AFT26H250W03SR6

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of AFT26H250W03SR6Last Revision (GMT):
Monday, 09 May 2022, 07:02:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
AFT26H250W03SR6SOT1829-1CFM4F13174.556514 mg YesYesYesN/ANot Applicablee4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 234 831282020-04-079NA / Not Available26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-52.19970499.9900000.016697
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002200.0100000.000002
Subtotal2.199924100.00000000.016698
CapCapAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-11703.52636394.94100012.930427
Calcium and its compoundsCalcium monoxide1305-78-83.5347710.1970000.026830
Epoxy ResinsProprietary Material-Other Epoxy resins27.1549361.5134000.206117
Inorganic Silicon compoundsQuartz14808-60-742.4118692.3637000.321923
Magnesium and its compoundsMagnesium-oxide1309-48-417.6720610.9849000.134138
Subtotal1794.300000100.000000013.619434
CapacitorCapacitorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-11.1938783.1063000.009062
Barium and its compoundsBarium titanate12047-27-730.70580279.8921000.233069
Copper and its compoundsCopper, metal7440-50-82.3706156.1680000.017994
Gold and its compoundsGold, metal7440-57-52.4654706.4148000.018714
Manganese and its compoundsManganese dioxide1313-13-90.0388570.1011000.000295
Nickel and its compoundsNickel, metal7440-02-01.2801633.3308000.009717
Tin and its compoundsTin, metal7440-31-50.3793060.9869000.002879
Subtotal38.434090100.00000000.291730
Header Assembly/FlangeHeader Assembly/FlangeAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1443.9147533.9402003.369485
Cobalt and its compoundsCobalt, metal7440-48-442.2148260.3747000.320427
Copper and its compoundsCopper, metal7440-50-85192.84046346.09180039.415676
Gold and its compoundsGold, metal7440-57-514.3983310.1278000.109289
Inorganic Silicon compoundsProprietary Material-Other glass compounds (without lead, chromium, cadmium or mercury)33.2130520.2948000.252100
Inorganic Silicon compoundsQuartz14808-60-715.4010320.1367000.116900
Iron and its compoundsIron, metal7439-89-6238.8568262.1201001.813016
Molybdenum and its compoundsMolybdenum, metal7439-98-74799.95078442.60450036.433490
Nickel and its compoundsNickel, metal7440-02-0271.2587052.4077002.058959
Palladium and its compoundsPalladium, metal7440-05-310.8043820.0959000.082009
Silver and its compoundsSilver, metal7440-22-498.2196030.8718000.745525
Titanium and its compoundsTitanium (IV) Oxide13463-67-72.8053090.0249000.021293
Tungsten and its compoundsTungsten, metal7440-33-7102.4219330.9091000.777422
Subtotal11266.300000100.000000085.515592
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped2.35200098.0000000.017853
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0480002.0000000.000364
Subtotal2.400000100.00000000.018217
Semiconductor Die 2Semiconductor DieGold and its compoundsGold, metal7440-57-50.0716041.0200000.000544
Inorganic Silicon compoundsSilicon, doped6.80942897.0004000.051686
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1389681.9796000.001055
Subtotal7.020000100.00000000.053284
Semiconductor Die 3Semiconductor DieInorganic Silicon compoundsSilicon, doped6.28992089.6000000.047743
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0631800.9000000.000480
Nickel and its compoundsNickel, metal7440-02-00.0351000.5000000.000266
Silver and its compoundsSilver, metal7440-22-40.0221130.3150000.000168
Tin and its compoundsTin, metal7440-31-50.6096878.6850000.004628
Subtotal7.020000100.00000000.053284
Semiconductor Die 4Semiconductor DieGold and its compoundsGold, metal7440-57-50.1509601.0200000.001146
Inorganic Silicon compoundsSilicon, doped14.35605997.0004000.108968
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2929811.9796000.002224
Subtotal14.800000100.00000000.112338
Semiconductor Die 5Semiconductor DieInorganic Silicon compoundsSilicon7440-21-341.24085098.0000000.313034
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8416502.0000000.006389
Subtotal42.082500100.00000000.319423
Total13174.556514100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 AFT26H250W03SR6
Product content declaration of AFT26H250W03SR6
上次修订 Last Revision (GMT):
Monday, 09 May 2022, 07:02:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
电容器
Capacitor
电容器
Capacitor
OOOOOO
封装焊头/法兰
Header Assembly/Flange
封装焊头/法兰
Header Assembly/Flange
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 4
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 5
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of AFT26H250W03SR6Last Revision (GMT):
Monday, 09 May 2022, 07:02:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
CapCERAMICTest Report
27 Jun 2019
Test Report
27 Jun 2019
Test Report
27 Jun 2019
Not Available
EPOXYTest Report
27 Jun 2019
Test Report
27 Jun 2019
Test Report
27 Jun 2019
Not Available
CapacitorNot AvailableNot AvailableNot AvailableNot Available
Header Assembly/FlangeAGCU SOLDERTest Report
23 Apr 2021
Test Report
23 Apr 2021
Test Report
9 Mar 2021
Test Report
9 Mar 2021
ALLOY 42Test Report
7 Jun 2021
Test Report
7 Jun 2021
Test Report
7 Jun 2021
Test Report
7 Jun 2021
AU PLATINGTest Report
2 Aug 2021
Test Report
30 Nov 2021
Test Report
30 Nov 2021
Test Report
25 Apr 2018
CPC BOARDTest Report
18 Mar 2021
Test Report
18 Mar 2021
Test Report
18 Mar 2021
Not Available
ELECTRIC CONDUCTOR (TUNGSTEN)Test Report
3 Sep 2021
Test Report
3 Sep 2021
Test Report
3 Sep 2021
Test Report
3 Sep 2021
NICO PLATINGTest Report
21 Sep 2021
Test Report
21 Sep 2021
Test Report
21 Sep 2021
Test Report
21 Sep 2021
PD PLATINGTest Report
18 Jan 2021
Test Report
18 Jan 2021
Not AvailableNot Available
Semiconductor Die 1Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Semiconductor Die 2Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Semiconductor Die 3Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Semiconductor Die 4Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Semiconductor Die 5Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.