MPC8535EBVTANGA

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8535EBVTANGALast Revision (GMT):
Thursday, 08 September 2022, 02:58:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8535EBVTANGASOT1622-3BGA7831151.206000 mg YesNoYesTin/Silver (Sn/Ag)Not Applicablee2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 196 475572019-10-03Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-752.16565665.4000004.531392
Copper and its compoundsCopper, metal7440-50-811.00743213.8000000.956165
Nickel and its compoundsNickel, metal7440-02-015.55398019.5000001.351103
Tin and its compoundsTin, metal7440-31-51.0369321.3000000.090074
Subtotal79.764000100.00000006.928734
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped308.55330089.10000026.802614
Lead and its compoundsLead, metallic lead and lead alloys7439-92-132.6134959.4177002.832985
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.1167000.9000000.270734
Nickel and its compoundsNickel, metal7440-02-00.2856970.0825000.024817
Tin and its compoundsTin, metal7440-31-51.7162630.4956000.149084
Titanium and its compoundsTitanium, metal7440-32-60.0145450.0042000.001263
Subtotal346.300000100.000000030.081497
Solder Ball - Lead FreeSolder Ball - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.6246760.0951000.054263
Arsenic and its compoundsArsenic, metal7440-38-20.0571470.0087000.004964
Bismuth and its compoundsBismuth, metal7440-69-90.2627450.0400000.022823
Iron and its compoundsIron, metal7439-89-60.2299020.0350000.019970
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0151080.0023000.001312
Silver and its compoundsSilver, metal7440-22-423.0125033.5034001.998991
Tin and its compoundsTin, metal7440-31-5632.65992096.31550054.956274
Subtotal656.862000100.000000057.058597
Solder FluxSolder FluxAliphatic AminesOther aliphatic amines0.0136080.2100000.001182
Aluminum and its compoundsAluminum, metal7429-90-50.0000650.0010000.000006
Antimony and its compoundsAntimony, metal7440-36-00.0064800.1000000.000563
Arsenic and its compoundsArsenic, metal7440-38-20.0006420.0099000.000056
Bismuth and its compoundsBismuth, metal7440-69-90.0019440.0300000.000169
Cadmium and its compoundsCadmium, metal7440-43-90.0001300.0020000.000011
Copper and its compoundsCopper, metal7440-50-80.0316870.4890000.002753
Gold and its compoundsGold, metal7440-57-50.0003240.0050000.000028
Iron and its compoundsIron, metal7439-89-60.0012960.0200000.000113
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0032400.0500000.000281
Nickel and its compoundsNickel, metal7440-02-00.0006480.0100000.000056
Silver and its compoundsSilver, metal7440-22-40.1739882.6850000.015114
Tin and its compoundsTin, metal7440-31-56.24458296.3670000.542438
Zinc and its compoundsZinc, metal7440-66-60.0013670.0211000.000119
Subtotal6.480000100.00000000.562888
UnderfillUnderfillEpoxy ResinsOther Non-halogenated Epoxy resins6.18000010.0000000.536828
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-510.50600017.0000000.912608
Inorganic Silicon compoundsProprietary Material-Other silica compounds4.9440008.0000000.429463
Inorganic Silicon compoundsSilicon dioxide7631-86-940.17000065.0000003.489384
Subtotal61.800000100.00000005.368283
Total1151.206000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8535EBVTANGA
Product content declaration of MPC8535EBVTANGA
上次修订 Last Revision (GMT):
Thursday, 08 September 2022, 02:58:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8535EBVTANGALast Revision (GMT):
Thursday, 08 September 2022, 02:58:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
27 Dec 2021
Test Report
27 Dec 2021
Test Report
27 Dec 2021
Test Report
27 Dec 2021
INNER ELECTRODETest Report
21 Oct 2021
Test Report
21 Oct 2021
Test Report
21 Oct 2021
Test Report
21 Oct 2021
NI PLATINGTest Report
20 May 2022
Test Report
20 May 2022
Test Report
25 Jun 2021
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Oct 2021
Test Report
21 Oct 2021
Test Report
21 Oct 2021
Test Report
21 Oct 2021
SN PLATINGTest Report
20 May 2022
Test Report
20 May 2022
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Semiconductor DieTest Report
23 Jul 2021
Test Report
23 Jul 2021
Test Report
27 Apr 2022
Not Available
Solder Ball - Lead FreeTest Report
3 Jan 2019
Test Report
3 Jan 2019
Test Report
3 Jan 2019
Test Report
3 Jan 2019
Solder FluxTest Report
29 Jan 2019
Test Report
29 Jan 2019
Test Report
29 Jan 2019
Test Report
29 Jan 2019
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.