MPC8572LVTAVNE

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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NXP Semiconductors
Product content declaration of MPC8572LVTAVNELast Revision (GMT):
Thursday, 07 March 2024, 06:32:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8572LVTAVNESOT1619-1BGA10235598.958000 mg YesNoYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 231 085572023-11-244Not ApplicableNot ApplicableNot Applicable3 / 168 hours24530 sec.3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-746.69560065.4000000.834005
Copper and its compoundsCopper, metal7440-50-89.85320013.8000000.175983
Nickel and its compoundsNickel, metal7440-02-013.92300019.5000000.248671
Tin and its compoundsTin, metal7440-31-50.9282001.3000000.016578
Subtotal71.400000100.00000001.275237
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-721.60000030.0000000.385786
Inorganic Silicon compoundsSilylated silica68909-20-62.8800004.0000000.051438
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0144000.0200000.000257
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-22.8800004.0000000.051438
Organic Silicon compoundsOther siloxanes and silicones2.1600003.0000000.038579
Organic Silicon compoundsSilicic acid sodium salt hydrolysis products with chlorotrimethylsilane and dichloroethenylmethylsilane68584-83-83.2400004.5000000.057868
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-238.88000054.0000000.694415
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.2160000.3000000.003858
Organic compoundsOther organic compounds.0.1080000.1500000.001929
Platinum and its compoundsOther platinum compounds0.0216000.0300000.000386
Subtotal72.000000100.00000001.285953
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped309.44430089.1000005.526820
Lead and its compoundsLead, metallic lead and lead alloys7439-92-132.7076729.4177000.584174
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.1257000.9000000.055827
Nickel and its compoundsNickel, metal7440-02-00.2865230.0825000.005117
Tin and its compoundsTin, metal7440-31-51.7212190.4956000.030742
Titanium and its compoundsTitanium, metal7440-32-60.0145870.0042000.000260
Subtotal347.300000100.00000006.202940
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-430.0369303.5000000.536474
Tin and its compoundsTin, metal7440-31-5828.16107096.50000014.791343
Subtotal858.198000100.000000015.327816
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-851.53100096.5000000.920368
Silver and its compoundsSilver, metal7440-22-41.6020003.0000000.028612
Tin and its compoundsTin, metal7440-31-50.2670000.5000000.004769
Subtotal53.400000100.00000000.953749
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8501.17691699.8700008.951253
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6523780.1300000.011652
Subtotal501.829294100.00000008.962905
Copper PlatingCopper and its compoundsCopper, metal7440-50-81392.11465699.75000024.863817
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.4890090.2500000.062315
Subtotal1395.603665100.000000024.926132
InsulationEpoxy ResinsBisphenol A diglycidyl ether1675-54-337.33759810.4500000.666867
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-537.33759810.4500000.666867
Inorganic Silicon compoundsSilicon dioxide7631-86-9149.52903941.8500002.670658
PolymersPlastic: EP - Epoxide, Epoxy133.09335037.2500002.377109
Subtotal357.297585100.00000006.381501
Solder Ball 1Copper and its compoundsCopper, metal7440-50-80.2371200.5000000.004235
Silver and its compoundsSilver, metal7440-22-41.4227203.0000000.025410
Tin and its compoundsTin, metal7440-31-545.76414796.5000000.817369
Subtotal47.423987100.00000000.847015
Solder Ball 2Lead and its compoundsLead, metallic lead and lead alloys7439-92-13.93415837.0000000.070266
Tin and its compoundsTin, metal7440-31-56.69870163.0000000.119642
Subtotal10.632859100.00000000.189908
Solder MaskBarium and its compoundsBarium sulfate7727-43-720.73798631.1000000.370390
Copper and its compoundsCopper phthalocyanine147-14-80.1333630.2000000.002382
Inorganic Silicon compoundsSilicon dioxide7631-86-90.3334080.5000000.005955
Magnesium and its compoundsTalc14807-96-62.4005393.6000000.042875
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.7334981.1000000.013101
Organic compoundsProprietary Material-Other organic compounds.0.0666820.1000000.001191
PolymersPlastic: EP - Epoxide, Epoxy42.27615263.4000000.755072
Subtotal66.681628100.00000001.190965
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3508.52031932.0000009.082410
Inorganic Silicon compoundsSilica, vitreous60676-86-095.3475606.0000001.702952
PolymersPlastic: PI - Polyimide985.25811962.00000017.597169
Subtotal1589.125998100.000000028.382531
Via PluggingCalcium and its compoundsCalcium-carbonate471-34-141.73371250.4000000.745384
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-57.1212298.6000000.127189
Epoxy ResinsProprietary Material-Other Epoxy resins12.42074815.0000000.221840
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8280501.0000000.014789
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-620.70124625.0000000.369734
Subtotal82.804985100.00000001.478936
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-550.84100070.0000000.908044
Miscellaneous substancesProprietary Material-Other miscellaneous substances.2.1789003.0000000.038916
Organic Silicon compoundsDimethyl Cyclosiloxanes70900-21-90.7263001.0000000.012972
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.7263001.0000000.012972
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-27.26300010.0000000.129721
Zinc and its compoundsZinc oxide1314-13-210.89450015.0000000.194581
Subtotal72.630000100.00000001.297206
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-37.98930011.0000000.142693
Bismuth and its compoundsBismuth nitrate10361-44-10.0726300.1000000.001297
Bismuth and its compoundsBismuth trioxide1304-76-30.5810400.8000000.010378
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-610.16820014.0000000.181609
Epoxy ResinsOther Epoxy resins2.9052004.0000000.051888
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-57.26300010.0000000.129721
Inorganic Silicon compoundsSilica, vitreous60676-86-043.57800060.0000000.778323
Inorganic compoundsCarbon Black1333-86-40.0726300.1000000.001297
Subtotal72.630000100.00000001.297206
Total5598.958000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8572LVTAVNE
Product content declaration of MPC8572LVTAVNE
上次修订 Last Revision (GMT):
Thursday, 07 March 2024, 06:32:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

绝缘
Insulation
OOOOOO

焊锡球
Solder Ball 1
OOOOOO

焊锡球
Solder Ball 2
XOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

有机基质通道堵塞
Via Plugging
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8572LVTAVNELast Revision (GMT):
Thursday, 07 March 2024, 06:32:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Epoxy AdhesiveTest Report
26 Feb 2024
Test Report
26 Feb 2024
Test Report
26 Feb 2024
Not Available
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Solder FluxTest Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
Test Report
11 Aug 2021
SubstrateABF-GX13Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
AUS 703Test Report
11 Oct 2023
Test Report
11 Oct 2023
Test Report
11 Oct 2023
Test Report
11 Oct 2023
COPPER FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
E679FG SERIESTest Report
7 Dec 2023
Not AvailableNot AvailableNot Available
E679FGBNot AvailableNot AvailableNot AvailableNot Available
E679FGB SERIESNot AvailableNot AvailableTest Report
7 Dec 2023
Test Report
7 Dec 2023
PHP-900 IR6Test Report
20 Apr 2023
Test Report
18 Jun 2023
Test Report
20 Apr 2023
Not Available
Thermally Conductive GelTest Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.