MPC8360ZUAGDGA

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8360ZUAGDGALast Revision (GMT):
Friday, 11 June 2021, 02:21:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8360ZUAGDGASOT1707-1LBGA74010771.847300 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 095 755572023-11-247Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-516.65763499.9900000.154640
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0016660.0100000.000016
Subtotal16.659300100.00000000.154656
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins14.2700005.0000000.132475
Inorganic Silicon compoundsSilica, vitreous60676-86-0191.21800067.0000001.775164
Inorganic Silicon compoundsSilicon dioxide7631-86-971.35000025.0000000.662375
Inorganic compoundsCarbon Black1333-86-41.4270000.5000000.013248
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins7.1350002.5000000.066238
Subtotal285.400000100.00000002.649499
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-53.48000012.0000000.032306
Epoxy ResinsProprietary Material-Other Epoxy resins2.0300007.0000000.018845
Silver and its compoundsSilver, metal7440-22-423.49000081.0000000.218068
Subtotal29.000000100.00000000.269220
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped49.00000098.0000000.454890
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.0000002.0000000.009284
Subtotal50.000000100.00000000.464173
Solder Ball - Low LeadSolder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-1353.69568036.0000003.283519
Silver and its compoundsSilver, metal7440-22-419.6497602.0000000.182418
Tin and its compoundsTin, metal7440-31-5609.14256062.0000005.654950
Subtotal982.488000100.00000009.120887
Substrate, Pre-plated NiAuCopper PlatingCopper and its compoundsCopper, metal7440-50-82155.30981499.00000020.008730
Nickel and its compoundsNickel, metal7440-02-021.7708061.0000000.202108
Subtotal2177.080620100.000000020.210838
EpoxyInorganic Silicon compoundsSilica, vitreous60676-86-01120.28184437.06000010.400090
PolymersPlastic: EP - Epoxide, Epoxy1902.60494662.94000017.662754
Subtotal3022.886790100.000000028.062845
Gold PlatingGold and its compoundsGold, metal7440-57-567.72621299.9800000.628733
Nickel and its compoundsNickel, metal7440-02-00.0135480.0200000.000126
Subtotal67.739760100.00000000.628859
Nickel PlatingInorganic compoundsSodium7440-23-53.7068701.0000000.034413
Nickel and its compoundsNickel, metal7440-02-0366.98015099.0000003.406845
Subtotal370.687020100.00000003.441258
Solder MaskAromatic hydrocarbon compoundsPigment Green 461725-50-62.1074590.5000000.019564
Barium and its compoundsBarium sulfate7727-43-773.33958017.4000000.680845
Inorganic Silicon compoundsSilicon dioxide7631-86-912.6447553.0000000.117387
PolymersPlastic: E/P - Ethylene/Propylene100.73655023.9000000.935184
PolymersPlastic: PAK232.66349655.2000002.159922
Subtotal421.491840100.00000003.912902
Substrate CoreInorganic Silicon compoundsSilicon dioxide7631-86-919.7556420.5900000.183401
PolymersPlastic: PI - Polyimide3328.65832899.41000030.901462
Subtotal3348.413970100.000000031.084863
Total10771.847300100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8360ZUAGDGA
Product content declaration of MPC8360ZUAGDGA
上次修订 Last Revision (GMT):
Friday, 11 June 2021, 02:21:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
镀铜
Copper Plating
OOOOOO

环氧胶
Epoxy
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8360ZUAGDGALast Revision (GMT):
Friday, 11 June 2021, 02:21:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - Low LeadNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuAUS 21Test Report
2 Jul 2021
Test Report
2 Jul 2021
Test Report
26 Sep 2019
Test Report
26 Sep 2019
NI PLATINGTest Report
20 Jan 2020
Test Report
20 Jan 2020
Test Report
20 Jan 2020
Test Report
20 Jan 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.