A7102CHTK2/T0BC2A5

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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Product content declaration of A7102CHTK2/T0BC2A5
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
A7102CHTK2/T0BC2A5NANA44.95948 mg YesYesYesNot AvailableNot AvailableNot Availablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 635 151182018-05-2541 | Unlimited26030 sec.1 | Unlimited24020 sec.3Bangkok, Thailand
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
AdhesiveFillerSilver (Ag)7440-22-40.0881180.100000.19598
PolymerResin systemProprietary0.0218919.900000.04869
Subtotal0.11000100.000000.24467
DieDoped siliconSilicon (Si)7440-21-32.4671097.999965.48739
Pure metalGold (Au)7440-57-50.050352.000040.11199
Subtotal2.51745100.000005.59938
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-816.8525697.4699837.48389
Iron (Fe)7439-89-60.414962.400000.92296
Phosphorous (P)7723-14-00.005190.030020.01154
Zinc (Zn)7440-66-60.017290.100000.03846
Subtotal17.29000100.0000038.45685
Mould CompoundAdditiveNon hazardousProprietary0.773163.169991.71968
FillerSilica fused60676-86-020.6046784.4800345.82942
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.870723.569991.93668
PigmentCarbon black1333-86-40.043900.179990.09764
Polymer1.4-bis(methoxymethyl)benzene/phenol copolymer26834-02-60.853653.500001.89871
Epoxy resin systemProprietary0.870723.569991.93668
Tetramethylbiphenyl diglycidyl ether85954-11-60.373171.530010.83001
Subtotal24.38999100.0000054.24882
Pre-platingPure metal layerGold (Au)7440-57-50.005901.000000.01312
Nickel (Ni) 7440-02-00.5723097.000001.27292
Palladium (Pd)7440-05-30.011802.000000.02625
Subtotal0.59000100.000001.31229
WirePure metalGold (Au)7440-57-50.0614299.000640.13661
Palladium (Pd)7440-05-30.000620.999360.00138
Subtotal0.06204100.000000.13799
Total44.95948100.00000100.00000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of A7102CHTK2/T0BC2A5
产品内容声明 A7102CHTK2/T0BC2A5
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Adhesive
粘合剂
OOOOOO
Die
晶粒
OOOOOO
Lead Frame Material
极片材料
OOOOOO
Mould Compound
注塑胶料
OOOOOO
Pre-plating
预电镀
OOOOOO
Wire
线
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

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