MC13892EJVL

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MC13892EJVLLast Revision (GMT):
Wednesday, 29 June 2022, 09:25:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC13892EJVLSOT1842-1LFBGA186284.279983 mg YesYesYesTin/Silver (Sn/Ag)Not Applicablee2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 185 315572020-07-2223 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.26797197.2995000.446029
Palladium and its compoundsPalladium, metal7440-05-30.0351922.7005000.012379
Subtotal1.303163100.00000000.458408
Die EncapsulantDie EncapsulantAluminum and its compoundsOther aluminum compounds5.6370003.0000001.982904
Epoxy ResinsOther Non-halogenated Epoxy resins9.3950005.0000003.304841
Inorganic Silicon compoundsSilica, vitreous60676-86-0159.71500085.00000056.182288
Inorganic compoundsCarbon Black1333-86-41.8790001.0000000.660968
Phenols and Phenolic ResinsOther phenolic resins5.6370003.0000001.982904
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-45.6370003.0000001.982904
Subtotal187.900000100.000000066.096810
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-92.70000045.0000000.949768
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0006000.0100000.000211
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.3000005.0000000.105530
PolymersPlastic: EP - Epoxide, Epoxy2.99940049.9900001.055087
Subtotal6.000000100.00000002.110595
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped39.91718498.00000014.041503
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8146362.0000000.286561
Subtotal40.731820100.000000014.328065
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0015470.0032000.000544
Antimony and its compoundsAntimony, metal7440-36-00.0060430.0125000.002126
Arsenic and its compoundsArsenic, metal7440-38-20.0036260.0075000.001275
Bismuth and its compoundsBismuth, metal7440-69-90.0090890.0188000.003197
Cadmium and its compoundsCadmium, metal7440-43-90.0006290.0013000.000221
Copper and its compoundsCopper, metal7440-50-80.0030460.0063000.001071
Gold and its compoundsGold, metal7440-57-50.0030460.0063000.001071
Indium and its compoundsIndium, metal7440-74-60.0030460.0063000.001071
Inorganic compoundsSulfur7704-34-90.0004830.0010000.000170
Iron and its compoundsIron, metal7439-89-60.0060430.0125000.002126
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0151320.0313000.005323
Nickel and its compoundsNickel, metal7440-02-00.0015470.0032000.000544
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0030460.0063000.001071
Silver and its compoundsSilver, metal7440-22-41.6921723.5002000.595248
Tin and its compoundsTin, metal7440-31-546.59558896.38140016.390738
Zinc and its compoundsZinc, metal7440-66-60.0009190.0019000.000323
Subtotal48.345000100.000000017.006122
Total284.279983100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC13892EJVL
Product content declaration of MC13892EJVL
上次修订 Last Revision (GMT):
Wednesday, 29 June 2022, 09:25:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC13892EJVLLast Revision (GMT):
Wednesday, 29 June 2022, 09:25:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Die EncapsulantTest Report
17 May 2021
Test Report
17 May 2021
Test Report
17 May 2021
Test Report
17 May 2021
Epoxy AdhesiveTest Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Semiconductor DieTest Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Solder Ball - Lead FreeTest Report
19 Oct 2021
Test Report
19 Oct 2021
Test Report
19 Oct 2021
Test Report
19 Oct 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.