CBTW28DD14ET,118

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of CBTW28DD14ET,118Last Revision (GMT):
Wednesday, 24 August 2022, 06:34:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
CBTW28DD14ET,118SOT1155TFBGA4839.012220 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 909 151182022-05-131 / Unlimited26030 sec.NA / Not Available24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000010.0020000.000000
Gold and its compoundsGold, metal7440-57-50.00219398.8400000.005625
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0080000.000000
Palladium and its compoundsPalladium, metal7440-05-30.0000251.1500000.000065
Subtotal0.002220100.00000000.005691
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins2.36900010.3000006.072456
Inorganic Silicon compoundsOther silica compounds20.63100089.70000052.883430
Subtotal23.000000100.000000058.955886
Epoxy AdhesiveEpoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.04000010.0000000.102532
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0080002.0000000.020506
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.04000010.0000000.102532
Silver and its compoundsSilver, metal7440-22-40.31200078.0000000.799749
Subtotal0.400000100.00000001.025320
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-30.59780098.0000001.532340
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0122002.0000000.031272
Subtotal0.610000100.00000001.563613
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0250000.5000000.064083
Silver and its compoundsSilver, metal7440-22-40.0500001.0000000.128165
Tin and its compoundsTin, metal7440-31-54.92500098.50000012.624249
Subtotal5.000000100.000000012.816497
SubstrateCopper CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-60.36600021.8000000.938168
Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.75214744.8000001.927978
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0201471.2000000.051642
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1074506.4000000.275425
Phenols - SpecificBisphenol A80-05-70.0167891.0000000.043035
PolymersBT Resin (CAS# 13676-54-5/25722-66-1) [Brominated Compound]0.24176114.4000000.619707
PolymersPlastic: EP - Epoxide, Epoxy0.17460510.4000000.447566
Subtotal1.678899100.00000004.303522
Copper FoilChromium and Chromium III compoundsChromium, metal7440-47-30.0004140.0100000.001062
Copper and its compoundsCopper, metal7440-50-84.13968099.95000010.611241
Zinc and its compoundsZinc, metal7440-66-60.0016570.0400000.004247
Subtotal4.141751100.000000010.616549
Copper PlatingCopper and its compoundsCopper, metal7440-50-82.56506399.9500006.575024
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0012830.0500000.003289
Subtotal2.566346100.00000006.578313
Gold PlatingGold and its compoundsGold, metal7440-57-50.04579399.9900000.117380
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000050.0100000.000012
Subtotal0.045797100.00000000.117392
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0004580.2000000.001174
Nickel and its compoundsNickel, metal7440-02-00.22862899.8000000.586042
Subtotal0.229086100.00000000.587217
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.38939329.1000000.998130
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0080290.6000000.020580
Magnesium and its compoundsTalc14807-96-60.0401443.0000000.102900
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0481723.6000000.123480
PolymersPlastic: EP - Epoxide, Epoxy0.26227119.6000000.672280
PolymersPlastic: PAK0.59011144.1000001.512631
Subtotal1.338120100.00000003.430001
Total39.012220100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 CBTW28DD14ET,118
Product content declaration of CBTW28DD14ET,118
上次修订 Last Revision (GMT):
Wednesday, 24 August 2022, 06:34:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜芯
Copper Core
OOOOOO

铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of CBTW28DD14ET,118Last Revision (GMT):
Wednesday, 24 August 2022, 06:34:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
22 Jul 2022
Test Report
22 Jul 2022
Test Report
22 Jul 2022
Test Report
22 Jul 2022
Die EncapsulantTest Report
3 Dec 2021
Test Report
3 Dec 2021
Test Report
3 Dec 2021
Test Report
3 Dec 2021
Epoxy AdhesiveTest Report
1 Jul 2022
Test Report
1 Jul 2022
Test Report
1 Jul 2022
Test Report
5 Jul 2021
Semiconductor DieTest Report
28 Jun 2022
Test Report
28 Jun 2022
Test Report
28 Jun 2022
Test Report
28 Jun 2022
Solder Ball - SAC, Lead FreeTest Report
12 Dec 2021
Test Report
12 Dec 2021
Test Report
12 Dec 2021
Test Report
12 Dec 2021
SubstrateAU PLATINGTest Report
22 Feb 2022
Test Report
22 Feb 2022
Test Report
22 Feb 2022
Test Report
22 Feb 2022
AUS 308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
18 Oct 2021
Test Report
18 Oct 2021
COPPERTest Report
1 Mar 2022
Test Report
1 Mar 2022
Test Report
1 Mar 2022
Test Report
1 Mar 2022
CU PLATINGTest Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
HL832NXATest Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
NI PLATINGTest Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.