NX3L1G3157GW,125

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of NX3L1G3157GW,125Last Revision (GMT):
Saturday, 03 April 2021, 01:19:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
NX3L1G3157GW,125SOT363SC-885.661058 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 866 341252020-07-0171 / Unlimited26030 sec.1 / Unlimited24020 sec.3Seremban, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuBeryllium and its compoundsBeryllium, metal7440-41-70.0000010.0010000.000008
Gold and its compoundsGold, metal7440-57-50.04305399.9900000.760524
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000040.0090000.000068
Subtotal0.043058100.00000000.760600
Copper Lead-Frame, Pre-Plated AgCopper Lead-Frame, Pre-Plated AgCopper and its compoundsCopper, metal7440-50-82.01131595.32300035.528965
Iron and its compoundsIron, metal7439-89-60.0442682.0980000.781970
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000210.0010000.000373
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0007830.0371000.013828
Silver and its compoundsSilver, metal7440-22-40.0510602.4199000.901950
Zinc and its compoundsZinc, metal7440-66-60.0025530.1210000.045099
Subtotal2.110000100.000000037.272185
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins0.45300015.0000008.002038
Inorganic Silicon compoundsSilicon dioxide7631-86-92.17440072.00000038.409781
Inorganic compoundsCarbon Black1333-86-40.0151000.5000000.266735
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0604002.0000001.066938
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.30200010.0000005.334692
Phosphorus compoundsTriphenyl phosphine603-35-00.0151000.5000000.266735
Subtotal3.020000100.000000053.346919
Epoxy AdhesiveEpoxy AdhesiveAromatic amines and their salts3-Aminophenyl sulfone599-61-10.0015005.0000000.026497
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01500050.0000000.264968
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0012004.0000000.021198
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.00300010.0000000.052994
Phenols and Phenolic ResinsCumyl hydroperoxide80-15-90.0003001.0000000.005299
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-30.00600020.0000000.105987
PolymersProprietary Material-Other acrylic/epoxy resin mixture0.00300010.0000000.052994
Subtotal0.030000100.00000000.529936
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0000070.0030000.000127
Bismuth and its compoundsBismuth, metal7440-69-90.0000020.0010000.000042
Copper and its compoundsCopper, metal7440-50-80.0000020.0010000.000042
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000120.0050000.000212
Tin and its compoundsTin, metal7440-31-50.23997699.9900004.239066
Subtotal0.240000100.00000004.239490
Semiconductor ComponentSemiconductor ComponentInorganic Silicon compoundsSilicon7440-21-30.21364098.0000003.773853
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0043602.0000000.077017
Subtotal0.218000100.00000003.850870
Total5.661058100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 NX3L1G3157GW,125
Product content declaration of NX3L1G3157GW,125
上次修订 Last Revision (GMT):
Saturday, 03 April 2021, 01:19:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体元件
Semiconductor Component
半导体元件
Semiconductor Component
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of NX3L1G3157GW,125Last Revision (GMT):
Saturday, 03 April 2021, 01:19:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Copper Lead-Frame, Pre-Plated AgNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
27 May 2020
Test Report
27 May 2020
Test Report
27 May 2020
Test Report
27 May 2020
Epoxy AdhesiveTest Report
24 Mar 2020
Test Report
24 Mar 2020
Test Report
24 Mar 2020
Test Report
24 Mar 2020
Post-plating - Lead FreeTest Report
20 Jun 2019
Test Report
20 Jun 2019
Test Report
20 Jun 2019
Test Report
20 Jun 2019
Semiconductor ComponentTest Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.