CBTL06GP213EE

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

Product content declaration of CBTL06GP213EE
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
CBTL06GP213EESOT1345-1TFBGA5048.74201 mg YesYesYesNot AvailableNot AvailableNot Availablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 014 191182016-01-2831 | Unlimited26030 sec.1 | Unlimited24020 sec.3Kaohsiung, Taiwan
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
AdhesiveAdditiveNon hazardousProprietary0.002002.000000.00410
FillerSilver (Ag)7440-22-40.0780078.000000.16003
PolymerBismaleimide resin 135325-39-40.0100010.000000.02052
Isobornyl Methacrylate7534-94-30.0100010.000000.02052
Subtotal0.10000100.000000.20517
DieDoped siliconSilicon (Si)7440-21-30.54000100.000001.10787
Subtotal0.54000100.000001.10787
Lead Frame MaterialAdditiveNon hazardousProprietary0.029900.230000.06134
FillerAluminium Hydroxide (Al(OH)3)21645-51-21.171309.010002.40306
Barium Sulfate (BaSO4)7727-43-70.100100.770000.20537
Glass Fibrous65997-17-33.5126027.020007.20651
Silica -amorphous-7631-86-90.050700.390000.10402
Talc14807-96-60.050700.390000.10402
N/A(2-Methoxymethylethoxy)propanol34590-94-80.070200.540000.14402
3-Methoxy-3-methylbutyl acetate103429-90-90.110500.850000.22670
Arsenic (As)7440-38-20.001300.010000.00267
Diethylene Glycol Monoethyl Ether Acetate112-15-20.001300.010000.00267
Solvent Naphta (petroleum) - Heavy Arom.64742-94-50.018200.140000.03734
PigmentC.I. Pigment Blue 15147-14-80.001300.010000.00267
Non hazardousProprietary0.001300.010000.00267
Polymer4.4'-Diphenylmethane bismaleimide105391-33-11.296109.970002.65910
Acrylic resinProprietary0.197601.520000.40540
Bisphenol-F/Formaldehyde/Epichlorohydrin copolymer9003-36-51.296109.970002.65910
Non hazardousProprietary0.143001.100000.29338
Triazine A25722-66-11.296109.970002.65910
Pure metalCopper (Cu)7440-50-83.5126027.020007.20651
Gold (Au)7440-57-50.024700.190000.05067
Nickel (Ni) 7440-02-00.114400.880000.23471
Subtotal13.00000100.0000026.67103
Mould CompoundFillerMisc. Silica compounds 114808-60-726.9100089.7000055.20906
PolymerEpoxy resin systemProprietary3.0900010.300006.33950
Subtotal30.00000100.0000061.54856
Solder BallTin alloyCopper (Cu)7440-50-80.025500.500000.05232
Silver (Ag)7440-22-40.051001.000000.10463
Tin (Sn)7440-31-55.0235098.5000010.30630
Subtotal5.10000100.0000010.46325
WirePure metalGold (Au)7440-57-50.0019999.004980.00408
Palladium (Pd)7440-05-30.000020.995020.00004
Subtotal0.00201100.000000.00412
Total48.74201100.00000100.00000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of CBTL06GP213EE
产品内容声明 CBTL06GP213EE
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Adhesive
粘合剂
OOOOOO
Die
晶粒
OOOOOO
Lead Frame Material
极片材料
OOOOOO
Mould Compound
注塑胶料
OOOOOO
Solder Ball
焊球
OOOOOO
Wire
线
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

Page is not available, please enter a service request