PTN38007EWY

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of PTN38007EWYLast Revision (GMT):
Thursday, 28 April 2022, 12:02:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
PTN38007EWYSOT1948HWFLGA3619.205000 mg YesYesYesNot ApplicableOtherNot Applicablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 839 735182021-05-2853 / 168 hours26030 sec.3 / 168 hours24020 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum Hydroxide21645-51-20.0630001.4000000.328040
Epoxy ResinsOther Epoxy resins0.2565005.7000001.335590
Inorganic Silicon compoundsQuartz14808-60-70.0225000.5000000.117157
Inorganic Silicon compoundsSilica, vitreous60676-86-02.66400059.20000013.871388
Inorganic Silicon compoundsSilicon dioxide7631-86-91.35000030.0000007.029419
Inorganic compoundsCarbon Black1333-86-40.0180000.4000000.093726
Phenols and Phenolic ResinsOther phenolic resins0.1260002.8000000.656079
Subtotal4.500000100.000000023.431398
Semiconductor DieDieInorganic Silicon compoundsSilicon7440-21-33.51624098.00000018.308981
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0717602.0000000.373653
Subtotal3.588000100.000000018.682633
Solder BallCopper and its compoundsCopper, metal7440-50-80.07029960.6026000.366046
Nickel and its compoundsNickel, metal7440-02-00.0066065.6944000.034395
Silver and its compoundsSilver, metal7440-22-40.0006910.5959000.003599
Tin and its compoundsTin, metal7440-31-50.03840433.1071000.199970
Subtotal0.116000100.00000000.604011
Under Bump MetalCopper and its compoundsCopper, metal7440-50-80.00076276.1905000.003967
Titanium and its compoundsTitanium, metal7440-32-60.00023823.8095000.001240
Subtotal0.001000100.00000000.005207
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-80.68642699.9900003.574203
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000690.0100000.000358
Subtotal0.686494100.00000003.574561
Copper PlatingCopper and its compoundsCopper, metal7440-50-84.05387699.99000021.108441
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0004050.0100000.002111
Subtotal4.054282100.000000021.110553
Gold PlatingGold and its compoundsGold, metal7440-57-50.21878199.9900001.139187
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000220.0100000.000114
Subtotal0.218803100.00000001.139301
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0001120.0100000.000584
Nickel and its compoundsNickel, metal7440-02-01.12099399.9900005.836983
Subtotal1.121105100.00000005.837566
Solder MaskAluminum and its compoundsAluminum Hydroxide21645-51-20.0338205.7000000.176101
Barium and its compoundsBarium sulfate7727-43-70.11629419.6000000.605540
Inorganic Silicon compoundsSilicon dioxide7631-86-90.05933410.0000000.308949
Magnesium and its compoundsTalc14807-96-60.0178003.0000000.092685
PolymersPlastic: EP - Epoxide, Epoxy0.07476012.6000000.389276
PolymersPlastic: PAK0.29132849.1000001.516939
Subtotal0.593336100.00000003.089489
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-31.48768855.3500007.746356
Inorganic Silicon compoundsSilicon dioxide7631-86-90.55690920.7200002.899810
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1550855.7700000.807524
PolymersPlastic: EP - Epoxide, Epoxy0.48810118.1600002.541533
Subtotal2.687783100.000000013.995223
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.42593126.0000002.217815
Inorganic Silicon compoundsSilicon dioxide7631-86-90.57009334.8000002.968460
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1425238.7000000.742115
PolymersPlastic: EP - Epoxide, Epoxy0.49965030.5000002.601668
Subtotal1.638198100.00000008.530059
Total19.205000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 PTN38007EWY
Product content declaration of PTN38007EWY
上次修订 Last Revision (GMT):
Thursday, 28 April 2022, 12:02:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO

焊锡球
Solder Ball
OOOOOO

焊料凸点下的金属
Under Bump Metal
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of PTN38007EWYLast Revision (GMT):
Thursday, 28 April 2022, 12:02:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
11 Feb 2022
Test Report
11 Feb 2022
Test Report
11 Feb 2022
Test Report
11 Feb 2022
Semiconductor DieDIETest Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
SOLDER BALLTest Report
19 Jul 2021
Test Report
19 Jul 2021
Test Report
19 Jul 2021
Test Report
19 Jul 2021
UBM- CUTest Report
18 Jan 2022
Test Report
18 Jan 2022
Test Report
18 Jan 2022
Test Report
18 Jan 2021
UBM- TITest Report
18 Jan 2022
Test Report
18 Jan 2022
Test Report
18 Jan 2022
Test Report
18 Jan 2021
SubstrateAU PLATINGTest Report
18 Jan 2021
Test Report
18 Jan 2021
Test Report
18 Jan 2021
Test Report
18 Jan 2021
AUS SR1Test Report
31 May 2021
Test Report
31 May 2021
Test Report
31 May 2021
Test Report
31 May 2021
CU FOILTest Report
1 Mar 2022Test Report
9 Mar 2021
Test Report
1 Mar 2022Test Report
9 Mar 2021
Test Report
9 Mar 2021
Test Report
1 Mar 2022Test Report
9 Mar 2021
CU PLATINGTest Report
9 Apr 2021
Test Report
9 Apr 2021
Test Report
9 Apr 2021
Test Report
9 Apr 2021
HL830NSNot AvailableNot AvailableTest Report
22 Mar 2021
Not Available
NI PLATINGTest Report
9 Apr 2021
Test Report
9 Apr 2021
Test Report
9 Apr 2021
Test Report
9 Apr 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.