A2T26H165-24SR3

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of A2T26H165-24SR3Last Revision (GMT):
Friday, 25 August 2023, 11:36:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
A2T26H165-24SR3SOT1799-3CFM6F4393.103196 mg YesYesYesN/ANot Applicablee4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 130 411282023-11-247NA / Not Available26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-527.50903498.8450000.626187
Inorganic Silicon compoundsSilicon7440-21-30.3200511.1500000.007285
Nickel and its compoundsNickel, metal7440-02-00.0013910.0050000.000032
Subtotal27.830476100.00000000.633504
CapCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1566.46182496.00000012.894344
Inorganic Silicon compoundsSilicon dioxide7631-86-917.7019323.0000000.402948
Inorganic compoundsOther inorganic compounds5.9006441.0000000.134316
Subtotal590.064400100.000000013.431608
EpoxyInorganic Silicon compoundsSilicon dioxide7631-86-99.91602045.0000000.225718
Phenols and Phenolic Resins2-[[4-[2-[4-[1,1-bis[4-(oxiran-2-ylmethoxy)phenyl]ethyl]phenyl]propan-2-yl]phenoxy]methyl]oxirane115254-47-212.11958055.0000000.275877
Subtotal22.035600100.00000000.501595
Header Assembly/FlangeCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1224.30376089.4000005.105816
Chromium and Chromium III compoundsDichromium trioxide1308-38-915.0539446.0000000.342672
Inorganic Silicon compoundsSilicon dioxide7631-86-97.5269723.0000000.171336
Inorganic compoundsOther inorganic compounds4.0143851.6000000.091379
Subtotal250.899060100.00000005.711203
ConductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-16.40636118.4000000.145828
Inorganic compoundsOther inorganic compounds0.4874401.4000000.011096
Molybdenum and its compoundsMolybdenum, metal7439-98-70.8704292.5000000.019814
Tungsten and its compoundsTungsten, metal7440-33-727.05294977.7000000.615805
Subtotal34.817180100.00000000.792542
FlangeCopper and its compoundsCopper, metal7440-50-81563.30717551.80000035.585487
Molybdenum and its compoundsMolybdenum, metal7439-98-71454.66034548.20000033.112364
Subtotal3017.967520100.000000068.697852
Gold PlatingGold and its compoundsGold, metal7440-57-56.10191999.9990000.138898
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000610.0010000.000001
Subtotal6.101980100.00000000.138899
Iron AlloyIron and its compoundsIron, metal7439-89-6102.21893358.0000002.326805
Nickel and its compoundsNickel, metal7440-02-074.02060742.0000001.684928
Subtotal176.239540100.00000004.011732
Metal BrazeCopper and its compoundsCopper, metal7440-50-813.36692628.0000000.304271
Silver and its compoundsSilver, metal7440-22-434.37209472.0000000.782410
Subtotal47.739020100.00000001.086681
Nickel Cobalt PlatingCobalt and its compoundsCobalt, metal7440-48-415.82925430.0000000.360321
Nickel and its compoundsNickel, metal7440-02-036.93492670.0000000.840748
Subtotal52.764180100.00000001.201069
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0028710.1000000.000065
Palladium and its compoundsPalladium, metal7440-05-32.86864899.9000000.065299
Subtotal2.871520100.00000000.065364
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped3.62600098.0000000.082539
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0740002.0000000.001685
Subtotal3.700000100.00000000.084223
Semiconductor Die 2Semiconductor DieGold and its compoundsGold, metal7440-57-50.4141201.0200000.009427
Inorganic Silicon compoundsSilicon, doped39.38216297.0004000.896454
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8037181.9796000.018295
Subtotal40.600000100.00000000.924176
Semiconductor Die 3Semiconductor DieInorganic Silicon compoundsSilicon, doped37.50726698.0000000.853776
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.7654542.0000000.017424
Subtotal38.272720100.00000000.871200
Semiconductor Die 4Semiconductor DieInorganic Silicon compoundsSilicon, doped19.89400098.0000000.452846
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4060002.0000000.009242
Subtotal20.300000100.00000000.462088
Semiconductor Die 5Semiconductor DieInorganic Silicon compoundsSilicon, doped39.78800098.0000000.905692
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8120002.0000000.018483
Subtotal40.600000100.00000000.924176
Semiconductor Die 6Semiconductor DieGold and its compoundsGold, metal7440-57-50.2070601.0200000.004713
Inorganic Silicon compoundsSilicon, doped19.69108197.0004000.448227
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4018591.9796000.009147
Subtotal20.300000100.00000000.462088
Total4393.103196100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 A2T26H165-24SR3
Product content declaration of A2T26H165-24SR3
上次修订 Last Revision (GMT):
Friday, 25 August 2023, 11:36:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
盖子
Cap
陶瓷的
Ceramic
OOOOOO

环氧胶
Epoxy
OOOOOO
封装焊头/法兰
Header Assembly/Flange
陶瓷的
Ceramic
OOOOOO

导体
Conductor
OOOOOO

法兰盘
Flange
OOOOOO

镀金材料
Gold Plating
OOOOOO

铁合金
Iron Alloy
OOOOOO

金属钎焊
Metal Braze
OOOOOO

镍钴电镀
Nickel Cobalt Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 4
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 5
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 6
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of A2T26H165-24SR3Last Revision (GMT):
Friday, 25 August 2023, 11:36:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
CapCERAMICTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
1 Jul 2020
EPOXYTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
1 Jul 2020
Not Available
Header Assembly/FlangeALLOY 42Test Report
7 Jun 2021
Test Report
7 Jun 2021
Test Report
7 Jun 2021
Test Report
7 Jun 2021
AU PLATINGTest Report
2 Aug 2021
Not AvailableNot AvailableNot Available
FLANGETest Report
18 Mar 2021
Test Report
18 Mar 2021
Test Report
18 Mar 2021
Not Available
NICO PLATINGTest Report
21 Sep 2021
Test Report
21 Sep 2021
Test Report
21 Sep 2021
Test Report
21 Sep 2021
PD PLATINGTest Report
18 Jan 2021
Test Report
18 Jan 2021
Not AvailableNot Available
Semiconductor Die 1Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 2Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 3Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Semiconductor Die 4Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Semiconductor Die 5Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Semiconductor Die 6Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.