FXAS21002CQR1

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of FXAS21002CQR1Last Revision (GMT):
Friday, 22 September 2023, 08:41:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FXAS21002CQR1SOT1681-1VQFN2434.800042 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 155 375472022-05-2714Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.40000299.9900001.149430
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000400.0100000.000115
Subtotal0.400042100.00000001.149545
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-84.36461767.45930012.541987
Gold and its compoundsGold, metal7440-57-50.0013520.0209000.003886
Inorganic Silicon compoundsSilicon7440-21-30.0539860.8344000.155131
Magnesium and its compoundsMagnesium, metal7439-95-40.0134960.2086000.038783
Nickel and its compoundsNickel, metal7440-02-00.2159363.3375000.620506
Palladium and its compoundsPalladium, metal7440-05-30.0026980.0417000.007753
Silver and its compoundsSilver, metal7440-22-41.81791528.0976005.223887
Subtotal6.470000100.000000018.591932
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Non-halogenated Epoxy resins0.6687003.0000001.921549
Inorganic Silicon compoundsSilica, vitreous60676-86-020.88573093.70000060.016393
Inorganic compoundsCarbon Black1333-86-40.0668700.3000000.192155
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.6687003.0000001.921549
Subtotal22.290000100.000000064.051647
Epoxy AdhesiveEpoxy AdhesiveAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.18400040.0000000.528735
Organic compoundsOther organic compounds.0.0230005.0000000.066092
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.04600010.0000000.132184
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-30.06900015.0000000.198276
PolymersPlastic: EP - Epoxide, Epoxy0.13800030.0000000.396551
Subtotal0.460000100.00000001.321837
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-31.00940098.0000002.900571
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0206002.0000000.059195
Subtotal1.030000100.00000002.959767
Semiconductor Die 2DieInorganic Silicon compoundsSilicon7440-21-34.04666598.00000011.628334
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0825852.0000000.237313
Subtotal4.129250100.000000011.865647
GlassAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0002081.0000000.000596
Boron and its compoundsBoron oxide1303-86-20.0016608.0000000.004770
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0006233.0000000.001789
Lead and its compoundsLead monooxide1317-36-80.01110153.5000000.031900
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.00715934.5000000.020571
Subtotal0.020750100.00000000.059626
Total34.800042100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FXAS21002CQR1
Product content declaration of FXAS21002CQR1
上次修订 Last Revision (GMT):
Friday, 22 September 2023, 08:41:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Die
OOOOOO

玻璃
Glass
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FXAS21002CQR1Last Revision (GMT):
Friday, 22 September 2023, 08:41:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
Die EncapsulantTest Report
12 May 2023
Test Report
12 May 2023
Test Report
12 May 2023
Test Report
12 May 2023
Epoxy AdhesiveTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Semiconductor Die 1Test Report
11 Nov 2022
Test Report
11 Nov 2022
Test Report
11 Nov 2022
Test Report
11 Nov 2022
Semiconductor Die 2CAP DIETest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
LEAD GLASS FRIT DIETest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.