MPC859TCZP100A

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC859TCZP100ALast Revision (GMT):
Tuesday, 27 February 2024, 06:28:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC859TCZP100ASOT1666-1BGA3572285.298415 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 167 475572023-11-2410Not ApplicableNot ApplicableNot Applicable3 / 168 hours22030 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Solder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-121.79501736.0000000.953705
Silver and its compoundsSilver, metal7440-22-41.2108342.0000000.052984
Tin and its compoundsTin, metal7440-31-537.53586362.0000001.642493
Subtotal60.541715100.00000002.649182
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-86.00425197.0000000.262734
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1856983.0000000.008126
Subtotal6.189950100.00000000.270860
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins46.9500006.0000002.054436
Inorganic Silicon compoundsSilica, vitreous60676-86-0579.05000074.00000025.338048
Inorganic Silicon compoundsSilicon dioxide7631-86-9117.37500015.0000005.136091
Inorganic compoundsCarbon Black1333-86-43.9125000.5000000.171203
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-415.6500002.0000000.684812
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins19.5625002.5000000.856015
Subtotal782.500000100.000000034.240605
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.79200012.0000000.034656
Epoxy ResinsProprietary Material-Other Epoxy resins0.4620007.0000000.020216
Silver and its compoundsSilver, metal7440-22-45.34600081.0000000.233930
Subtotal6.600000100.00000000.288803
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped35.78445598.0000001.565855
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.7302952.0000000.031956
Subtotal36.514750100.00000001.597811
Solder Ball - Low LeadSolder Ball - Low LeadAluminum and its compoundsAluminum, metal7429-90-50.0072940.0010000.000319
Antimony and its compoundsAntimony, metal7440-36-00.0072940.0010000.000319
Arsenic and its compoundsArsenic, metal7440-38-20.0145890.0020000.000638
Bismuth and its compoundsBismuth, metal7440-69-90.0080240.0011000.000351
Copper and its compoundsCopper, metal7440-50-80.0072940.0010000.000319
Iron and its compoundsIron, metal7439-89-60.0124010.0017000.000543
Lead and its compoundsLead, metallic lead and lead alloys7439-92-1262.61366236.00150011.491438
Nickel and its compoundsNickel, metal7440-02-00.0269900.0037000.001181
Silver and its compoundsSilver, metal7440-22-414.5292251.9918000.635769
Tin and its compoundsTin, metal7440-31-5452.21793261.99420019.788135
Zinc and its compoundsZinc, metal7440-66-60.0072940.0010000.000319
Subtotal729.452000100.000000031.919332
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-8258.73912499.99000011.321897
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0258770.0100000.001132
Subtotal258.765000100.000000011.323029
Copper PlatingCopper and its compoundsCopper, metal7440-50-882.98724999.9800003.631353
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0166010.0200000.000726
Subtotal83.003850100.00000003.632079
Gold PlatingGold and its compoundsGold, metal7440-57-52.32201899.9900000.101607
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002320.0100000.000010
Subtotal2.322250100.00000000.101617
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0044390.0300000.000194
Nickel and its compoundsNickel, metal7440-02-014.79161199.9700000.647251
Subtotal14.796050100.00000000.647445
Solder MaskBarium and its compoundsBarium sulfate7727-43-734.09766329.1000001.492044
Inorganic Silicon compoundsSilicon dioxide7631-86-90.7030450.6000000.030764
Magnesium and its compoundsTalc14807-96-63.5152233.0000000.153819
Organic compoundsOther organic compounds.4.2182683.6000000.184583
PolymersPlastic: EP - Epoxide, Epoxy22.96612419.6000001.004951
PolymersPlastic: PAK51.67377844.1000002.261139
Subtotal117.174100100.00000005.127300
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-389.22084547.6000003.904122
Inorganic Silicon compoundsSilica, vitreous60676-86-08.9970604.8000000.393693
PolymersPlastic: PI - Polyimide89.22084547.6000003.904122
Subtotal187.438750100.00000008.201938
Total2285.298415100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC859TCZP100A
Product content declaration of MPC859TCZP100A
上次修订 Last Revision (GMT):
Tuesday, 27 February 2024, 06:28:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)

焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC859TCZP100ALast Revision (GMT):
Tuesday, 27 February 2024, 06:28:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - Low LeadNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuAUS 703Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
COPPER FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
PHP-900 IR-6Test Report
18 Jun 2021
Test Report
19 Aug 2021
Test Report
18 Jun 2021
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.