HT2DC20S20/F/RSP

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of HT2DC20S20/F/RSPLast Revision (GMT):
Monday, 04 March 2024, 01:59:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
HT2DC20S20/F/RSPSOT385-1PLLMC427.811640 mg NoYesYesSilver (Ag)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 031 321222023-11-258NA / Not AvailableNot ApplicableNot ApplicableNA / Not AvailableNot ApplicableNot ApplicableNot ApplicableBangkok, Thailand
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.0000010.0010000.000000
Beryllium and its compoundsBeryllium, metal7440-41-70.0000010.0010000.000000
Copper and its compoundsCopper, metal7440-50-80.0000010.0010000.000000
Gold and its compoundsGold, metal7440-57-50.00599399.9930000.001402
Iron and its compoundsIron, metal7439-89-60.0000010.0010000.000000
Magnesium and its compoundsMagnesium, metal7439-95-40.0000010.0010000.000000
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0010000.000000
Silver and its compoundsSilver, metal7440-22-40.0000010.0010000.000000
Subtotal0.006000100.00000000.001402
CapacitorCeramicCalcium and its compoundsCalcium monoxide1305-78-80.41356840.0000000.096671
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.10339210.0000000.024168
Zirconium and its compoundsZirconium oxide1314-23-40.51696050.0000000.120838
Subtotal1.033920100.00000000.241676
GlassBoron and its compoundsBoron oxide1303-86-20.00403220.0000000.000942
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01612880.0000000.003770
Subtotal0.020160100.00000000.004712
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000290.0100000.000007
Nickel and its compoundsNickel, metal7440-02-00.29501199.9900000.068958
Subtotal0.295040100.00000000.068965
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.01903899.9900000.004450
Subtotal0.019040100.00000000.004450
Outer ElectrodeCopper and its compoundsCopper, metal7440-50-80.18174299.9900000.042482
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000180.0100000.000004
Subtotal0.181760100.00000000.042486
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000050.0100000.000001
Tin and its compoundsTin, metal7440-31-50.05007599.9900000.011705
Subtotal0.050080100.00000000.011706
CoilEnd CapInorganic Silicon compoundsFibrous-glass-wool65997-17-36.06060042.0000001.416651
Inorganic compoundsCarbon Black1333-86-40.1443001.0000000.033730
Organic compounds1,3-Benzenedicarboxylic acid,polymer with 1,4-benzenedicarboxylic acid,[1,1'-biphenyl]-4,4'-diol and 4-hydroxybenzoic acid60088-52-08.22510057.0000001.922599
Subtotal14.430000100.00000003.372980
InsulationMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000950.0100000.000022
PolymersPlastic: PUR - Polyurethane0.95215999.9900000.222565
Subtotal0.952254100.00000000.222587
SolderCopper and its compoundsCopper, metal7440-50-80.0404301.0000000.009450
Tin and its compoundsTin, metal7440-31-54.00257099.0000000.935592
Subtotal4.043000100.00000000.945042
Substrate CoreCobalt and its compoundsCobalt tetroxide1308-06-10.0413790.0500000.009672
Iron and its compoundsDiiron-trioxide1309-37-157.88094569.94000013.529540
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0082760.0100000.001934
Manganese and its compoundsManganese tetraoxide1317-35-714.89644018.0000003.482009
Zinc and its compoundsZinc oxide1314-13-29.93096012.0000002.321339
Subtotal82.758000100.000000019.344495
WireCopper and its compoundsCopper, metal7440-50-827.81396499.9900006.501451
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0027820.0100000.000650
Subtotal27.816746100.00000006.502101
Copper Lead-Frame, Pre-Plated AgCopper Lead-Frame, Pre-Plated AgCopper and its compoundsCopper, metal7440-50-825.97408196.2003006.071383
Inorganic Silicon compoundsSilicon7440-21-30.1755000.6500000.041023
Magnesium and its compoundsMagnesium, metal7439-95-40.0405270.1501000.009473
Nickel and its compoundsNickel, metal7440-02-00.8098922.9996000.189310
Subtotal27.000000100.00000006.311189
Die EncapsulantDie EncapsulantAntimony OxidesAntimony(III) oxide1309-64-49.2520003.6000002.162634
Epoxy ResinsProprietary Material-Other Epoxy resins58.85300022.90000013.756755
Halogenated Organic CompoundsProprietary Material-Other brominated organic hydrocarbons3.8550001.5000000.901097
Inorganic Silicon compoundsQuartz14808-60-7185.04000072.00000043.252680
Subtotal257.000000100.000000060.073167
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-71.75000050.0000000.409058
Organic compoundsOther organic compounds.0.1050003.0000000.024543
PolymersPlastic: EP - Epoxide, Epoxy1.64500047.0000000.384515
Subtotal3.500000100.00000000.818117
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0002000.0100000.000047
Silver and its compoundsSilver, metal7440-22-41.99980099.9900000.467449
Subtotal2.000000100.00000000.467495
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-31.67152798.0000000.390716
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0341132.0000000.007974
Subtotal1.705640100.00000000.398689
Solder PasteSolder PasteCopper and its compoundsCopper, metal7440-50-80.0350000.7000000.008181
Silver and its compoundsSilver, metal7440-22-40.1900003.8000000.044412
Tin and its compoundsTin, metal7440-31-54.77500095.5000001.116145
Subtotal5.000000100.00000001.168739
Total427.811640100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 HT2DC20S20/F/RSP
Product content declaration of HT2DC20S20/F/RSP
上次修订 Last Revision (GMT):
Monday, 04 March 2024, 01:59:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
电容器
Capacitor
陶瓷的
Ceramic
OOOOOO

