LX2120XN71826B

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of LX2120XN71826BLast Revision (GMT):
Monday, 29 March 2021, 09:00:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LX2120XN71826BSOT1848BGA151720292.365000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 025 635572021-01-2693 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-532.51160072.0000000.160216
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones4.51550010.0000000.022252
Zinc and its compoundsZinc oxide1314-13-28.12790018.0000000.040054
Subtotal45.155000100.00000000.222522
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-715.62320040.0000000.076991
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-65.85870015.0000000.028871
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-217.57610045.0000000.086614
Subtotal39.058000100.00000000.192476
Heat SpreaderCopper AlloyCopper and its compoundsCopper, metal7440-50-814014.11236099.90000069.061011
Miscellaneous substancesProprietary Material-Other miscellaneous substances.14.0281400.1000000.069130
Subtotal14028.140500100.000000069.130141
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.2208590.1000000.001088
Nickel and its compoundsNickel, metal7440-02-0220.63864199.9000001.087299
Subtotal220.859500100.00000001.088387
Semiconductor DieSemiconductor DieCopper and its compoundsCopper, metal7440-50-811.8221825.9811000.058259
Inorganic Silicon compoundsSilicon, doped180.51307091.3255000.889562
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.6217061.8323000.017848
Silver and its compoundsSilver, metal7440-22-40.0306370.0155000.000151
Tin and its compoundsTin, metal7440-31-51.6714040.8456000.008237
Subtotal197.659000100.00000000.974056
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-86.3638990.5009000.031361
Silver and its compoundsSilver, metal7440-22-438.1833973.0054000.188166
Tin and its compoundsTin, metal7440-31-51225.94570496.4937006.041414
Subtotal1270.493000100.00000006.260941
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-81810.63591899.9900008.922745
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1810820.0100000.000892
Subtotal1810.817000100.00000008.923637
Solder 1Copper and its compoundsCopper, metal7440-50-80.3075650.5000000.001516
Silver and its compoundsSilver, metal7440-22-41.8453903.0000000.009094
Tin and its compoundsTin, metal7440-31-559.36004596.5000000.292524
Subtotal61.513000100.00000000.303134
Solder 2Copper and its compoundsCopper, metal7440-50-80.0880040.7000000.000434
Tin and its compoundsTin, metal7440-31-512.48399699.3000000.061521
Subtotal12.572000100.00000000.061954
Solder MaskBarium and its compoundsBarium sulfate7727-43-719.83682023.5000000.097755
Inorganic Silicon compoundsSilica, vitreous60676-86-013.08386015.5000000.064477
Miscellaneous substancesProprietary Material-Other miscellaneous substances.4.2206005.0000000.020799
PolymersPlastic: EP - Epoxide, Epoxy47.27072056.0000000.232948
Subtotal84.412000100.00000000.415979
Substrate Build UpEpoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-622.9439005.0000000.113067
Inorganic Silicon compoundsSilicon dioxide7631-86-9298.27070065.0000001.469867
IsocyanatesProprietary Material-Other isocyanate compounds34.4158507.5000000.169600
Miscellaneous substancesProprietary Material-Other miscellaneous substances.11.4719502.5000000.056533
PolymersPlastic: EP - Epoxide, Epoxy91.77560020.0000000.452267
Subtotal458.878000100.00000002.261333
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3804.10512039.0000003.962599
Inorganic Silicon compoundsSilica, vitreous60676-86-0742.25088036.0000003.657784
PolymersPlastic: PI - Polyimide515.45200025.0000002.540128
Subtotal2061.808000100.000000010.160511
UnderfillUnderfillAliphatic AminesProprietary Material-Other aliphatic amines0.0630006.3000000.000311
Aromatic amines and their salts6-methyl-2,4-bis(methylthio)phenylene-1,3-diamine106264-79-30.0210002.1000000.000103
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-60.0350003.5000000.000172
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.19000019.0000000.000936
Inorganic Silicon compoundsSilica, vitreous60676-86-00.67000067.0000000.003302
Inorganic compoundsCarbon Black1333-86-40.0007500.0750000.000004
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0183501.8350000.000090
Phosphorus compoundsTriphenyl phosphine603-35-00.0019000.1900000.000009
Subtotal1.000000100.00000000.004928
Total20292.365000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LX2120XN71826B
Product content declaration of LX2120XN71826B
上次修订 Last Revision (GMT):
Monday, 29 March 2021, 09:00:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
铜合金
Copper Alloy
OOOOOO

镀镍层
Nickel Plating
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊料
Solder 1
OOOOOO

焊料
Solder 2
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LX2120XN71826BLast Revision (GMT):
Monday, 29 March 2021, 09:00:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
30 Sep 2020
Test Report
30 Sep 2020
Test Report
30 Sep 2020
Test Report
30 Sep 2020
Epoxy AdhesiveTest Report
9 Mar 2020
Test Report
9 Mar 2020
Test Report
9 Mar 2020
Test Report
9 Mar 2020
Heat SpreaderCU ALLOYTest Report
22 Jun 2020
Test Report
22 Jun 2020
Test Report
22 Jun 2020
Test Report
22 Jun 2020
NI PLATINGTest Report
22 Jun 2020
Test Report
22 Jun 2020
Test Report
22 Jun 2020
Test Report
22 Jun 2020
Semiconductor DieTest Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Solder Ball - SAC, Lead FreeTest Report
7 Aug 2020
Test Report
7 Aug 2020
Test Report
7 Aug 2020
Test Report
7 Aug 2020
SubstrateABF-GZ41Test Report
26 Aug 2020
Test Report
26 Aug 2020
Test Report
26 Aug 2020
Test Report
26 Aug 2020
CU FOILTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
E705GTest Report
14 Jan 2020
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
14 Jan 2020
SAC 305Test Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
24 Dec 2019
SR7300GR-BTest Report
27 Mar 2020
Test Report
27 Mar 2020
Test Report
27 Mar 2020
Test Report
27 Mar 2020
THP-100DX1Test Report
26 Feb 2020
Test Report
26 Feb 2020
Test Report
26 Feb 2020
Test Report
26 Feb 2020
UnderfillTest Report
10 Apr 2020
Test Report
10 Apr 2020
Test Report
10 Apr 2020
Test Report
10 Apr 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.