MC13892EJVL

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MC13892EJVLLast Revision (GMT):
Friday, 04 June 2021, 01:21:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC13892EJVLSOT1842-1LFBGA186376.879983 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 185 315572020-07-2223 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.26797197.2995000.336439
Palladium and its compoundsPalladium, metal7440-05-30.0351922.7005000.009338
Subtotal1.303163100.00000000.345777
Die EncapsulantDie EncapsulantAluminum and its compoundsOther aluminum compounds5.6370003.0000001.495702
Epoxy ResinsOther Non-halogenated Epoxy resins9.3950005.0000002.492836
Inorganic Silicon compoundsSilica, vitreous60676-86-0159.71500085.00000042.378212
Inorganic compoundsCarbon Black1333-86-41.8790001.0000000.498567
Phenols and Phenolic ResinsOther phenolic resins5.6370003.0000001.495702
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-45.6370003.0000001.495702
Subtotal187.900000100.000000049.856721
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-92.70000045.0000000.716408
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0006000.0100000.000159
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.3000005.0000000.079601
PolymersPlastic: EP - Epoxide, Epoxy2.99940049.9900000.795850
Subtotal6.000000100.00000001.592019
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped39.91718498.00000010.591484
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8146362.0000000.216153
Subtotal40.731820100.000000010.807637
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0015470.0032000.000411
Antimony and its compoundsAntimony, metal7440-36-00.0060430.0125000.001604
Arsenic and its compoundsArsenic, metal7440-38-20.0036260.0075000.000962
Bismuth and its compoundsBismuth, metal7440-69-90.0090890.0188000.002412
Cadmium and its compoundsCadmium, metal7440-43-90.0006290.0013000.000167
Copper and its compoundsCopper, metal7440-50-80.0030460.0063000.000808
Gold and its compoundsGold, metal7440-57-50.0030460.0063000.000808
Indium and its compoundsIndium, metal7440-74-60.0030460.0063000.000808
Inorganic compoundsSulfur7704-34-90.0004830.0010000.000128
Iron and its compoundsIron, metal7439-89-60.0060430.0125000.001604
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0151320.0313000.004015
Nickel and its compoundsNickel, metal7440-02-00.0015470.0032000.000411
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0030460.0063000.000808
Silver and its compoundsSilver, metal7440-22-41.6921723.5002000.448995
Tin and its compoundsTin, metal7440-31-546.59558896.38140012.363508
Zinc and its compoundsZinc, metal7440-66-60.0009190.0019000.000244
Subtotal48.345000100.000000012.827691
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAluminum and its compoundsAluminum Hydroxide21645-51-24.0385644.3613001.071578
Aromatic amines and their saltsOther aromatic amines and their salts0.0154640.0167000.004103
Aromatic hydrocarbon compounds1,2,4-Trimethylbenzene95-63-60.0046300.0050000.001228
Aromatic hydrocarbon compoundsOther Aromatic carbonyl compounds0.0976000.1054000.025897
Barium and its compoundsBarium sulfate7727-43-70.5210600.5627000.138256
Copper and its compoundsCopper phthalocyanine147-14-80.0046300.0050000.001228
Copper and its compoundsCopper, metal7440-50-840.92040344.19050010.857675
Epoxy ResinsOther Epoxy resins3.8747544.1844001.028114
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.6209631.7505000.430101
Epoxy ResinsProprietary Material-Other Epoxy resins1.6595771.7922000.440346
Gold and its compoundsGold, metal7440-57-51.2336171.3322000.327324
Inorganic Silicon compoundsFibrous-glass-wool65997-17-322.05648723.8191005.852390
Inorganic Silicon compoundsSilicon dioxide7631-86-92.8455983.0730000.755041
Magnesium and its compoundsTalc14807-96-60.2624280.2834000.069632
Nickel and its compoundsNickel, metal7440-02-09.62641810.3957002.554240
Organic compounds3-methoxy-3-methyl-1-butyl acetate103429-90-90.5712490.6169000.151573
Organic compoundsBis(3-ethyl-5-methyl-4-maleimidophenyl)methane105391-33-11.6209631.7505000.430101
Organic compoundsQuinacridone pigment1047-16-10.0046300.0050000.001228
PolymersTriazine25722-66-11.6209631.7505000.430101
Subtotal92.600000100.000000024.570156
Total376.879983100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC13892EJVL
Product content declaration of MC13892EJVL
上次修订 Last Revision (GMT):
Friday, 04 June 2021, 01:21:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC13892EJVLLast Revision (GMT):
Friday, 04 June 2021, 01:21:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
2 Feb 2021
Test Report
2 Feb 2021
Test Report
2 Feb 2021
Test Report
2 Feb 2021
Die EncapsulantTest Report
14 Jul 2020
Test Report
14 Jul 2020
Test Report
14 Jul 2020
Test Report
14 Jul 2020
Epoxy AdhesiveTest Report
8 Sep 2020
Test Report
8 Sep 2020
Test Report
8 Sep 2020
Not Available
Semiconductor DieTest Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Solder Ball - Lead FreeTest Report
3 Nov 2020
Test Report
3 Nov 2020
Test Report
3 Nov 2020
Test Report
3 Nov 2020
Substrate, Pre-plated NiAuAUS308Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
E679FG SERIESTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
22 Jan 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.