玻璃
Glass
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
线圈
Coil
端盖
End Cap
OOOOOO

绝缘
Insulation
OOOOOO

焊料
Solder
OOOOOO

有机基质芯
Substrate Core
OOOOOO

线
Wire
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of HT2DC20S20/F/RSPLast Revision (GMT):
Monday, 04 March 2024, 01:59:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
CapacitorCERAMICTest Report
22 Dec 2022
Test Report
22 Dec 2022
Test Report
22 Dec 2022
Test Report
22 Dec 2022
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Test Report
20 May 2022
CoilFERRITETest Report
7 Dec 2020
Test Report
7 Dec 2020
Test Report
7 Dec 2020
Not Available
LCP RESINTest Report
26 Mar 2021
Test Report
26 Mar 2021
Test Report
26 Mar 2021
Not Available
MAGNET WIRETest Report
31 Mar 2021
Not AvailableNot AvailableNot Available
MAGNET WIRE COATINGTest Report
31 Mar 2021
Test Report
31 Mar 2021
Test Report
31 Mar 2021
Test Report
31 Mar 2021
SOLDER BARTest Report
4 Apr 2019
Test Report
4 Apr 2019
Test Report
23 Nov 2020
Not Available
Copper Lead-Frame, Pre-Plated AgAG PLATINGTest Report
7 Nov 2023
Test Report
7 Nov 2023
Test Report
7 Nov 2023
Test Report
7 Nov 2023
C7025Test Report
14 Feb 2023
Test Report
14 Feb 2023
Test Report
14 Feb 2023
Test Report
14 Feb 2023
Die EncapsulantTest Report
20 Jun 2023
Test Report
20 Jun 2023
Test Report
20 Jun 2023
Test Report
20 Jun 2023
Epoxy AdhesiveTest Report
3 Oct 2022
Test Report
3 Oct 2022
Test Report
3 Oct 2022
Test Report
3 Oct 2022
Pre-plating - Precious metal - AgTest Report
29 Dec 2022
Test Report
29 Dec 2022
Test Report
29 Dec 2022
Test Report
29 Dec 2022
Semiconductor DieTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Solder PasteTest Report
14 Jan 2022
Test Report
14 Jan 2022
Test Report
14 Jan 2022
Test Report
14 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.