A2T18S162W31GSR3

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NXP Semiconductors
Product content declaration of A2T18S162W31GSR3Last Revision (GMT):
Thursday, 24 August 2023, 03:59:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
A2T18S162W31GSR3SOT1805-3CFM43545.650189 mg YesYesYesN/ANot Applicablee4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 222 541282023-11-2410NA / Not Available26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-55.73274298.8450000.161684
Inorganic Silicon compoundsSilicon7440-21-30.0666971.1500000.001881
Nickel and its compoundsNickel, metal7440-02-00.0002900.0050000.000008
Subtotal5.799729100.00000000.163573
CapCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1566.46182496.00000015.976247
Inorganic Silicon compoundsSilicon dioxide7631-86-917.7019323.0000000.499258
Inorganic compoundsOther inorganic compounds5.9006441.0000000.166419
Subtotal590.064400100.000000016.641924
EpoxyInorganic Silicon compoundsSilicon dioxide7631-86-99.91602045.0000000.279667
Phenols and Phenolic Resins2-[[4-[2-[4-[1,1-bis[4-(oxiran-2-ylmethoxy)phenyl]ethyl]phenyl]propan-2-yl]phenoxy]methyl]oxirane115254-47-212.11958055.0000000.341815
Subtotal22.035600100.00000000.621483
CapacitorCapacitorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-11.1938783.1063000.033672
Barium and its compoundsBarium titanate12047-27-730.70580279.8921000.866013
Copper and its compoundsCopper, metal7440-50-82.3706156.1680000.066860
Gold and its compoundsGold, metal7440-57-52.4654706.4148000.069535
Manganese and its compoundsManganese dioxide1313-13-90.0388570.1011000.001096
Nickel and its compoundsNickel, metal7440-02-01.2801633.3308000.036105
Tin and its compoundsTin, metal7440-31-50.3793060.9869000.010698
Subtotal38.434090100.00000001.083979
Header Assembly/FlangeCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1164.02369189.4000004.626054
Chromium and Chromium III compoundsDichromium trioxide1308-38-911.0083016.0000000.310473
Inorganic Silicon compoundsSilicon dioxide7631-86-95.5041513.0000000.155237
Inorganic compoundsOther inorganic compounds2.9355471.6000000.082793
Subtotal183.471690100.00000005.174557
ConductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-14.75761118.4000000.134182
Inorganic compoundsOther inorganic compounds0.3619921.4000000.010209
Molybdenum and its compoundsMolybdenum, metal7439-98-70.6464152.5000000.018231
Tungsten and its compoundsTungsten, metal7440-33-720.09056377.7000000.566626
Subtotal25.856580100.00000000.729248
FlangeCopper and its compoundsCopper, metal7440-50-81143.02477851.80000032.237381
Molybdenum and its compoundsMolybdenum, metal7439-98-71063.58676248.20000029.996946
Subtotal2206.611540100.000000062.234327
Gold PlatingGold and its compoundsGold, metal7440-57-55.50134599.9990000.155158
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000550.0010000.000002
Subtotal5.501400100.00000000.155159
Iron AlloyIron and its compoundsIron, metal7439-89-6144.22470258.0000004.067652
Nickel and its compoundsNickel, metal7440-02-0104.43857842.0000002.945541
Subtotal248.663280100.00000007.013193
Metal BrazeCopper and its compoundsCopper, metal7440-50-89.39639128.0000000.265012
Silver and its compoundsSilver, metal7440-22-424.16214972.0000000.681459
Subtotal33.558540100.00000000.946471
Nickel Cobalt PlatingCobalt and its compoundsCobalt, metal7440-48-413.36840230.0000000.377037
Nickel and its compoundsNickel, metal7440-02-031.19293870.0000000.879752
Subtotal44.561340100.00000001.256789
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0024760.1000000.000070
Palladium and its compoundsPalladium, metal7440-05-32.47315499.9000000.069752
Subtotal2.475630100.00000000.069822
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped73.37281698.0000002.069376
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.4974042.0000000.042232
Subtotal74.870220100.00000002.111608
Semiconductor Die 2Semiconductor DieGold and its compoundsGold, metal7440-57-50.1473511.0200000.004156
Inorganic Silicon compoundsSilicon, doped14.01282397.0004000.395212
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2859761.9796000.008065
Subtotal14.446150100.00000000.407433
Semiconductor Die 3Semiconductor DieGold and its compoundsGold, metal7440-57-50.0716041.0200000.002020
Inorganic Silicon compoundsSilicon, doped6.80942897.0004000.192050
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1389681.9796000.003919
Subtotal7.020000100.00000000.197989
Semiconductor Die 4Semiconductor DieGold and its compoundsGold, metal7440-57-50.4312561.0200000.012163
Inorganic Silicon compoundsSilicon, doped41.01176997.0004001.156678
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8369751.9796000.023606
Subtotal42.280000100.00000001.192447
Total3545.650189100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 A2T18S162W31GSR3
Product content declaration of A2T18S162W31GSR3
上次修订 Last Revision (GMT):
Thursday, 24 August 2023, 03:59:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
盖子
Cap
陶瓷的
Ceramic
OOOOOO

环氧胶
Epoxy
OOOOOO
电容器
Capacitor
电容器
Capacitor
OOOOOO
封装焊头/法兰
Header Assembly/Flange
陶瓷的
Ceramic
OOOOOO

导体
Conductor
OOOOOO

法兰盘
Flange
OOOOOO

镀金材料
Gold Plating
OOOOOO

铁合金
Iron Alloy
OOOOOO

金属钎焊
Metal Braze
OOOOOO

镍钴电镀
Nickel Cobalt Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 4
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of A2T18S162W31GSR3Last Revision (GMT):
Thursday, 24 August 2023, 03:59:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
CapCERAMICTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
1 Jul 2020
EPOXYTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
1 Jul 2020
Not Available
CapacitorNot AvailableNot AvailableNot AvailableNot Available
Header Assembly/FlangeALLOY 42Test Report
7 Jun 2021
Test Report
7 Jun 2021
Test Report
7 Jun 2021
Test Report
7 Jun 2021
AU PLATINGTest Report
2 Aug 2021
Not AvailableNot AvailableNot Available
FLANGETest Report
18 Mar 2021
Test Report
18 Mar 2021
Test Report
18 Mar 2021
Not Available
PD PLATINGTest Report
18 Jan 2021
Test Report
18 Jan 2021
Not AvailableNot Available
Semiconductor Die 1Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Semiconductor Die 2Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 3Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 4Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.