PN5190B1EV/C121Y

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of PN5190B1EV/C121YLast Revision (GMT):
Sunday, 17 September 2023, 06:23:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
PN5190B1EV/C121YSOT1307VFBGA6433.163110 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 179 145182024-02-2793 / 168 hours26030 sec.NA / Not Available24020 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum Hydroxide21645-51-20.2048061.4000000.617572
Epoxy ResinsOther Epoxy resins0.8338535.7000002.514399
Inorganic Silicon compoundsQuartz14808-60-70.0731450.5000000.220561
Inorganic Silicon compoundsSilica, vitreous60676-86-08.66036859.20000026.114463
Inorganic Silicon compoundsSilicon dioxide7631-86-94.38870030.00000013.233680
Inorganic compoundsCarbon Black1333-86-40.0585160.4000000.176449
Phenols and Phenolic ResinsOther phenolic resins0.4096122.8000001.235143
Subtotal14.629000100.000000044.112268
Semiconductor DieDieInorganic Silicon compoundsSilicon7440-21-33.46649898.00000010.452872
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0707452.0000000.213324
Subtotal3.537242100.000000010.666196
Polyimide CoatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000170.0100000.000051
PolymersPolyimide Resin39355-34-50.17048399.9900000.514074
Subtotal0.170500100.00000000.514126
Redistribution MetalCopper and its compoundsCopper, metal7440-50-80.03109599.1354000.093763
Titanium and its compoundsTitanium, metal7440-32-60.0002710.8646000.000818
Subtotal0.031366100.00000000.094581
Solder BallSilver and its compoundsSilver, metal7440-22-40.0023411.8000000.007060
Tin and its compoundsTin, metal7440-31-50.12773298.2000000.385164
Subtotal0.130074100.00000000.392224
Under Bump MetalCopper and its compoundsCopper, metal7440-50-80.11860292.4498000.357631
Nickel and its compoundsNickel, metal7440-02-00.0095227.4223000.028712
Titanium and its compoundsTitanium, metal7440-32-60.0001640.1279000.000495
Subtotal0.128288100.00000000.386838
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0332700.5000000.100322
Nickel and its compoundsNickel, metal7440-02-00.0033270.0500000.010032
Silver and its compoundsSilver, metal7440-22-40.0798481.2000000.240774
Tin and its compoundsTin, metal7440-31-56.53755598.25000019.713335
Subtotal6.654000100.000000020.064463
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-83.40718099.99000010.274006
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0003410.0100000.001027
Subtotal3.407521100.000000010.275034
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.08024018.9000000.241954
Magnesium and its compoundsTalc14807-96-60.0178314.2000000.053768
Organic compoundsOther organic compounds.0.0118872.8000000.035845
Phosphorus compoundsDiphenyl(2,4,6-trimethylbenzoyl)phosphine oxide75980-60-80.0046701.1000000.014082
PolymersPlastic: EP - Epoxide, Epoxy0.08024018.9000000.241954
PolymersPlastic: PAK0.22968054.1000000.692578
Subtotal0.424548100.00000001.280181
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-32.23127855.0855006.728191
Inorganic Silicon compoundsSilicon dioxide7631-86-91.08809326.8627003.281034
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1903974.7005000.574123
PolymersPlastic: EP - Epoxide, Epoxy0.54080413.3513001.630740
Subtotal4.050571100.000000012.214088
Total33.163110100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 PN5190B1EV/C121Y
Product content declaration of PN5190B1EV/C121Y
上次修订 Last Revision (GMT):
Sunday, 17 September 2023, 06:23:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO

聚酰亚胺涂料
Polyimide Coating
OOOOOO

电气再分配
Redistribution Metal
OOOOOO

焊锡球
Solder Ball
OOOOOO

焊料凸点下的金属
Under Bump Metal
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of PN5190B1EV/C121YLast Revision (GMT):
Sunday, 17 September 2023, 06:23:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
30 Nov 2023
Test Report
30 Nov 2023
Test Report
30 Nov 2023
Test Report
30 Nov 2023
Semiconductor DieDIETest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
POLYIMIDETest Report
3 Nov 2023
Test Report
3 Nov 2023
Test Report
3 Nov 2023
Test Report
3 Nov 2023
RDL CUTest Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
RDL CU PLATINGTest Report
5 May 2021
Test Report
5 May 2021
Test Report
5 May 2021
Test Report
5 May 2021
RDL TITest Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
UBM CUTest Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
UBM TITest Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Solder Ball - SAC, Lead FreeTest Report
6 Oct 2023
Test Report
6 Oct 2023
Test Report
6 Oct 2023
Test Report
6 Oct 2023
SubstrateAUS410Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
COPPER FOILTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
HL832NSTest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
8 Feb 2023
Test Report
29 Dec 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.