MPC8535BVTAKGA

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NXP Semiconductors
Product content declaration of MPC8535BVTAKGALast Revision (GMT):
Thursday, 08 September 2022, 02:37:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8535BVTAKGASOT1622-3BGA7833713.942000 mg YesNoYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 104 565572019-10-04Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-751.14280065.4000001.377049
Copper and its compoundsCopper, metal7440-50-810.79160013.8000000.290570
Nickel and its compoundsNickel, metal7440-02-015.24900019.5000000.410588
Tin and its compoundsTin, metal7440-31-51.0166001.3000000.027373
Subtotal78.200000100.00000002.105580
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped308.55330089.1000008.307973
Lead and its compoundsLead, metallic lead and lead alloys7439-92-132.6134959.4177000.878137
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.1167000.9000000.083919
Nickel and its compoundsNickel, metal7440-02-00.2856970.0825000.007693
Tin and its compoundsTin, metal7440-31-51.7162630.4956000.046211
Titanium and its compoundsTitanium, metal7440-32-60.0145450.0042000.000392
Subtotal346.300000100.00000009.324324
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-422.9901703.5000000.619023
Tin and its compoundsTin, metal7440-31-5633.87183096.50000017.067359
Subtotal656.862000100.000000017.686383
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-86.25320096.5000000.168371
Silver and its compoundsSilver, metal7440-22-40.1944003.0000000.005234
Tin and its compoundsTin, metal7440-31-50.0324000.5000000.000872
Subtotal6.480000100.00000000.174478
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8316.60623399.8700008.524803
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4121240.1300000.011097
Subtotal317.018357100.00000008.535899
Copper PlatingCopper and its compoundsCopper, metal7440-50-8879.43432399.75000023.679269
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.2040960.2500000.059347
Subtotal881.638419100.000000023.738616
InsulationEpoxy ResinsBisphenol A diglycidyl ether1675-54-323.58711210.4500000.635096
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-523.58711210.4500000.635096
Inorganic Silicon compoundsSilicon dioxide7631-86-994.46130641.8500002.543424
PolymersPlastic: EP - Epoxide, Epoxy84.07846337.2500002.263860
Subtotal225.713994100.00000006.077478
Solder Ball 1Copper and its compoundsCopper, metal7440-50-80.1555870.5000000.004189
Silver and its compoundsSilver, metal7440-22-40.9335203.0000000.025136
Tin and its compoundsTin, metal7440-31-530.02821396.5000000.808527
Subtotal31.117319100.00000000.837851
Solder Ball 2Lead and its compoundsLead, metallic lead and lead alloys7439-92-12.16235237.0000000.058223
Tin and its compoundsTin, metal7440-31-53.68184263.0000000.099136
Subtotal5.844194100.00000000.157358
Solder MaskBarium and its compoundsBarium sulfate7727-43-713.14046731.1000000.353814
Copper and its compoundsCopper phthalocyanine147-14-80.0845050.2000000.002275
Inorganic Silicon compoundsSilicon dioxide7631-86-90.2112610.5000000.005688
Magnesium and its compoundsTalc14807-96-61.5210833.6000000.040956
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.4647751.1000000.012514
Organic compoundsProprietary Material-Other organic compounds.0.0422520.1000000.001138
PolymersPlastic: EP - Epoxide, Epoxy26.78796163.4000000.721281
Subtotal42.252305100.00000001.137667
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3321.24527132.0000008.649712
Inorganic Silicon compoundsSilica, vitreous60676-86-060.2334886.0000001.621821
PolymersPlastic: PI - Polyimide622.41271362.00000016.758816
Subtotal1003.891473100.000000027.030349
Via PluggingCalcium and its compoundsCalcium-carbonate471-34-128.63926550.4000000.771128
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-54.8868598.6000000.131581
Epoxy ResinsProprietary Material-Other Epoxy resins8.52359115.0000000.229502
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5682391.0000000.015300
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-614.20598525.0000000.382504
Subtotal56.823939100.00000001.530017
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-36.79800011.0000000.183040
Bismuth and its compoundsBismuth nitrate10361-44-10.0618000.1000000.001664
Bismuth and its compoundsBismuth trioxide1304-76-30.4944000.8000000.013312
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-68.65200014.0000000.232960
Epoxy ResinsOther Epoxy resins2.4720004.0000000.066560
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-56.18000010.0000000.166400
Inorganic Silicon compoundsSilica, vitreous60676-86-037.08000060.0000000.998400
Inorganic compoundsCarbon Black1333-86-40.0618000.1000000.001664
Subtotal61.800000100.00000001.664000
Total3713.942000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8535BVTAKGA
Product content declaration of MPC8535BVTAKGA
上次修订 Last Revision (GMT):
Thursday, 08 September 2022, 02:37:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

绝缘
Insulation
OOOOOO

焊锡球
Solder Ball 1
OOOOOO

焊锡球
Solder Ball 2
XOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

有机基质通道堵塞
Via Plugging
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8535BVTAKGALast Revision (GMT):
Thursday, 08 September 2022, 02:37:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
27 Dec 2021
Test Report
27 Dec 2021
Test Report
27 Dec 2021
Test Report
27 Dec 2021
INNER ELECTRODETest Report
21 Oct 2021
Test Report
21 Oct 2021
Test Report
21 Oct 2021
Test Report
21 Oct 2021
NI PLATINGTest Report
20 May 2022
Test Report
20 May 2022
Test Report
25 Jun 2021
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Oct 2021
Test Report
21 Oct 2021
Test Report
21 Oct 2021
Test Report
21 Oct 2021
SN PLATINGTest Report
20 May 2022
Test Report
20 May 2022
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Semiconductor DieTest Report
23 Jul 2021
Test Report
23 Jul 2021
Test Report
27 Apr 2022
Not Available
Solder Ball - Lead FreeTest Report
19 Oct 2021
Test Report
19 Oct 2021
Test Report
19 Oct 2021
Test Report
19 Oct 2021
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
SubstrateAUS 703Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
COPPERTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
CU PLATINGTest Report
29 Nov 2021
Test Report
29 Nov 2021
Test Report
29 Nov 2021
Test Report
29 Nov 2021
E679FGBTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
GX-13Test Report
20 Jul 2022
Test Report
20 Jul 2022
Test Report
20 Jul 2022
Test Report
20 Jul 2022
PHP-900 IR-6Test Report
17 Feb 2022
Test Report
17 Feb 2022
Test Report
18 Jun 2021
Test Report
17 Feb 2022
SAC305 PASTETest Report
14 Oct 2021
Test Report
14 Oct 2021
Not AvailableTest Report
14 Oct 2021
SNPB SOLDERTest Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
UnderfillTest Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.