PCF8537BH/1,518

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of PCF8537BH/1,518Last Revision (GMT):
Monday, 27 June 2022, 11:25:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
PCF8537BH/1,518SOT357-1TQFP64270.646008 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 978 985182021-10-0732 / 1 year26030 sec.2 / 1 year24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000130.0020000.000005
Gold and its compoundsGold, metal7440-57-50.63851498.8400000.235922
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000520.0080000.000019
Palladium and its compoundsPalladium, metal7440-05-30.0074291.1500000.002745
Subtotal0.646008100.00000000.238691
Copper Lead-Frame, Pre-Plated AgCopper AlloyCopper and its compoundsCopper, metal7440-50-877.13398995.01600028.499954
Inorganic Silicon compoundsSilicon7440-21-30.5926140.7300000.218963
Iron and its compoundsIron, metal7439-89-60.1030990.1270000.038094
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0243540.0300000.008998
Magnesium and its compoundsMagnesium, metal7439-95-40.1436890.1770000.053091
Manganese and its compoundsManganese, metal7439-96-50.0487080.0600000.017997
Nickel and its compoundsNickel, metal7440-02-02.6221143.2300000.968835
Zinc and its compoundsZinc, metal7440-66-60.5114340.6300000.188968
Subtotal81.180000100.000000029.994900
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000820.0100000.000030
Silver and its compoundsSilver, metal7440-22-40.81991899.9900000.302949
Subtotal0.820000100.00000000.302979
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins20.64000012.0000007.626198
Inorganic Silicon compoundsQuartz14808-60-7151.36000088.00000055.925451
Subtotal172.000000100.000000063.551649
Epoxy AdhesiveEpoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.0595693.3094000.022010
AcrylatesProprietary Material-Other acrylates0.1588548.8252000.058694
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.0595693.3094000.022010
Palladium and its compoundsPalladium, metal7440-05-30.0029790.1655000.001101
PolymersProprietary Material-Other polymers0.0297851.6547000.011005
Silver and its compoundsSilver, metal7440-22-41.48924482.7358000.550255
Subtotal1.800000100.00000000.665075
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0002370.0030000.000088
Bismuth and its compoundsBismuth, metal7440-69-90.0000790.0010000.000029
Copper and its compoundsCopper, metal7440-50-80.0000790.0010000.000029
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0003950.0050000.000146
Tin and its compoundsTin, metal7440-31-57.89921099.9900002.918650
Subtotal7.900000100.00000002.918942
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000200.0100000.000007
Silver and its compoundsSilver, metal7440-22-40.19998099.9900000.073890
Subtotal0.200000100.00000000.073897
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-35.97800098.0000002.208789
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1220002.0000000.045077
Subtotal6.100000100.00000002.253867
Total270.646008100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 PCF8537BH/1,518
Product content declaration of PCF8537BH/1,518
上次修订 Last Revision (GMT):
Monday, 27 June 2022, 11:25:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of PCF8537BH/1,518Last Revision (GMT):
Monday, 27 June 2022, 11:25:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Copper Lead-Frame, Pre-Plated AgAG PLATINGTest Report
22 Oct 2021
Test Report
22 Oct 2021
Test Report
22 Oct 2021
Test Report
22 Oct 2021
C7025Test Report
2 Jul 2020
Test Report
2 Jul 2020
Test Report
2 Jul 2020
Test Report
2 Jul 2020
Die EncapsulantTest Report
3 Dec 2021
Test Report
3 Dec 2021
Test Report
3 Dec 2021
Test Report
3 Dec 2021
Epoxy AdhesiveTest Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Post-plating - Lead FreeTest Report
13 Aug 2021
Test Report
13 Aug 2021
Test Report
13 Aug 2021
Test Report
13 Aug 2021
Pre-plating - Precious metal - AgNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.