LX2160SC72232B

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LX2160SC72232BLast Revision (GMT):
Monday, 29 March 2021, 08:37:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LX2160SC72232BSOT1848BGA151720333.271000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 026 555572020-10-1573 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-532.51160072.0000000.159894
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones4.51550010.0000000.022207
Zinc and its compoundsZinc oxide1314-13-28.12790018.0000000.039973
Subtotal45.155000100.00000000.222074
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-715.62320040.0000000.076836
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-65.85870015.0000000.028813
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-217.57610045.0000000.086440
Subtotal39.058000100.00000000.192089
Heat SpreaderCopper AlloyCopper and its compoundsCopper, metal7440-50-814014.11236099.90000068.922075
Miscellaneous substancesProprietary Material-Other miscellaneous substances.14.0281400.1000000.068991
Subtotal14028.140500100.000000068.991066
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.2208590.1000000.001086
Nickel and its compoundsNickel, metal7440-02-0220.63864199.9000001.085111
Subtotal220.859500100.00000001.086198
Semiconductor DieSemiconductor DieCopper and its compoundsCopper, metal7440-50-811.8221825.9811000.058142
Inorganic Silicon compoundsSilicon, doped180.51307091.3255000.887772
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.6217061.8323000.017812
Silver and its compoundsSilver, metal7440-22-40.0306370.0155000.000151
Tin and its compoundsTin, metal7440-31-51.6714040.8456000.008220
Subtotal197.659000100.00000000.972096
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-86.3638990.5009000.031298
Silver and its compoundsSilver, metal7440-22-438.1833973.0054000.187788
Tin and its compoundsTin, metal7440-31-51225.94570496.4937006.029260
Subtotal1270.493000100.00000006.248346
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-81810.63591899.9900008.904794
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1810820.0100000.000891
Subtotal1810.817000100.00000008.905685
Solder 1Copper and its compoundsCopper, metal7440-50-80.3075650.5000000.001513
Silver and its compoundsSilver, metal7440-22-41.8453903.0000000.009076
Tin and its compoundsTin, metal7440-31-559.36004596.5000000.291936
Subtotal61.513000100.00000000.302524
Solder 2Copper and its compoundsCopper, metal7440-50-80.0880040.7000000.000433
Tin and its compoundsTin, metal7440-31-512.48399699.3000000.061397
Subtotal12.572000100.00000000.061830
Solder MaskBarium and its compoundsBarium sulfate7727-43-719.83682023.5000000.097558
Inorganic Silicon compoundsSilica, vitreous60676-86-013.08386015.5000000.064347
Miscellaneous substancesProprietary Material-Other miscellaneous substances.4.2206005.0000000.020757
PolymersPlastic: EP - Epoxide, Epoxy47.27072056.0000000.232480
Subtotal84.412000100.00000000.415142
Substrate Build UpEpoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-622.9439005.0000000.112839
Inorganic Silicon compoundsSilicon dioxide7631-86-9298.27070065.0000001.466910
IsocyanatesProprietary Material-Other isocyanate compounds34.4158507.5000000.169259
Miscellaneous substancesProprietary Material-Other miscellaneous substances.11.4719502.5000000.056420
PolymersPlastic: EP - Epoxide, Epoxy91.77560020.0000000.451357
Subtotal458.878000100.00000002.256784
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3804.10512039.0000003.954627
Inorganic Silicon compoundsSilica, vitreous60676-86-0742.25088036.0000003.650425
PolymersPlastic: PI - Polyimide515.45200025.0000002.535018
Subtotal2061.808000100.000000010.140071
UnderfillUnderfillAliphatic AminesProprietary Material-Other aliphatic amines2.6400786.3000000.012984
Aromatic amines and their salts6-methyl-2,4-bis(methylthio)phenylene-1,3-diamine106264-79-30.8800262.1000000.004328
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-61.4667103.5000000.007213
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-57.96214019.0000000.039158
Inorganic Silicon compoundsSilica, vitreous60676-86-028.07702067.0000000.138084
Inorganic compoundsCarbon Black1333-86-40.0314290.0750000.000155
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.7689751.8350000.003782
Phosphorus compoundsTriphenyl phosphine603-35-00.0796210.1900000.000392
Subtotal41.906000100.00000000.206096
Total20333.271000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LX2160SC72232B
Product content declaration of LX2160SC72232B
上次修订 Last Revision (GMT):
Monday, 29 March 2021, 08:37:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
铜合金
Copper Alloy
OOOOOO

镀镍层
Nickel Plating
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊料
Solder 1
OOOOOO

焊料
Solder 2
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LX2160SC72232BLast Revision (GMT):
Monday, 29 March 2021, 08:37:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
30 Sep 2020
Test Report
30 Sep 2020
Test Report
30 Sep 2020
Test Report
30 Sep 2020
Epoxy AdhesiveTest Report
9 Mar 2020
Test Report
9 Mar 2020
Test Report
9 Mar 2020
Test Report
9 Mar 2020
Heat SpreaderCU ALLOYTest Report
22 Jun 2020
Test Report
22 Jun 2020
Test Report
22 Jun 2020
Test Report
22 Jun 2020
NI PLATINGTest Report
22 Jun 2020
Test Report
22 Jun 2020
Test Report
22 Jun 2020
Test Report
22 Jun 2020
Semiconductor DieTest Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Solder Ball - SAC, Lead FreeTest Report
7 Aug 2020
Test Report
7 Aug 2020
Test Report
7 Aug 2020
Test Report
7 Aug 2020
SubstrateABF-GZ41Test Report
26 Aug 2020
Test Report
26 Aug 2020
Test Report
26 Aug 2020
Test Report
26 Aug 2020
CU FOILTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
E705GTest Report
14 Jan 2020
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
14 Jan 2020
SAC 305Test Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
24 Dec 2019
SR7300GR-BTest Report
27 Mar 2020
Test Report
27 Mar 2020
Test Report
27 Mar 2020
Test Report
27 Mar 2020
THP-100DX1Test Report
26 Feb 2020
Test Report
26 Feb 2020
Test Report
26 Feb 2020
Test Report
26 Feb 2020
UnderfillTest Report
10 Apr 2020
Test Report
10 Apr 2020
Test Report
10 Apr 2020
Test Report
10 Apr 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.