous60676-86-04.9840664.0853001.007122
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1249280.1024000.025244
Magnesium and its compoundsTalc14807-96-60.6245180.5119000.126195
Organic compoundsOther organic compounds.0.7494460.6143000.151439
PolymersPlastic: EP - Epoxide, Epoxy4.0805343.3447000.824547
PolymersPlastic: PAK9.1812327.5256001.855237
PolymersPlastic: PI - Polyimide51.50242242.21510010.407010
Subtotal122.000000100.000000024.652341
Total494.882013100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FS32R294KCK0MJDR
Product content declaration of FS32R294KCK0MJDR
上次修订 Last Revision (GMT):
Wednesday, 18 August 2021, 06:50:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FS32R294KCK0MJDRLast Revision (GMT):
Wednesday, 18 August 2021, 06:50:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
22 Apr 2021
Test Report
22 Apr 2021
Test Report
22 Apr 2021
Test Report
22 Apr 2021
Die EncapsulantTest Report
24 Apr 2020
Test Report
24 Apr 2020
Test Report
24 Apr 2020
Test Report
24 Apr 2020
Epoxy AdhesiveTest Report
8 Sep 2020
Test Report
8 Sep 2020
Test Report
8 Sep 2020
Not Available
Semiconductor DieTest Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Solder Ball - Lead FreeTest Report
3 Nov 2020
Test Report
3 Nov 2020
Test Report
3 Nov 2020
Test Report
3 Nov 2020
SubstrateAU PLATINGTest Report
16 Jun 2020
Test Report
16 Jun 2020
Test Report
16 Jun 2020
Test Report
16 Jun 2020
AUS 308Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
CU FOILTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
E679FG SERIESNot AvailableTest Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
E67FG SERIESTest Report
14 Jan 2020
Not AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.