KMA221J

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of KMA221JLast Revision (GMT):
Thursday, 17 June 2021, 01:16:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
KMA221JSOT1188SIL4447.883264 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9340 674 811182021-01-06111 / Unlimited030 sec.1 / Unlimited020 sec.3Cabuyao, Philippines
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.26063198.9999000.058192
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0026070.9901000.000582
Palladium and its compoundsPalladium, metal7440-05-30.0000260.0100000.000006
Subtotal0.263264100.00000000.058780
Capacitor 1CeramicBarium and its compoundsBarium titanate12047-27-73.85990092.9906000.861810
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1006502.4248000.022472
Rare Earth Metals and its compoundsYtterbium oxide1314-37-00.1100022.6501000.024560
Rare Earth Metals and its compoundsYttrium oxide1314-36-90.0802981.9345000.017928
Subtotal4.150850100.00000000.926771
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0005500.1621000.000123
Nickel and its compoundsNickel, metal7440-02-00.33880099.8379000.075645
Subtotal0.339350100.00000000.075768
Outer Electrode 1Copper and its compoundsCopper, metal7440-50-80.03920499.0000000.008753
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0003961.0000000.000088
Subtotal0.039600100.00000000.008842
Outer Electrode 2Palladium and its compoundsPalladium, metal7440-05-30.0599506.1791000.013385
Silver and its compoundsSilver, metal7440-22-40.91025093.8209000.203234
Subtotal0.970200100.00000000.216619
Capacitor 2CeramicBarium and its compoundsBarium titanate12047-27-73.57918092.9906000.799132
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0933302.4248000.020838
Rare Earth Metals and its compoundsYtterbium oxide1314-37-00.1020022.6501000.022774
Rare Earth Metals and its compoundsYttrium oxide1314-36-90.0744581.9345000.016625
Subtotal3.848970100.00000000.859369
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0005100.1621000.000114
Nickel and its compoundsNickel, metal7440-02-00.31416099.8379000.070143
Subtotal0.314670100.00000000.070257
Outer Electrode 1Copper and its compoundsCopper, metal7440-50-80.03635399.0000000.008117
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0003671.0000000.000082
Subtotal0.036720100.00000000.008199
Outer Electrode 2Palladium and its compoundsPalladium, metal7440-05-30.0555906.1791000.012412
Silver and its compoundsSilver, metal7440-22-40.84405093.8209000.188453
Subtotal0.899640100.00000000.200865
Copper Lead-Frame, Pre-Plated AgCopper Lead-Frame, Pre-Plated AgCopper and its compoundsCopper, metal7440-50-8163.83600099.90000036.580067
Zirconium and its compoundsZirconium, metal7440-67-70.1640000.1000000.036617
Subtotal164.000000100.000000036.616684
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins22.2700008.5000004.972278
Inorganic Silicon compoundsQuartz14808-60-7231.87000088.50000051.770186
Miscellaneous substancesProprietary Material-Other miscellaneous substances.7.8600003.0000001.754922
Subtotal262.000000100.000000058.497386
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.06486510.8108000.014483
Guanidine compounds1-cyanoguanidine461-58-50.0032430.5405000.000724
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0454067.5676000.010138
Silver and its compoundsSilver, metal7440-22-40.48648781.0811000.108619
Subtotal0.600000100.00000000.133964
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0001650.0030000.000037
Bismuth and its compoundsBismuth, metal7440-69-90.0000550.0010000.000012
Copper and its compoundsCopper, metal7440-50-80.0000550.0010000.000012
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0002750.0050000.000061
Tin and its compoundsTin, metal7440-31-55.49945099.9900001.227876
Subtotal5.500000100.00000001.227999
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000200.0100000.000005
Silver and its compoundsSilver, metal7440-22-40.19998099.9900000.044650
Subtotal0.200000100.00000000.044654
Semiconductor Die 1Semiconductor DieGold and its compoundsGold, metal7440-57-50.0240002.0000000.005359
Inorganic Silicon compoundsSilicon7440-21-31.17600098.0000000.262568
Subtotal1.200000100.00000000.267927
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-33.44960098.0000000.770201
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0704002.0000000.015718
Subtotal3.520000100.00000000.785919
Total447.883264100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 KMA221J
Product content declaration of KMA221J
上次修订 Last Revision (GMT):
Thursday, 17 June 2021, 01:16:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
电容器
Capacitor 1
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

外电极
Outer Electrode 1
OOOOOO

外电极
Outer Electrode 2
OOOOOO
电容器
Capacitor 2
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

外电极
Outer Electrode 1
OOOOOO

外电极
Outer Electrode 2
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of KMA221JLast Revision (GMT):
Thursday, 17 June 2021, 01:16:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
6 Jul 2020
Test Report
6 Jul 2020
Test Report
6 Jul 2020
Test Report
6 Jul 2020
Capacitor 1CERAMICTest Report
21 Apr 2021
Test Report
21 Apr 2021
Test Report
21 Apr 2021
Test Report
21 Apr 2021
INNER ELECTRODETest Report
21 Apr 2021
Test Report
21 Apr 2021
Test Report
21 Apr 2021
Test Report
21 Apr 2021
NI PLATINGTest Report
21 Apr 2021
Test Report
21 Apr 2021
Test Report
21 Apr 2021
Test Report
21 Apr 2021
OUTER ELECTRODETest Report
21 Apr 2021
Test Report
21 Apr 2021
Test Report
21 Apr 2021
Test Report
21 Apr 2021
SN PLATINGTest Report
21 Apr 2021
Test Report
21 Apr 2021
Test Report
21 Apr 2021
Test Report
21 Apr 2021
Capacitor 2Not AvailableNot AvailableNot AvailableNot Available
Copper Lead-Frame, Pre-Plated AgAG PLATINGTest Report
2 Apr 2019
Test Report
2 Apr 2019
Test Report
2 Apr 2019
Not Available
C151Test Report
5 Sep 2018
Test Report
5 Sep 2018
Test Report
5 Sep 2018
Test Report
5 Sep 2018
Die EncapsulantTest Report
27 Jan 2021
Test Report
27 Jan 2021
Test Report
27 Jan 2021
Test Report
27 Jan 2021
Epoxy AdhesiveTest Report
21 May 2019
Test Report
21 May 2019
Test Report
21 May 2019
Test Report
21 May 2019
Post-plating - Lead FreeTest Report
20 Jun 2019
Test Report
20 Jun 2019
Test Report
20 Jun 2019
Test Report
20 Jun 2019
Pre-plating - Precious metal - AgNot AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 1Test Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
12 Jun 2020
Semiconductor Die 2Test Report
22 Feb 2021
Test Report
22 Feb 2021
Test Report
22 Feb 2021
Test Report
22 Feb 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.